| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/29/2012 | CN101626660B Process for attaching and pressing copper surfaces of multilayer plates with asymmetrical structures |
| 08/29/2012 | CN101466208B Wiring substrate and method of manufacturing the same |
| 08/29/2012 | CN101420006B Surface-mountable, radiation-emitting component and method for the production thereof |
| 08/29/2012 | CN101355848B Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board |
| 08/29/2012 | CN101213464B Connector-to-pad PCB translator for a tester and method of fabrication |
| 08/29/2012 | CN101142863B Method for manufacturing circuit forming board |
| 08/28/2012 | US8254144 Circuit board laminated module and electronic equipment |
| 08/28/2012 | US8254136 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board |
| 08/28/2012 | US8253030 Multilayer printed wiring board |
| 08/28/2012 | US8252635 Electronic system modules and method of fabrication |
| 08/28/2012 | US8252423 Laminate and use thereof |
| 08/28/2012 | US8252419 Adhesive for bonding circuit members, circuit board and process for its production |
| 08/28/2012 | US8252364 Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same |
| 08/28/2012 | US8251619 Hole machining method for circuit board |
| 08/28/2012 | US8250749 Method of producing a proximal connector end of an implantable lead |
| 08/28/2012 | US8250748 Method for producing an LTCC substrate |
| 08/28/2012 | US8250747 Method of mounting capacitor array |
| 08/28/2012 | US8250746 Method for making electronic device having metallic connecting structure |
| 08/28/2012 | US8250745 Process for manufacturing a microcircuit cochlear electrode array |
| 08/28/2012 | CA2496957C Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate |
| 08/23/2012 | WO2012112367A1 Printed circuit board registration testing |
| 08/23/2012 | WO2012112027A1 Hybrid materials for printing (semi-) conductive elements |
| 08/23/2012 | WO2012111711A1 Multilayered wired substrate and method for producing the same |
| 08/23/2012 | WO2012111375A1 Method for producing multilayer substrate and desmearing method |
| 08/23/2012 | WO2012111356A1 Two-liquid mixing first and second liquids and method for producing printed circuit board |
| 08/23/2012 | WO2012111183A1 Photosensitive composition and printed circuit board |
| 08/23/2012 | WO2012111055A1 Member mounting method |
| 08/23/2012 | WO2012110023A1 Method for soldering components |
| 08/23/2012 | WO2012109745A1 Reflow method for lead-free solder |
| 08/23/2012 | WO2012085472A3 Printed circuit board with an insulated metal substrate |
| 08/23/2012 | WO2012074563A3 Ultrasonic assisted filling of cavities |
| 08/23/2012 | WO2012072070A3 Sensor comprising a preferably multilayered ceramic substrate and method for producing it |
| 08/23/2012 | US20120213944 Method for manufacturing printed wiring board |
| 08/23/2012 | US20120212920 Circuit card assemblies having connector-less perpendicular card-to-card interconnects |
| 08/23/2012 | US20120212919 Inductor component and printed wiring board incorporating inductor component and method for manufacturing inductor component |
| 08/23/2012 | US20120212252 Printed Circuit Board Registration Testing |
| 08/23/2012 | US20120211487 Microwave unit and method therefore |
| 08/23/2012 | US20120211465 Flex-rigid printed wiring board and manufacturing method thereof |
| 08/23/2012 | US20120211464 Method of manufacturing printed circuit board having metal bump |
| 08/23/2012 | US20120211273 Via stub elimination |
| 08/23/2012 | US20120211270 Method of manufacturing printed wiring board and printed wiring board |
| 08/23/2012 | US20120211268 Light and heat resistant circuit board apparatus and method |
| 08/23/2012 | US20120211264 Capacitive touch panels |
| 08/23/2012 | US20120211263 Wired circuit board and producing method thereof |
| 08/23/2012 | US20120211148 3-dimensional curved substrate lamination |
| 08/23/2012 | US20120210576 Printed circuit board and method of manufacturing the same |
| 08/23/2012 | US20120210575 Electric contact for a connector |
| 08/23/2012 | US20120210564 Circuit obfuscation |
| 08/23/2012 | DE102011011748A1 Verfahren zum Verlöten von Bauelementen Method for soldering components |
| 08/23/2012 | DE102011004383A1 Flexible, multi-layer circuit substrate manufacturing method, involves connecting functional films with each other by region-wise deflection of carrier film and region-wise contacting of films and adhesive layer by laminating movement |
| 08/23/2012 | DE102011000866A1 Elektrisches Bauelement mit einer elektrischen Verbindungsanordnung und Verfahren zu dessen Herstellung An electrical component with an electrical connection arrangement and method for its production |
| 08/22/2012 | EP2490514A1 Printed wiring board, method of soldering quad flat package IC, and air conditioner |
| 08/22/2012 | EP2490513A2 Light and heat resistant circuit board apparatus and method |
| 08/22/2012 | EP2489683A1 Process for production of core-shell particles, core-shell particles, and paste composition and sheet composition which contain same |
| 08/22/2012 | EP2489248A1 Printed circuit board |
| 08/22/2012 | EP2489247A1 Printed circuit board |
| 08/22/2012 | EP2489072A1 Protective circuit board cover |
| 08/22/2012 | EP2165582B1 Compositions and methods for creating electronic circuitry |
| 08/22/2012 | EP2165581B1 Compositions and methods for creating electronic circuitry |
| 08/22/2012 | EP1950767B1 Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board |
| 08/22/2012 | EP1678288B1 Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards |
| 08/22/2012 | CN202396093U Tackling used for riveting quickly |
| 08/22/2012 | CN202396092U Closed integrated PCB (printed circuit board) through hole copper plating production line |
| 08/22/2012 | CN202396091U Circuit board carrying tool |
| 08/22/2012 | CN202396090U Press-connection machine |
| 08/22/2012 | CN202388905U Formwork for various types |
| 08/22/2012 | CN102648671A Resin substrate with built-in electronic component and electronic circuit module |
| 08/22/2012 | CN102648670A Printed circuit board and method of manufacturing the same |
| 08/22/2012 | CN102648669A Conductor pattern forming method and conductor pattern |
| 08/22/2012 | CN102648668A Electrical connection and method for making the same |
| 08/22/2012 | CN102648667A Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration |
| 08/22/2012 | CN102648246A Method for applying carbon/tin mixtures to metal or alloy layers |
| 08/22/2012 | CN102647862A Blind via filling plating method using different current parameter combinations |
| 08/22/2012 | CN102647861A Metal-core printed circuit board and manufacturing method thereof |
| 08/22/2012 | CN102647860A Joint welding fixture |
| 08/22/2012 | CN102647859A Producing process for carbon ink of circuit board |
| 08/22/2012 | CN102647858A Processing method of printed circuit board (PCB) |
| 08/22/2012 | CN102647857A Manufacture process of printed circuit board |
| 08/22/2012 | CN102647856A Method for producing COF (Chip on Film) flexible printed circuit board |
| 08/22/2012 | CN102647855A Auxiliary clamping jig for plate cutting machine |
| 08/22/2012 | CN102647854A Inductor component, printed circuit board incorporating inductor component therein, and method of manufacturing inductor component |
| 08/22/2012 | CN102647853A High-accuracy through-hole resistance printed board and manufacture method thereof |
| 08/22/2012 | CN102647852A High heat radiation printed circuit board and production method thereof |
| 08/22/2012 | CN102647850A Positioning mark structure for measuring harmomegathus of six-layer HDI (high density interconnect) circuit board |
| 08/22/2012 | CN102643572A Thermocuring solder-mask ink and preparation method thereof |
| 08/22/2012 | CN102118921B Pin-bending-and-fixing device for component inserter |
| 08/22/2012 | CN102045946B Stamping method |
| 08/22/2012 | CN102026495B Sheet welding preventing method |
| 08/22/2012 | CN102014600B Radiating structure and manufacturing method thereof as well as electronic device with radiating structure |
| 08/22/2012 | CN102006728B Novel production method of board deep-recess line |
| 08/22/2012 | CN101990373B Method for manufacturing ceramic-based interconnected rigid flexible combined multilayer circuit board |
| 08/22/2012 | CN101990371B Manufacture method of ceramic-based interconnection flexible circuit board |
| 08/22/2012 | CN101965107B Welding fixture of optical component |
| 08/22/2012 | CN101959384B Surface mounting elastic sheet with supporting section and blocking adsorption section |
| 08/22/2012 | CN101917821B High-density circuit board registration hole and manufacturing method thereof |
| 08/22/2012 | CN101917818B Pad structure of circuit board and manufacturing method thereof |
| 08/22/2012 | CN101916752B Multilayer printed wiring board |
| 08/22/2012 | CN101911849B Method for manufacturing ceramic electronic component and ceramic electronic component |
| 08/22/2012 | CN101647074B Conductive film and method for producing the same |
| 08/22/2012 | CN101602052B Cleaning device |