| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/14/2011 | DE102009042561A1 Verbindungsanordnung Connector assembly |
| 04/14/2011 | DE10165069B4 Verfahren zum Verbinden von gedruckten Leiterplatten A method for connecting printed circuit boards |
| 04/13/2011 | EP2309834A1 Compression bonding device, compression bonding method, package, and pressing plate |
| 04/13/2011 | EP2309831A1 Method for the manufacture of a circuit board, in particular a multi-layer printed board |
| 04/13/2011 | EP2309830A1 Plating film, printed wiring board, and module substrate |
| 04/13/2011 | EP2309829A1 Multilayer circuit board |
| 04/13/2011 | EP2309521A1 Resistance component |
| 04/13/2011 | EP2308629A1 Apparatus for generating a negatively charged ionic reducing gas |
| 04/13/2011 | EP2308276A1 A method of forming a high density structure |
| 04/13/2011 | EP2308275A1 Method for the hot stamping of at least one conductor track onto a substrate, substrate comprising at least one conductor track and stamping tool |
| 04/13/2011 | EP2308135A1 Electrical contact pair |
| 04/13/2011 | EP2307895A2 Test of electronic devices with boards without sockets based on independent mechanical clipping |
| 04/13/2011 | EP2307199A1 Screen plate, interlayer insulation film, circuit board, active matrix circuit board, and image display apparatus |
| 04/13/2011 | EP2205391B1 Method for operation of a wave soldering system which uses perfluoric polyether for reaction with impurities containing lead |
| 04/13/2011 | CN201797658U Ventilation hole structure for preventing board explosion for six-layered circuit board after aligned lamination |
| 04/13/2011 | CN201797657U Printed circuit board fixing post assembly |
| 04/13/2011 | CN201797656U Steel plate tipper |
| 04/13/2011 | CN201797655U Double-side circuit board made of parallel flat leads |
| 04/13/2011 | CN201797639U Fixing rivet for circuit board |
| 04/13/2011 | CN201796227U Exposure device |
| 04/13/2011 | CN201793797U Gold plating rack for flexible circuit board |
| 04/13/2011 | CN201793794U Screw rod type cathode vehicle sliding structure for electroplating circuit board |
| 04/13/2011 | CN201793793U Novel electroplating cylinder for printed circuit board (PCB) |
| 04/13/2011 | CN201793791U Improved PCB (printed circuit board) plating line |
| 04/13/2011 | CN201791837U Flexible circuit board forming mold base |
| 04/13/2011 | CN1993498B Printed wiring board |
| 04/13/2011 | CN102017821A Resist ink and method for manufacturing multilayer printed wiring board |
| 04/13/2011 | CN102017820A Substrate, structure for mounting surface mounting component, and electronic device |
| 04/13/2011 | CN102017819A Bonding method and bonding apparatus |
| 04/13/2011 | CN102017818A An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof |
| 04/13/2011 | CN102017332A Contacting of multipoint connectors by means of intermediate circuit boards |
| 04/13/2011 | CN102017107A Joint structure and electronic component |
| 04/13/2011 | CN102017106A Method for mounting member |
| 04/13/2011 | CN102016129A Electroplating composition and process for coating a semiconductor substrate using said composition |
| 04/13/2011 | CN102015922A Methods and compositions for ink jet deposition of conductive features |
| 04/13/2011 | CN102015835A Polyimide precursor, photosensitive polyimide precursor composition, photosensitive dry film, and flexible printed circuit board using those materials |
| 04/13/2011 | CN102014600A Radiating structure and manufacturing method thereof as well as electronic device with radiating structure |
| 04/13/2011 | CN102014590A Production method of multi-layer printed circuit board and multi-layer printed circuit board |
| 04/13/2011 | CN102014589A Method of manufacturing printed wiring board |
| 04/13/2011 | CN102014588A Method for plugging buried holes on high density interconnected printed circuit board |
| 04/13/2011 | CN102014587A Gold-plating process method of long and short golden fingers |
| 04/13/2011 | CN102014586A Method for gold-plating long and short gold fingers |
| 04/13/2011 | CN102014585A Process for plating gold on long and short gold fingers |
| 04/13/2011 | CN102014584A Process for manufacturing whole gold-plated board |
| 04/13/2011 | CN102014583A Process for manufacturing whole gold-plated board |
| 04/13/2011 | CN102014582A Process for manufacturing whole gold-plated board |
| 04/13/2011 | CN102014581A Process for manufacturing local gold-plated board |
| 04/13/2011 | CN102014580A Manufacturing technology of whole-plate gold-plated plate |
| 04/13/2011 | CN102014579A Gold-plating method of long and short golden fingers |
| 04/13/2011 | CN102014578A Process for manufacturing local gold-plated board |
| 04/13/2011 | CN102014577A Process for manufacturing local gold-plated board |
| 04/13/2011 | CN102014576A Process for manufacturing local gold-plated board |
| 04/13/2011 | CN102014575A Process for manufacturing local gold-plated board |
| 04/13/2011 | CN102014574A Carrier for conveying flexible printed substrate, and printing device of flexible printed substrate with the same |
| 04/13/2011 | CN102014573A Printed circuit board with radio frequency identification and production method thereof |
| 04/13/2011 | CN102014572A Electronic piece of metal sheet fillet and processing technology thereof |
| 04/13/2011 | CN102012634A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board |
| 04/13/2011 | CN102012607A Flexible circuit board imaging device |
| 04/13/2011 | CN102011169A Electroplating apparatus and electroplating method |
| 04/13/2011 | CN102010673A High-performance modified acrylate adhesive used in FPC (Flexible Printed Circuit) filed |
| 04/13/2011 | CN102009515A Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof |
| 04/13/2011 | CN102009244A Wave-soldering V-shaped claw piece |
| 04/13/2011 | CN102009198A Method for manufacturing PCB short slot |
| 04/13/2011 | CN101754576B Flexible circuit board and manufacturing method thereof and display |
| 04/13/2011 | CN101631434B Method of interlamination conduction of printed circuit boards |
| 04/13/2011 | CN101621893B Process and equipment thereof for manufacturing imprint dividing board of defective subboard of circuit board |
| 04/13/2011 | CN101583250B Method for processing through hole of printed circuit board, printed circuit board and communication equipment |
| 04/13/2011 | CN101577159B Film resistance structure and manufacturing method thereof |
| 04/13/2011 | CN101562949B Manufacturing method of rigid-flexible plate |
| 04/13/2011 | CN101543151B Multilayered ceramic substrate, process for producing the multilayered ceramic substrate, and electronic component |
| 04/13/2011 | CN101521994B Reflow soldering shield jig for flexible circuit board |
| 04/13/2011 | CN101494954B Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| 04/13/2011 | CN101483978B Method of repair of electronic device and repair system, circuit board unit and its manufacture method |
| 04/13/2011 | CN101483976B Method for manufacturing flexible substrate and flexible substrate punching device |
| 04/13/2011 | CN101472388B Layout structure of circuit board |
| 04/13/2011 | CN101460019B Production method for circuit construction of circuit board |
| 04/13/2011 | CN101416568B Components joining method and components joining structure |
| 04/13/2011 | CN101395977B Paste transfer apparatus and electronic component mounting apparatus |
| 04/13/2011 | CN101316479B Circuit board and production method thereof |
| 04/13/2011 | CN101276800B Circuit board and method of manufacturing same |
| 04/13/2011 | CN101253258B Aqueous solution and method for removing ionic contaminants from the surface of a workpiece |
| 04/13/2011 | CN101198211B Laminated substrate and manufacturing method thereof |
| 04/13/2011 | CN101035406B Embedded capacitor core having multilayer structure |
| 04/13/2011 | CN101027431B Plating method and plating apparatus |
| 04/13/2011 | CN101022703B Method and process for embedding electrically conductive elements in a dielectric layer |
| 04/12/2011 | US7923849 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 04/12/2011 | US7923125 Apparatus for solder crack deflection |
| 04/12/2011 | US7922545 Press-fit terminal |
| 04/12/2011 | US7921895 Adhesive chuck, and apparatus and method for assembling substrates using the same |
| 04/12/2011 | US7921553 Method of making a customized wireless communication device |
| 04/12/2011 | US7921551 Electronic component mounting method |
| 04/12/2011 | US7921550 Process of fabricating circuit structure |
| 04/09/2011 | CA2717227A1 Test fixture for printed circuit board |
| 04/07/2011 | WO2011041211A1 Printing of conductive patterns |
| 04/07/2011 | WO2011040560A1 Modified urethane resin curable composition and cured product thereof |
| 04/07/2011 | WO2011040502A1 Circuit substrate and process for production thereof |
| 04/07/2011 | WO2011040480A1 Circuit board |
| 04/07/2011 | WO2011040442A1 Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal |
| 04/07/2011 | WO2011040393A1 Circuit substrate and method of manufacture thereof |
| 04/07/2011 | WO2011040299A1 Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, and permanent pattern, method for forming same, and printed substrate |