Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2012
05/30/2012CN102480846A Method for preparing flexible substate and flexible substrate
05/30/2012CN102480845A 一种柔性印刷线路板的制作方法 A method of manufacturing a flexible printed wiring board
05/30/2012CN102480844A 一种防渗镀的pcb镀金板制造工艺 One kind of seepage gilt plated pcb board manufacturing process
05/30/2012CN102480843A 一种线路板及其制造方法 A circuit board and its manufacturing method
05/30/2012CN102480842A Method for preparing dielectric substate
05/30/2012CN102480841A Method for preparing dielectric substrate
05/30/2012CN102480840A Method for manufacturing circuit boards
05/30/2012CN102480839A Holding device
05/30/2012CN102480835A Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the same
05/30/2012CN102480834A 散热基板以及制造该散热基板的方法 The heat radiation substrate and a method of manufacturing the heat dissipation substrate
05/30/2012CN102480833A 具有专属电力传导结构的印刷电路板组与其制造方法 A printed circuit board manufacturing method of the exclusive group of its electricity conduction structure
05/30/2012CN102478346A 一种利用超声波干燥印制线路板的技术 A use of ultrasonic drying technology printed circuit boards
05/30/2012CN102476494A Dielectric substrate manufacturing method
05/30/2012CN102476231A Transmission structure with double guide rails for reflow soldering and reflow soldering machine with double guide rails
05/30/2012CN102476229A Heating wire fixing structure for reflow soldering and reflow soldering equipment
05/30/2012CN102073156B Display device and assembling method thereof
05/30/2012CN102056416B Minitype fast corrosion tank of printed circuit board (PCB)
05/30/2012CN101911850B Method for manufacturing multilayer printed wiring board
05/30/2012CN101906274B Adhesive, method of connecting wiring terminals and wiring structure
05/30/2012CN101897242B Parts made of electrostructural composite material
05/30/2012CN101808462B Wiring board and preparation method thereof
05/30/2012CN101772526B Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
05/30/2012CN101715285B Automatic sticking and inserting machine
05/30/2012CN101658081B Flexible wiring board and method of manufacturing same
05/30/2012CN101657063B Method for manufacturing radiating circuit board and radiating circuit board
05/30/2012CN101651404B Substrate and magnetic device integrated DC-DC converter and preparation process thereof
05/30/2012CN101610646B Electrical connection structure as well as technology and circuit board structure thereof
05/30/2012CN101563962B Printed substrate through which very strong currents can pass and corresponding production method
05/30/2012CN101541145B Processing method of ultra-thin core board in manufacturing of printed circuit board or integrated circuit package substrate
05/30/2012CN101493548B Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
05/30/2012CN101472402B Soldering apparatus and soldering method
05/30/2012CN101465193B Magnetic element unit and fixed component thereof
05/30/2012CN101445644B White hardening resin composition
05/30/2012CN101433134B Solder resist material, wiring board using the solder resist material, and semiconductor package
05/30/2012CN101421671B Photosensitive element, method for formation of resist pattern, and method for production of print circuit board
05/30/2012CN101415299B Method of manufacturing multi-layer circuit board
05/30/2012CN101335376B Preparing method of electronic label antenna
05/30/2012CN101257142B Annular satellite navigation aerial and manufacturing method thereof
05/30/2012CN101147432B 电路板设计 Circuit board design
05/30/2012CN101115352B Multilayered printed wiring board and method for manufacturing the same
05/30/2012CN101112141B Multi-layer printed wiring board
05/30/2012CN101022698B Printed circuit board assembly and method of manufacturing the same
05/29/2012US8188372 Flex-rigid printed wiring board and manufacturing method thereof
05/29/2012US8187670 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device
05/29/2012US8187667 Method for disposing a component
05/29/2012US8186850 Mounting arrangement and method for light emitting diodes
05/29/2012US8186052 Method of producing substrate
05/29/2012US8186051 Method for fabricating package substrate and die spacer layers having a ceramic backbone
05/29/2012US8186050 Printed wiring board manufacturing method
05/29/2012US8186049 Method of making a circuit structure
05/29/2012US8186048 Conformal shielding process using process gases
05/29/2012US8186047 Method of mounting electronic component
05/29/2012US8186046 Method for manufacturing a multilayer printed wiring board for providing an electronic component therein
05/29/2012US8186045 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
05/29/2012US8186044 Method of manufacturing small volume in vitro analyte sensors
05/29/2012US8186043 Method of manufacturing a circuit board
05/29/2012US8186042 Manufacturing method of a printed board assembly
05/29/2012US8186030 Method for manufacturing elastic wave device
05/29/2012US8186027 Method of fabricating a piezoelectric vibrator
05/24/2012WO2012067263A1 Laminate and method for producing laminate
05/24/2012WO2012067253A1 Ceramic substrate and method for producing same
05/24/2012WO2012067225A1 Metal foil pattern laminate, method for punching metal foil, circuit board, method for producing same, and solar cell module
05/24/2012WO2012067177A1 Wiring board and method for producing same
05/24/2012WO2012067155A1 Transport device
05/24/2012WO2012067142A1 Film-like member and method for attaching same
05/24/2012WO2012067094A1 Insulating substrate, metal-clad laminate, printed wiring board, and semiconductor device
05/24/2012WO2012067041A1 Method for inspecting foreign material on substrate and apparatus for inspecting foreign material on substratrate
05/24/2012WO2012067016A1 Conductive paste and base with conductive film
05/24/2012WO2012067003A1 Circuit substrate and manufacturing method therefor
05/24/2012WO2012066973A1 Method for manufacturing flexible multi-layered circuit substrate
05/24/2012WO2012066957A1 Conductive composition, conductive film, and method for forming conductive film
05/24/2012WO2012066921A1 Pattern modification device and humidifying unit used by same
05/24/2012WO2012066897A1 Anisotropic conductive film, united object, and process for producing united object
05/24/2012WO2012066726A1 Tape adhesion device and tape adhesion method
05/24/2012WO2012066699A1 Device for cleaning objects to be cleaned
05/24/2012WO2012066273A1 Method for reducing creep corrosion
05/24/2012WO2012066139A1 Apparatus and method for inspecting pcb-mounted integrated circuits
05/24/2012WO2012065376A1 Substrate of printed circuit board and manufacturing method thereof
05/24/2012WO2012065203A1 Circuit board, and method for the production and use of such a circuit board
05/24/2012WO2012065202A1 Method for mounting a component in or on a circuit board, and circuit board
05/24/2012WO2012015982A3 Electronics substrate with enhanced direct bonded metal
05/24/2012US20120128099 Method and Frequency Agile Pre-distorted Transmitter Using Programmable Digital Up and Down Conversion
05/24/2012US20120127681 Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the same
05/24/2012US20120127667 Heat sink package and method of manufacturing
05/24/2012US20120127666 Heat-Radiating Substrate and Method Of Manufacturing The Same
05/24/2012US20120127661 Directly injected forced convection cooling for electronics
05/24/2012US20120127660 Cylindrical packages, electronic apparatus including the same, and methods of fabricating the same
05/24/2012US20120127559 Holographic visualization system comprising a high data refresh rate dnd driver array
05/24/2012US20120127387 Electrode substrate, method for manufacturing electrode substrate, and image display device
05/24/2012US20120127254 Thermal print head and method of manufacturing the same
05/24/2012US20120126678 Apparatus for Retaining an Object
05/24/2012US20120125882 Method of making touch-sensitive device with electrodes having location pattern included therein
05/24/2012US20120125680 Multilayered printed circuit board and manufacturing method thereof
05/24/2012US20120125677 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
05/24/2012US20120125668 Wiring structure for improving crown-like defect and fabrication method thereof
05/24/2012US20120125667 Printed circuit board and method of manufacturing the same
05/24/2012US20120125664 Printed Wiring Board with Dielectric Material Sections Having Different Dissipation Factors
05/24/2012US20120124830 Process for fabricating circuit board
05/24/2012US20120124829 Producing method of wired circuit board
05/24/2012US20120124828 Electronic component embedded printed circuit board and manufacturing method thereof