| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/23/2012 | CN101564931B Substrate positioning device and method, substrate processing device and method |
| 05/23/2012 | CN101553092B Method of welding printed circuit board containing mixed lead components and leadless components |
| 05/23/2012 | CN101547551B Printed circuit board and method for fabricating a printed circuit board |
| 05/23/2012 | CN101528009B Method for manufacturing circuit structure |
| 05/23/2012 | CN101528008B Circuit board and manufacturing method thereof |
| 05/23/2012 | CN101519184B Method for manufacturing application substrate through photo-thermal effect |
| 05/23/2012 | CN101447354B In-mold molding touch control module and manufacturing method thereof |
| 05/23/2012 | CN101418201B Adhesive composite for flexible circuit board |
| 05/23/2012 | CN101366325B Electronic component mounting structure |
| 05/23/2012 | CN101361413B Electronic components mounting adhesive and electronic components mounting structure |
| 05/22/2012 | US8183386 Phenylnaphthylimidazole compound and usage of the same |
| 05/22/2012 | US8183090 Methods for manufacturing device mounting board and circuit substrate |
| 05/22/2012 | US8182882 For stereolithography, allow for variation in color, opacity, and surface properties, form opaque white or colored objects |
| 05/22/2012 | US8181340 External electrode forming method |
| 05/22/2012 | US8181339 Method of manufacturing a printed circuit board |
| 05/22/2012 | US8181338 Method of making a multilayer composite |
| 05/18/2012 | WO2012063918A1 Multilayer wiring board |
| 05/18/2012 | WO2012063805A1 Method for forming circuit on flexible laminate substrate |
| 05/18/2012 | WO2012063768A1 Method for forming functional pattern, and functional device |
| 05/18/2012 | WO2012063763A1 Method for forming functional pattern, and functional element |
| 05/18/2012 | WO2012063682A1 Circuit module having attached metal case, circuit module assembly having attached metal case, and method for producing circuit module having attached metal case |
| 05/18/2012 | WO2012063579A1 Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor |
| 05/18/2012 | WO2012063474A1 Plasma treatment device and plasma treatment method |
| 05/18/2012 | WO2012063386A1 Production method for solder transfer base material, solder precoating method, and solder transfer base material |
| 05/18/2012 | WO2012062557A1 Solution and process for the pre-treatment of copper surfaces using an n-alkoxylated adhesion-promoting compound |
| 05/18/2012 | WO2012035419A9 Apparatus and methods for compensation of carrier distortion from measurement machines |
| 05/18/2012 | WO2012031708A3 Antenna component and method for producing an antenna component |
| 05/17/2012 | US20120122323 Air conditioning wiring system |
| 05/17/2012 | US20120121800 Method of modifying surface of substrate for inkjet printing |
| 05/17/2012 | US20120121799 Method For Segregating The Alloying Elements And Reducing The Residue Resistivity Of Copper Alloy Layers |
| 05/17/2012 | US20120120671 Light emitting device, and method for manufacturing circuit board |
| 05/17/2012 | US20120120659 Board assemblies, light emitting device assemblies, and methods of making the same |
| 05/17/2012 | US20120120616 Wiring board, method for manufacturing same, display panel, and display device |
| 05/17/2012 | US20120120615 Circuit board with via trace connection and method of making the same |
| 05/17/2012 | US20120120613 Electronic module and production method therefor |
| 05/17/2012 | US20120120610 Semiconductor device |
| 05/17/2012 | US20120120582 Memory support structure |
| 05/17/2012 | US20120120547 Ceramic electronic component and method of manufacturing the same |
| 05/17/2012 | US20120120298 Lens module, camera module, and method for making lens module |
| 05/17/2012 | US20120119868 Wiring substrate and manufacturing method for wiring substrate |
| 05/17/2012 | US20120119863 Common mode filter and method of manufacturing the same |
| 05/17/2012 | US20120119682 Luminaire system and method |
| 05/17/2012 | US20120118857 Plasma Treatment System |
| 05/17/2012 | US20120118851 Method for forming a touch sensing pattern and signal wires |
| 05/17/2012 | US20120118753 Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier |
| 05/17/2012 | US20120118622 Laminate capacitor stack inside a printed circuit board for electromagnetic compatibility capacitance |
| 05/17/2012 | US20120118621 Printed circuit board and method for manufacturing the same |
| 05/17/2012 | US20120118618 Printed circuit board and method for manufacturing the same |
| 05/17/2012 | US20120118611 Planar electrodes and a method of controlling spacing between electrodes |
| 05/17/2012 | US20120118427 Electronic textile, article and method |
| 05/17/2012 | US20120117801 Variable resistance memory device and method of manufacturing the same |
| 05/17/2012 | US20120117800 Automated Twist Pin Assembling Method for Interconnecting Stacked Circuit Boards in a Module |
| 05/17/2012 | US20120117798 Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method |
| 05/17/2012 | US20120117797 Packaging or mounting a component |
| 05/17/2012 | US20120117796 Device mounting method and apparatus using the method |
| 05/16/2012 | EP2453726A1 Connection method, connection structure, and electronic device |
| 05/16/2012 | EP2453725A1 Through-wiring board and method of manufacturing same |
| 05/16/2012 | EP2453724A1 Through-wiring board and method of manufacturing same |
| 05/16/2012 | EP2453722A2 Electronic apparatus, method for mounting a device, and optical communication apparatus |
| 05/16/2012 | EP2453457A1 Switch |
| 05/16/2012 | EP2453041A1 Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound |
| 05/16/2012 | EP2453040A1 Method for producing formed circuit component |
| 05/16/2012 | EP2452547A1 Electronic component |
| 05/16/2012 | EP2452546A1 Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board |
| 05/16/2012 | EP2451881A2 Electrically conductive adhesives |
| 05/16/2012 | EP2255601B1 Method of producing circuit board by additive method |
| 05/16/2012 | EP2215203B1 High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean |
| 05/16/2012 | EP2127506B1 Method for fabricating electrical circuitry on ultra-thin plastic films |
| 05/16/2012 | EP1858307B1 Multilayer printed wiring board |
| 05/16/2012 | EP1704758B8 Method for the production of printed circuit boards and printed circuit board |
| 05/16/2012 | DE102011111489A1 Heizeinrichtung für eine Lötanlage Heater for soldering |
| 05/16/2012 | DE102011079278A1 Manufacturing method of electronic module based on three-dimensional technology, involves applying solder paste on solder surfaces of individual printed circuit boards (PCBs) and heating PCB in reflow oven for melting the solder paste |
| 05/16/2012 | CN202222084U Crimping tooling for crimp-type connector printed circuit board |
| 05/16/2012 | CN1466517B Copper foil for high-density ultrafine wiring board |
| 05/16/2012 | CN102461351A 多层陶瓷基片的制造方法 The method of manufacturing a multilayer ceramic substrate |
| 05/16/2012 | CN102461350A 多层印刷布线板的制造方法 The method of manufacturing a multilayer printed wiring board |
| 05/16/2012 | CN102461349A 电极连接方法、电极连接结构、用于电极连接的导电粘合剂、以及电子装置 Electrode connection method, the electrode connection structure, electrically connected to the conductive adhesive, and an electronic device for |
| 05/16/2012 | CN102461348A 电极基体 Electrode matrix |
| 05/16/2012 | CN102461340A 利用发光二极管单片阵列来提供高分辨率图像的系统和方法 The use of light-emitting diode array chip to provide a system and method for high-resolution images |
| 05/16/2012 | CN102460685A Semiconductor package and semiconductor package mounting structure |
| 05/16/2012 | CN102460669A Insulating resin film, bonded body using insulating resin film, and method for manufacturing bonded body |
| 05/16/2012 | CN102460667A Method of producing electronic component mounting structure, and electronic component mounting structure |
| 05/16/2012 | CN102460666A Method of producing electronic module, and electronic module |
| 05/16/2012 | CN102460656A Method for manufacturing semiconductor device, printed circuit board, and method for manufacturing the printed circuit board |
| 05/16/2012 | CN102460600A Reliable and durable conductive films comprising metal nanostructures |
| 05/16/2012 | CN102460206A Radar sensor with interference signal compensation |
| 05/16/2012 | CN102459430A Method for manufacturing prepreg for printed wiring board and device for manufacturing prepreg for printed wiring board |
| 05/16/2012 | CN102459417A Modified polyimide and method for producing modified polyimide |
| 05/16/2012 | CN102459392A 反应性氨基甲酸酯化合物、包含该化合物的活性能量射线固化型树脂组合物及其用途 Reactive urethane compound containing an active energy ray-curable resin composition and use of the compound |
| 05/16/2012 | CN102458856A 丝网印版 Screen printing |
| 05/16/2012 | CN102458059A Protection cover with conductive coating protection circuit and point-of-sale (POS) equipment consisting of protection cover |
| 05/16/2012 | CN102458056A 制造布线基板的方法 The method of manufacturing a wiring board |
| 05/16/2012 | CN102458055A 软硬结合电路板的制作方法 Flex circuit board manufacturing method |
| 05/16/2012 | CN102458054A Method for producing an electrical circuit and electrical circuit |
| 05/16/2012 | CN102458053A 电路板的制造方法 Method for manufacturing circuit boards |
| 05/16/2012 | CN102458052A 一种柔性线路板的补强贴合方法 A flexible circuit board reinforcement bonding method |
| 05/16/2012 | CN102458051A 基板的制造方法及用于简化制备工艺的结构 Substrate manufacturing method and structure for a simplified process for preparing |
| 05/16/2012 | CN102458050A Molding method |
| 05/16/2012 | CN102458049A 一种对叠孔印制板的生产方法 Kind of stacked hole PCB production methods |
| 05/16/2012 | CN102458048A Electronic component and electronic device |