| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/05/2011 | US7920045 Surface mountable PPTC device with integral weld plate |
| 04/05/2011 | US7919872 Integrated circuit (IC) carrier assembly with first and second suspension means |
| 04/05/2011 | US7919027 Methods and devices for manufacturing of electrical components and laminated structures |
| 04/05/2011 | US7918021 Production of via hole in a flexible printed circuit board by applying a laser or punch |
| 04/05/2011 | US7918019 Method for fabricating thin touch sensor panels |
| 04/05/2011 | US7918018 Method of fabricating a semiconductor device |
| 04/05/2011 | US7918017 Electronic component taking out apparatus |
| 04/05/2011 | US7918012 Method of making calibration-adjusted analyte sensors |
| 04/05/2011 | CA2368384C A control method for copper density in a solder dipping bath |
| 03/31/2011 | WO2011038090A1 Electrical connection and method for making the same |
| 03/31/2011 | WO2011037285A1 Electrode production method |
| 03/31/2011 | WO2011037265A1 Structure and process for producing same |
| 03/31/2011 | WO2011037260A1 Structure and method for producing same |
| 03/31/2011 | WO2011037121A1 Method for inspecting surface of resin substrate having metal pattern formed thereon, and method for manufacturing the resin substrate |
| 03/31/2011 | WO2011036948A1 Nozzle for heating device, heating device, and nozzle for cooling device |
| 03/31/2011 | WO2011036776A1 Mounting board and failure predicting method |
| 03/31/2011 | WO2011036751A1 Electronic device and damage detecting method |
| 03/31/2011 | WO2011036278A1 Layout of contact pads of a system in package, comprising circuit board and electronic integrated elements |
| 03/31/2011 | WO2011036088A2 Carrier for electrically connecting a plurality of contacts of at least one chip applied to the carrier and method for producing the carrier |
| 03/31/2011 | WO2011035777A1 Method for separatively processing workpieces in a burr-free manner with changes of laser processing parameters |
| 03/31/2011 | WO2011008459A3 Structured material substrates for flexible, stretchable electronics |
| 03/31/2011 | WO2010132522A3 Multi-layer article for flexible printed circuits |
| 03/31/2011 | US20110077709 Medical device having resistance welded connections |
| 03/31/2011 | US20110076897 High Density Connector and Method of Manufacture |
| 03/31/2011 | US20110076855 Laminate and use thereof |
| 03/31/2011 | US20110075392 Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets |
| 03/31/2011 | US20110075382 Flexible circuit assembly for a capacitive-sensing device |
| 03/31/2011 | US20110075380 Self-locking features in a multi-chip module |
| 03/31/2011 | US20110075374 Rigid-flexible circuit board and method of manufacturing the same |
| 03/31/2011 | US20110073357 Electronic device and method of manufacturing an electronic device |
| 03/31/2011 | US20110073354 Printed board and method of manufacturing printed board |
| 03/31/2011 | US20110073252 Conductive paste and method of manufacturing printed circuit board using the same |
| 03/31/2011 | US20110072906 Sensor system and method for manufacturing a sensor system |
| 03/31/2011 | US20110072656 Method for forming a current distribution structure |
| 03/31/2011 | US20110072655 Method of soldering an electronic component |
| 03/31/2011 | US20110072654 Electronic Component Mounting Apparatus, Component Supply Apparatus, and Electronic Component Mounting Method |
| 03/31/2011 | DE102009045061A1 Producing electrically conductive, structured or fully flat surface, comprises applying base layer on a support using a dispersion, curing and/or drying the material, exposing particle by partial disruption and forming metal- on base layer |
| 03/31/2011 | DE102009043063A1 Schwert Sword |
| 03/31/2011 | DE102009028744A1 Verfahren zur Herstellung einer elektrischen Verbindung zwischen Leiterplatten A method for making an electrical connection between printed circuit boards |
| 03/31/2011 | DE102005034499B4 Presspaketaufbau zum Verpressen von Multilayern bzw. Presse zur Verpressung bzw. Herstellung von Multilayern Press package structure for pressing multilayer or press for pressing or multilayer production |
| 03/30/2011 | EP2302988A2 Method of soldering an electronic component |
| 03/30/2011 | EP2302987A1 Integration of SMD components in an IC housing |
| 03/30/2011 | EP2302083A1 Apparatus for soldering electronic component and method for soldering electronic component |
| 03/30/2011 | EP2302013A1 Anisotropic conductive adhesive |
| 03/30/2011 | EP2301311A1 Device for the heat treatment of workpieces |
| 03/30/2011 | EP2301065A1 Method for making an electronic assembly |
| 03/30/2011 | EP2301043A1 Metallic pastes and inks |
| 03/30/2011 | EP1042803B1 Method of manufacturing a multi-layered ceramic substrate |
| 03/30/2011 | CN201781693U Hanging basket for vertical brown oxide treatment line of PCB (printed circuit board) |
| 03/30/2011 | CN201781692U Clamp fixture for printed circuit board (PCB) |
| 03/30/2011 | CN201781681U Ceramic-based flex-rigid combined multilayer circuit board with through holes |
| 03/30/2011 | CN201781679U Ceramic-matrix rigid-flexible joint multilayer circuit board |
| 03/30/2011 | CN201776977U Special storage rack for PCB (printed circuit board) screens |
| 03/30/2011 | CN1973589B Method for production of electronic circuit board |
| 03/30/2011 | CN1914965B Method of manufacturing a circuit carrier and the use of the method |
| 03/30/2011 | CN101999259A Electronic component mounting apparatus and viscous material trial coater |
| 03/30/2011 | CN101999257A Flex-rigid wiring board and method of manufacturing the same |
| 03/30/2011 | CN101998779A Laminated ceramic electronic component and method for manufacturing same |
| 03/30/2011 | CN101998778A Method of manufacturing flexible printed circuit board |
| 03/30/2011 | CN101998777A Method for producing conduction between layers of metal aluminum based printed wiring board |
| 03/30/2011 | CN101998776A Copper foil for printed circuit boards and method for manufacturing the same |
| 03/30/2011 | CN101998775A Wave soldering clamp for circuit board with double-sided devices |
| 03/30/2011 | CN101998774A Component wave-peak welding clamp for high-power circuit board |
| 03/30/2011 | CN101998773A Method for processing plasma of organic solderability anti-corrosive coat in printed circuit board assembly |
| 03/30/2011 | CN101998772A Method of processing cavity of core substrate |
| 03/30/2011 | CN101998771A Manufacturing method of film with metal coating |
| 03/30/2011 | CN101998770A Method for manufacturing etched film resistance circuit board manufacturing method |
| 03/30/2011 | CN101998769A Rigid-flex board and step board and processing method of rigid-flex board and step board |
| 03/30/2011 | CN101998768A Novel manufacturing method for back drilling of PCB (Printed Circuit Board) |
| 03/30/2011 | CN101998767A Method and system of managing board assembling line |
| 03/30/2011 | CN101998766A Method for manufacturing soft and hard composite board |
| 03/30/2011 | CN101998765A Printed circuit board, display module and manufacture methods thereof |
| 03/30/2011 | CN101998764A Matrix MOV circuit board structure and manufacturing method thereof |
| 03/30/2011 | CN101998761A Metal lamination plate and preparation method thereof |
| 03/30/2011 | CN101998758A LED printed circuit board and preparation method of amorphous diamond heat dissipation and insulation film layer thereof |
| 03/30/2011 | CN101998755A Multilayer circuit board and manufacturing method thereof |
| 03/30/2011 | CN101998753A Circuit board and manufacturing method thereof |
| 03/30/2011 | CN101998752A Circuit board structure and manufacturing method thereof |
| 03/30/2011 | CN101998751A Circuit board and manufacturing method thereof |
| 03/30/2011 | CN101997256A Needling device of printed circuit board |
| 03/30/2011 | CN101997062A Manufacturing method of light-emitting diode (LED) circuit board |
| 03/30/2011 | CN101996758A Embedded combined type ultrathin transformer applied to LED |
| 03/30/2011 | CN101995772A Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method |
| 03/30/2011 | CN101994105A Preparing substrates containing polymers for metallization |
| 03/30/2011 | CN101994104A Method for electroless nickel-palladium-gold plating, plated product, printed wiring board, interposer and semiconductor apparatus |
| 03/30/2011 | CN101993634A Conductive ink, preparation method of metal micropattern using the same and printed circuit board prepared by the method |
| 03/30/2011 | CN101993581A Cleaning-free activated resinous composition and method for surface mounting using the same |
| 03/30/2011 | CN101699937B Method for producing stepped PCB board |
| 03/30/2011 | CN101699936B Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating |
| 03/30/2011 | CN101699935B Method for producing locatable high heat conduction ceramic circuit board |
| 03/30/2011 | CN101695220B Method for manufacturing PCB with stepped groove |
| 03/30/2011 | CN101652026B Preparation method of copper clad plate |
| 03/30/2011 | CN101617569B Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor |
| 03/30/2011 | CN101583248B Cold-connecting method of components |
| 03/30/2011 | CN101547574B Base plate of a circuit board and a preparing method of a circuit board with a misalignment structure |
| 03/30/2011 | CN101547573B Method for manufacturing circuit board with offset structure |
| 03/30/2011 | CN101541144B Circuit board transferring system and circuit board transferring method |
| 03/30/2011 | CN101528004B Supporting frame and material frame provided with same |
| 03/30/2011 | CN101525745B Metal surface treatment agent and printed wiring board with protecting film formed thereby |
| 03/30/2011 | CN101521998B Brush-throwing machine for removing protruding ink at two ends of conducting hole of printed circuit board and removing method thereof |