Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
03/2012
03/28/2012CN1609156B Composition for polishing semiconductor layers
03/28/2012CN1576339B 抛光组合物 The polishing composition
03/28/2012CN102395643A A cerium-based particle composition and the preparation thereof
03/28/2012CN102390036A Chemical-mechanical grinding end-point detecting method and system based on shallow trench isolation technology
03/28/2012CN102390033A Inspection device capable of debugging planeness and parallelism of wide-range outside micrometer
03/28/2012CN101934494B Chemical mechanical grinding method
03/28/2012CN101786260B Grinding method for eliminating corner effect in shallow trench isolation
03/28/2012CN101350332B Ultra thin wafers having an edge support ring and manufacture method thereof
03/27/2012US8143194 Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor
03/27/2012US8142259 Grinding machine and method
03/22/2012WO2012036087A1 Polishing agent and polishing method
03/22/2012WO2012034497A1 Numerical control machine tool for grinding two sides of a plane by shifting self-rotation and ultrasonic vibration
03/22/2012US20120071067 Retaining ring with shaped surface
03/22/2012US20120071065 Polishing apparatus
03/22/2012DE102007049810B4 Simultanes Doppelseitenschleifen von Halbleiterscheiben Simultaneous double side grinding of semiconductor wafers
03/22/2012DE10029032B4 Schleif- und Ätzanlage für plattenartige Objekte Grinding and etching equipment for plate-like objects
03/21/2012EP2429859A2 Process for resurfacing plastic lens
03/21/2012EP1934015B1 Cmp of copper/ruthenium substrates
03/21/2012CN202169537U 石板磨光机的石板平面检测装置 Slate stone grinder plane detection device
03/21/2012CN1910012B Retaining ring with shaped surface
03/21/2012CN102387894A Work carrier, bristle material for brush and method of producing brush, work carrier and bristle material for brush
03/21/2012CN102384900A Scatter plate and manufacture method thereof
03/21/2012CN102380821A Bevel gear shaft dual-positioning grinding fixture
03/21/2012CN102380820A Polishing apparatus
03/21/2012CN102380819A Double-head grinding machine
03/21/2012CN102380818A Chemical mechanical grinding method and chemical mechanical grinding equipment
03/21/2012CN102380817A Method for preventing low yield of wafer edge device
03/21/2012CN102380816A Chemically mechanical polishing method and system
03/21/2012CN102380815A Chemical mechanical grinding method and chemical mechanical grinding system
03/21/2012CN102380814A Chemical mechanical grinding method and chemical mechanical grinding device
03/21/2012CN101972979B Diamond surface chemical mechanical combined machining method and device thereof
03/21/2012CN101801605B Work polishing head, and polishing apparatus having the polishing head
03/21/2012CN101616772B Sapphire substrates and methods of making same
03/20/2012US8137159 Abrasive, method of polishing target member and process for producing semiconductor device
03/15/2012WO2011150326A3 Non-abrasive back coat for coated abrasives
03/15/2012US20120064721 Polishing slurry and polishing method
03/15/2012DE102010040535A1 Verfahren zum Sägen eines Werkstücks Method for cutting a workpiece
03/14/2012EP2428984A1 Semiconductor wafer polishing method and polishing pad shaping jig
03/14/2012EP2428318A2 Method of polishing an object to form a convex or concave surface on said object and polishing pad
03/14/2012EP2428315A2 Polishing apparatus
03/14/2012CN202162703U 机床滑鞍磨夹具 Saddle jig grinding machine
03/14/2012CN202162695U 一种水晶研磨机上的摇摆传动机构 A swing drive mechanism on the grinding machine crystal
03/14/2012CN202162694U 篮式砂磨机反转装置 Basket Mill inversion means
03/14/2012CN202162693U 一种研磨机 A polishing machine
03/14/2012CN202162692U 用于冲子成型器的定位装置 Positioning means for Punch's
03/14/2012CN202162691U 一种自动研磨加工装置 An automatic grinding device
03/14/2012CN202162690U Slope grinding device of fan-shaped plate of coiling machine
03/14/2012CN202162689U 一种全自动单排研磨抛光一体机 A fully automatic single-row polishing machine
03/14/2012CN202162688U 研磨机传动轴装置 Grinder shaft means
03/14/2012CN102378668A Method for the material-removing machining of very thin work pieces in a double side grinding machine
03/14/2012CN102371535A Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment
03/14/2012CN102371534A Chemical mechanical polishing method for surface of wafer
03/14/2012CN102371533A Method for reprocessing wafer by utilizing chemical mechanical polishing device
03/14/2012CN102371532A Reworking method for chemical mechanical lapping process
03/14/2012CN102371531A Grinding mechanism on grinding machine
03/14/2012CN102371530A Valve grinding machine
03/14/2012CN102371529A Automatic valve grinding machine
03/14/2012CN102019578B Method for removing wafer from grinding head of chemical mechanical polishing equipment
03/13/2012US8133815 Method of polishing compound semiconductor substrate, compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substrate
03/13/2012US8133096 Multi-phase polishing pad
03/08/2012WO2012029627A1 Polishing composition
03/08/2012WO2012029547A1 Polishing cloth and method for producing same
03/07/2012CN202155790U 一种冲子成型器 One kind Punch
03/07/2012CN202155789U 六工位研孔专用机床 Six-station research Kong Special Machines
03/07/2012CN102366932A Method of grinding bearing ring by utilizing grinding wheel
03/07/2012CN102366931A Workpiece grinding jig
03/07/2012CN102366930A Automatic valve grinding device
03/06/2012US8128464 Chemical mechanical polishing pad
03/06/2012US8128458 Polishing apparatus and substrate processing method
03/01/2012WO2012026437A1 Silicon wafer processing solution and silicon wafer processing method
03/01/2012WO2012026329A1 Polishing composition and polishing method using same
03/01/2012US20120053721 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
03/01/2012US20120052771 Method For the Material-Removing Machining of Very Thin Work Pieces in a Double Sided Grinding Machine
02/2012
02/29/2012EP2422930A2 Polishing apparatus
02/29/2012EP1432773B1 Rare earth salt oxidizer based cmp method
02/29/2012CN202151824U 一种研磨机过载保护装置 A polishing machine overload protection device
02/29/2012CN202151823U 一种光纤研磨机 A fiber optic polishing machine
02/29/2012CN101523565B Machining end point detecting method, grinding method, and grinder
02/29/2012CN101223016B Manufacturing method of laminated sheet and laminated sheet
02/23/2012US20120046781 Method, apparatus and system for use in processing wafers
02/23/2012DE10245636B4 Chemisch-mechanisches Polierverfahren Chemical mechanical polishing method
02/22/2012EP2421028A1 Method for producing silicon epitaxial wafer
02/22/2012EP2419929A2 Wafer manufacturing cleaning apparatus, process and method of use
02/22/2012EP2094441B1 Process and apparatus for treating exhausted abrasive slurries from the lapping process for the recovery of their reusable abrasive component
02/22/2012CN202147211U 一种适用于研磨易碎工件的装置 An apparatus suitable for grinding a workpiece fragile
02/22/2012CN202147210U 复合旋转轴座及包含该复合旋转轴座的研磨机 Composite rotating shaft seat and the seat containing the composite rotation axis milling machine
02/22/2012CN202147209U 研磨机 Grinder
02/22/2012CN202147208U 一种用于钢胚研磨机的冷却水板 Billet mill for cooling water board
02/22/2012CN202147207U 一种涡轮轴精研磨夹具 A turbine axis precision grinding fixture
02/22/2012CN202147206U 一种研磨机的研磨头心轴保护装置 Grinding spindle head protection device for grinding machine
02/21/2012US8119517 Chemical mechanical polishing method and method of manufacturing semiconductor device
02/21/2012US8118646 Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method
02/21/2012US8118640 Wafer transferring apparatus, polishing apparatus, and wafer receiving method
02/16/2012WO2012020672A1 Polishing composition and polishing method
02/16/2012WO2012019333A1 Method and apparatus for one-side chemical mechanical polishing silicon wafers
02/16/2012CA2806137A1 Method and apparatus for silicon wafter single surface chemical mechanical polishing
02/15/2012EP2418677A2 Polishing apparatus
02/15/2012EP2418258A1 Polishing slurry and method of polishing substrate
02/15/2012CN202144039U 地坪多功能机头自由变化研磨机 Multifunctional floor grinding machine head freely change
02/15/2012CN1760307B 抛光组合物以及使用该抛光组合物的抛光方法 The polishing composition and a polishing method using the polishing composition,
1 ... 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 ... 209