| Patents for B81B 7 - Micro-structural systems (8,983) |
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| 08/21/2013 | CN103260123A MEMS device |
| 08/21/2013 | CN103253627A Semiconductor integrated device assembly process |
| 08/21/2013 | CN103253626A Silicon material taper structure and preparation method thereof |
| 08/21/2013 | CN103253625A Micro-electro mechanical systems (mems) structures and methods of forming the same |
| 08/21/2013 | CN101767765B Micro electromechanical element with protective ring and manufacture method thereof |
| 08/21/2013 | CN101665231B Structure of thin film device manufactured by means of double-faced opposite-penetrated corrosion based on (100) silicon chip and method thereof |
| 08/21/2013 | CN101665230B Micro-electro-mechanical systems (mems) package and method for forming the mems package |
| 08/21/2013 | CN101636344B Mems cavity-coating layers and methods |
| 08/21/2013 | CN101616863B Electronic device comprising differential sensor mems devices and drilled substrates |
| 08/21/2013 | CN101355076B Integrated circuit having a semiconductor substrate with a barrier layer |
| 08/20/2013 | CA2747236C Shape-acceleration measurement device and method |
| 08/15/2013 | WO2013119765A1 Devices with fluidic nanofunnels, associated methods, fabrication and analysis systems |
| 08/15/2013 | WO2013081458A3 Mems scanning micromirror |
| 08/15/2013 | WO2013064634A3 Micromechanical element, component having a micromechanical element, and method for producing a component |
| 08/15/2013 | US20130209030 Optical switch having a multirow waveguide array |
| 08/15/2013 | US20130207714 Shunt switch at common port to reduce hot switching |
| 08/14/2013 | DE10229038B4 Verkapptes Mikrostrukturbauelement mit Hochfrequenzdurchführung Capped microstructure device with radio frequency feedthrough |
| 08/14/2013 | DE102013202212A1 Zweistufig gemoldeter Sensor Two-stage gemoldeter sensor |
| 08/14/2013 | DE102012202183A1 Micromechanical structure, has aeration layer formed as lime layer in cavity for releasing gas in cavity and comprising reactant for endothermic reaction, and heating device provided in cavity for providing thermal energy to aeration layer |
| 08/14/2013 | DE102012202035A1 Mikromechanisches Bauelement mit einer Membran Micromechanical component with a membrane |
| 08/14/2013 | DE102012201981A1 Micromechanical component for deflecting light beams in e.g. pico projector, has assembly comprising torsion bars and bending bar, where torsion bars are suspended at drive body over bending bar aligned inclined to longitudinal direction |
| 08/14/2013 | DE102009031545B4 Verfahrenen zur Herstellung eines Mikroelektromechanischen-System- (MEMS-) Bauelements Traversed for producing a micro-electro-mechanical system (MEMS) device |
| 08/14/2013 | CN103245579A Structure for testing Young modulus of top silicon layer of silicon-on-insulator |
| 08/14/2013 | CN103245421A Pyrogenicity type MEMS (micro-electro-mechanical system) thermopile infrared detector structure and manufacturing method thereof |
| 08/14/2013 | CN103241707A Method for packaging wafer-level chip of gallium arsenide image sensor and its structure |
| 08/14/2013 | CN103241704A Three-dimensional integrated sensor and production method thereof |
| 08/13/2013 | US8506906 Microfluidic device |
| 08/08/2013 | WO2013116514A1 Mems multi-axis gyroscope with central suspension and gimbal structure |
| 08/08/2013 | WO2013116356A1 Mems multi-axis accelerometer electrode structure |
| 08/08/2013 | US20130199293 Sensors |
| 08/08/2013 | DE112011103090T5 Berührungsloses Messsystem mit einer auf einem mikroelektromechanischen System basierenden Lichtquelle Non-contact measurement system based on a microelectromechanical system light source |
| 08/08/2013 | DE102013101051A1 Plasmazelle und Verfahren zur Herstellung einer Plasmazelle Plasma cell and method of manufacturing a plasma cell |
| 08/08/2013 | DE102013001674A1 Vertikale druckempfindliche Struktur Vertical pressure sensitive structure |
| 08/08/2013 | DE102012201713A1 Method for positioning e.g. sensors in microelectromechanical system, involves positioning microstructure elements within frame located on or below platform or between parts of frame, where parts of frame are extended over platform |
| 08/08/2013 | DE102012201486A1 Dämpfungsvorrichtung für eine mikromechanische Sensoreinrichtung Damping device for a micromechanical sensor device |
| 08/08/2013 | DE102012201480A1 Mikromechanisches Bauelement und Verfahren zu dessen Herstellung Micromechanical component and method for its production |
| 08/08/2013 | DE102010062149B4 MEMS-Mikrophonhäusung und MEMS-Mikrophonmodul MEMS and MEMS microphone module Mikrophonhäusung |
| 08/07/2013 | EP2623321A1 Inkjet printhead for printing with low density keep-wet dots |
| 08/07/2013 | CN103234673A Pressure sensor micro-nano structure with high stability under high-temperature environment |
| 08/07/2013 | CN103234567A MEMS (micro-electromechanical systems) capacitive ultrasonic sensor on basis of anodic bonding technology |
| 08/07/2013 | CN103232021A Die attach stress isolation |
| 08/07/2013 | CN102411086B Five-port capacitance type microwave power sensor based on micro mechanical clamped beam |
| 08/07/2013 | CN102385001B Three-channel micro-mechanical cantilever beam indirect-type microwave power sensor and preparation method |
| 08/07/2013 | CN102360039B Five-port micromachine cantilever-based capacitance type microwave power sensor and manufacturing method thereof |
| 08/01/2013 | WO2013112310A2 Mems vibration isolation system and method |
| 08/01/2013 | DE102013201034A1 MEMS-Ventil-Betriebsprofil MEMS valve operating Profile |
| 08/01/2013 | DE102013200106A1 Halbleitermessvorrichtung zur Minimierung von thermischem Rauschen Semiconductor measuring device to minimize thermal noise |
| 07/31/2013 | EP2620407A2 Conductive pillars for flip-chip packaging |
| 07/31/2013 | EP2619594A1 Inertial sensor mode tuning circuit |
| 07/31/2013 | EP2619130A2 Through silicon via with reduced shunt capacitance |
| 07/31/2013 | CN103224217A Systems and methods for conductive pillars |
| 07/31/2013 | CN103224216A A microelectronic mechanical system (MEMS) structure equipped with substrate through holes and a forming method therefore |
| 07/31/2013 | CN102072795B Piezoresistive high-frequency high-temperature dynamic pressure sensor |
| 07/30/2013 | CA2602714C Mems fluid sensor |
| 07/30/2013 | CA2499208C Controlling electromechanical behavior of structures within a microelectromechanical systems device |
| 07/25/2013 | WO2013108252A1 Multi-purpose optical cap and apparatus and methods useful in conjunction therewith |
| 07/25/2013 | WO2013032728A3 Glass as a substrate material and a final package for mems and ic devices |
| 07/25/2013 | DE102013100673A1 Sensorbauelement und Verfahren Sensor device and method |
| 07/25/2013 | DE102012200929A1 Mikromechanische Struktur und Verfahren zur Herstellung einer mikromechanischen Struktur Micromechanical structure and method for making a micromechanical structure |
| 07/25/2013 | DE102012200736A1 Spiegelanordnung, insbesondere zum Einsatz in einer mikrolithographischen Projektionsbelichtungsanlage Mirror assembly, particularly for use in a microlithography projection exposure apparatus |
| 07/24/2013 | EP2617677A2 Structure for isolating a microstructure die from packaging stress |
| 07/24/2013 | EP2616822A1 Micromachined 3-axis accelerometer with a single proof-mass |
| 07/24/2013 | EP2616772A2 Micromachined monolithic 3-axis gyroscope with single drive |
| 07/24/2013 | EP2616389A2 Multi-die mems package |
| 07/24/2013 | EP2616388A2 Sealed packaging for microelectromechanical systems |
| 07/24/2013 | EP2616387A2 Packaging to reduce stress on microelectromechanical systems |
| 07/24/2013 | CN203086374U Nanogenerator packaging piece |
| 07/24/2013 | CN103221333A Multi-die MEMS package |
| 07/24/2013 | CN103221332A Packaging to reduce stress on microelectromechanical systems |
| 07/24/2013 | CN103221331A Sealed packaging for microelectromechanical systems |
| 07/24/2013 | CN103221330A Sensor comprising a preferably multilayered ceramic substrate and method for producing it |
| 07/24/2013 | CN103213938A Surface-enhanced Raman active substrate with gold nano cap array and preparation method thereof |
| 07/24/2013 | CN103213937A Semiconductor package and method and system for fabricating the same |
| 07/24/2013 | CN103213936A Wafer-level MEMS (Micro Electronics Mechanical Systems) inert device TSV (Through Silicon Via) stack packaging structure |
| 07/24/2013 | CN103213934A Micromechanical structure and method for manufacturing a micromechanical structure |
| 07/24/2013 | CN102139854B MEMS (micro electro mechanical system) structure and manufacturing method thereof |
| 07/23/2013 | CA2482165C Sunken electrode configuration for mems micromirror |
| 07/18/2013 | WO2013104828A1 A vibration tolerant accelaration sensor structure |
| 07/18/2013 | WO2013104827A1 Accelerator sensor structure and use thereof |
| 07/18/2013 | DE102012200655A1 Method for manufacturing micromechanical arrangement, particularly micromechanical sensors, involves providing substrate with casualty layer above it, where micromechanical functional structure is formed on casualty layer |
| 07/18/2013 | DE102012200648A1 Sensor device for use in e.g. air-bag release system, has set of sections provided with terminals for contacting sensor device, where sections are arranged in region of surface of containment body, and sections extend in different planes |
| 07/17/2013 | CN103210278A Inertial sensor mode tuning circuit |
| 07/17/2013 | CN103209922A Through silicon via with reduced shunt capacitance |
| 07/17/2013 | CN103207021A High-performance micro-electromechanical system (MEMS) thermopile infrared detector structure and manufacturing method thereof |
| 07/17/2013 | CN103204461A Semiconductor structure and forming method thereof |
| 07/17/2013 | CN103204456A Support structure for TSV in MEMS structure |
| 07/17/2013 | CN102164748B Efficient inkjet nozzle assembly |
| 07/17/2013 | CN102076600B Electromechanical actuators |
| 07/16/2013 | US8486247 Use of microfluidic systems in the electrochemical detection of target analytes |
| 07/16/2013 | CA2455651C Bubble-actuated valve with latching |
| 07/11/2013 | WO2013102763A1 Strain decoupled sensor |
| 07/11/2013 | DE102012200124A1 Micromechanical structure for rotational rate sensor, has substrate and movable mass that is movably mounted opposite to substrate by spring element, where substrate is provided with main extension plane |
| 07/10/2013 | CN103193193A MEMS device and method of forming same |
| 07/10/2013 | CN103193191A Cantilever beam structure with high response sensitivity and method for making same |
| 07/10/2013 | CN102354052B Digital micro-mirror device and forming method thereof |
| 07/10/2013 | CN102350694B Flexible ultrasonic radiometric force clamp based on microscopic visual servo |
| 07/10/2013 | CN102060258B Microelectronic mechanical shutter device |
| 07/04/2013 | WO2013097135A1 A silicon based mems microphone, a system and a package with the same |
| 07/04/2013 | WO2012094722A8 Printed circuit board with an acoustic channel for a microphone |
| 07/04/2013 | US20130169393 Microscale or nanoscale magnetic tweezers and process for fabricating such tweezers |