| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/12/2012 | CN102668019A Tool for picking a planar object from a supply station |
| 09/12/2012 | CN102667962A Electroconductive paste for electron beam curing and circuit board production method using same |
| 09/12/2012 | CN102666747A Conductive metal ink composition and method for forming a conductive pattern |
| 09/12/2012 | CN102666658A Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board |
| 09/12/2012 | CN102666652A Semiaromatic polyamide, process for preparing same, composition comprising such a polyamide and uses thereof |
| 09/12/2012 | CN102666639A Epoxy resin composition and surface mounting device coated with said composition |
| 09/12/2012 | CN102666631A Polyamideimide adhesives for printed circuit boards |
| 09/12/2012 | CN102666332A Tape adhesion device and tape adhesion method |
| 09/12/2012 | CN102666002A Solder ball for semiconductor mounting and electronic member |
| 09/12/2012 | CN102665375A System and method for welding flexible printed circuit made of polyester material at low temperature |
| 09/12/2012 | CN102665374A Method for assembling printed circuit board |
| 09/12/2012 | CN102665373A Printed circuit board and manufacturing method thereof |
| 09/12/2012 | CN102665372A Two-sided hollow flexible circuit board and manufacturing method thereof |
| 09/12/2012 | CN102665306A Heater and method for producing the same using PCB process |
| 09/12/2012 | CN102662306A Photosensitive element, method for formation of resist pattern, and method for production of print circuit board |
| 09/12/2012 | CN102223762B High-precision jacquard glass fiber fabric |
| 09/12/2012 | CN101868563B Base processing agent for metal material and method for processing base for metal material |
| 09/11/2012 | US8264851 Multi-configuration processor-memory substrate device |
| 09/11/2012 | US8264847 Electronic circuit module and method of making the same |
| 09/11/2012 | US8263983 Wiring substrate and semiconductor device |
| 09/11/2012 | US8263870 Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board |
| 09/11/2012 | US8263438 Method for connecting a die assembly to a substrate in an integrated circuit |
| 09/11/2012 | US8263192 Methods for modifying surfaces |
| 09/11/2012 | US8261438 Method for forming metal pattern, metal pattern and printed wiring board |
| 09/11/2012 | US8261437 Method for manufacturing a circuit board |
| 09/11/2012 | US8261436 Fabricating process of circuit substrate |
| 09/11/2012 | US8261435 Printed wiring board and method for manufacturing the same |
| 09/11/2012 | CA2535186C Frame for a device mounted above a printed circuit board in an electronic device |
| 09/11/2012 | CA2374143C Substrate for power electronic circuit and power electronic module using such substrate |
| 09/07/2012 | WO2012118031A1 Photosensitive resin composition, photoresist film using same, resist pattern forming method, and conductor pattern forming method |
| 09/07/2012 | WO2012117915A1 Novel insulating film and printed wiring board provided with insulating film |
| 09/07/2012 | WO2012117872A1 Resin substrate with built-in electronic component |
| 09/07/2012 | WO2012117762A1 Printed circuit board |
| 09/07/2012 | WO2012117533A1 Through-hole plating method and substrate manufactured using same |
| 09/07/2012 | WO2012116963A1 Method for assembling electronic components onto a substrate |
| 09/07/2012 | WO2012116858A1 Carrier for an optoelectronic structure and optoelectronic semiconductor chip comprising such a carrier |
| 09/07/2012 | WO2012060657A3 New printed circuit board and method for manufacturing same |
| 09/06/2012 | US20120226195 Lancet integrated test element tape dispenser |
| 09/06/2012 | US20120225411 Connector Assemblage Formational for a Dermal Communication |
| 09/06/2012 | US20120224345 Member mounting method and member assembly |
| 09/06/2012 | US20120224333 Multi-plate board embedded capacitor and methods for fabricating the same |
| 09/06/2012 | US20120224332 Integrated circuit packaging system with bump bonded dies and method of manufacture thereof |
| 09/06/2012 | US20120224328 Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof |
| 09/06/2012 | US20120224284 Distributed building blocks of r-c clamping circuitry in semiconductor die core area |
| 09/06/2012 | US20120223622 Vibrating device, method for manufacturing vibrating device, and electronic apparatus |
| 09/06/2012 | US20120223613 Electrical bypass structure for mems device |
| 09/06/2012 | US20120223046 Printing method for printing electronic devices and relative control apparatus |
| 09/06/2012 | US20120222892 Wire bond pad system and method |
| 09/06/2012 | US20120222891 Electronic device and noise suppression method |
| 09/06/2012 | US20120222299 Method of manufacturing a printed circuit board |
| 09/06/2012 | US20120222298 Method of circuit layout by photosensitive environment-friendly ink |
| 09/06/2012 | US20120222290 Method and system for preparing wireless communication chips for later processing |
| 09/06/2012 | DE19959407B4 Elektrisch leitende Verbindung zwischen einem Endgerät mit einer Kontaktiereinheit zur Aufnahme und elektrischen Kontaktierung einer Chipkarte und einem Gerät zur elektrischen Simulation einer Chipkarte zum Testen des Endgeräts Electrically conductive connection between a terminal with a contacting unit for receiving and making electrical contact with a smart card and a device for the electrical simulation of a chip card for testing of the terminal |
| 09/05/2012 | EP2496062A1 Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials |
| 09/05/2012 | EP2496061A1 Circuit board, and semiconductor device having component mounted on circuit board |
| 09/05/2012 | EP2495818A1 Conductive connection material and terminal-to-terminal connection method using same |
| 09/05/2012 | EP2495732A2 Conductive fine particles, method for plating fine particles, and substrate structure |
| 09/05/2012 | EP2494857A1 Method for curing a substance comprising a metal complex |
| 09/05/2012 | EP2494099A1 Metal deposition |
| 09/05/2012 | EP2493953A1 Polyamideimide adhesives for printed circuit boards |
| 09/05/2012 | CN202425217U Flexible lamp panel furnace-through clamp |
| 09/05/2012 | CN202425216U Wave-soldering tool |
| 09/05/2012 | CN202425215U Tray |
| 09/05/2012 | CN202425214U Self-locking mechanism |
| 09/05/2012 | CN202425213U Protective substrate for circuit board processing |
| 09/05/2012 | CN202425212U Board blockage prevention and alarm system for PCB (Printed Circuit Board) horizontal production line |
| 09/05/2012 | CN202425211U Automatic discharge equipment |
| 09/05/2012 | CN202425210U Fixture for fitting reinforcers of flexible printed circuit boards |
| 09/05/2012 | CN202425209U Tool for fitting reinforcement of flexible circuit board |
| 09/05/2012 | CN202425208U Flexible circuit board vacuum lamination machine |
| 09/05/2012 | CN202425190U Stepped circuit board |
| 09/05/2012 | CN202423236U Die bonding pressing plate |
| 09/05/2012 | CN202415724U Electroless copper plating hanging basket |
| 09/05/2012 | CN202414771U Scaffold for preventing circuit board from being scratched in electroplating pretreatment process |
| 09/05/2012 | CN202411615U Cooling fan device for wave soldering |
| 09/05/2012 | CN202411612U Wave-soldering jig |
| 09/05/2012 | CN202411611U Nitrogen automatic switching-off system for reflow oven |
| 09/05/2012 | CN202411600U Elastic chain claw for wave peak soldering machine |
| 09/05/2012 | CN202411598U Jig for furnace positioning of printed circuit board (PCB) |
| 09/05/2012 | CN1985552B Conductive member for non-contact type data carrier and method and device for manufacturing the same |
| 09/05/2012 | CN1901181B Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/05/2012 | CN102656957A Process for producing electric circuits on a given surface |
| 09/05/2012 | CN102656956A Flexible printed circuit board and method of manufacturing thereof |
| 09/05/2012 | CN102656955A A method of manufacturing substrates having asymmetric buildup layers |
| 09/05/2012 | CN102656685A Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
| 09/05/2012 | CN102656630A Circuit board, manufacturing method of circuit board, suspension substrate, suspension, device-mounted suspension, and hard disk drive |
| 09/05/2012 | CN102656518A Photosensitive resin composition, dry film thereof, and printed wiring board formed using same |
| 09/05/2012 | CN102656244A 各向异性导电性粘接剂 Anisotropic conductive adhesive |
| 09/05/2012 | CN102655716A Printed circuit boards with stacked micros vias |
| 09/05/2012 | CN102655715A Flexible printed circuit board (PCB) and manufacturing method thereof |
| 09/05/2012 | CN102655714A Manufacturing process of metal substrate high-conductivity metal base circuit board |
| 09/05/2012 | CN102655713A Manufacturing process of high-conduction metal-based circuit board of metal substrate |
| 09/05/2012 | CN102655712A Aligning lamination pressing machine of semi-automatic reinforcing sheet of flexible printed circuit board |
| 09/05/2012 | CN102653156A Process for manufacturing printed circuit boards and a machine for this purpose |
| 09/05/2012 | CN102170756B Circuit board resin film evener and using method thereof |
| 09/05/2012 | CN102123562B Method for manufacturing metal substrate by adopting reflow soldering |
| 09/05/2012 | CN102111991B Method for soldering through-hole reflow device and printed circuit board |
| 09/05/2012 | CN102110616B Method for realizing thin film multilayer wiring on low temperature cofired ceramic (LTCC) substrate |
| 09/05/2012 | CN102088819B Novel electronic circuit substrate and manufacturing process thereof |
| 09/05/2012 | CN102045960B Method for plating gold on equilong fingers |