Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2012
09/05/2012CN102045956B Method for plating gold on equilong connecting fingers
09/05/2012CN102045955B Method for plating gold on equilong connecting fingers
09/05/2012CN102036504B Tool for production process of PCB and integrated fixing method
09/05/2012CN102014580B Manufacturing technology of whole-plate gold-plated plate
09/05/2012CN102006967B Lead-free solder alloy, fatigue-resistant soldering materials containing the solder alloy, and joined products using the soldering materials
09/05/2012CN101960931B Flow soldering apparatus and flow soldering method
09/05/2012CN101911843B A multilayer film for dry film resist
09/05/2012CN101909408B Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board)
09/05/2012CN101909406B Board interconnection structure
09/05/2012CN101888747B Method for manufacturing printed-circuit board
09/05/2012CN101883470B Prepreg for printed board and laminated plate adhered with metal foil
09/05/2012CN101865682B Multilayer printed wiring board interlayer dislocation detection method
09/05/2012CN101836514B Negative imaging method for providing a patterned metal layer having high conductivity
09/05/2012CN101835351B Manufacture process of sectional golden finger
09/05/2012CN101826409B Side control structure of electronic structure and circuit board manufacturing method thereof
09/05/2012CN101796147B Ink composition
09/05/2012CN101784365B Flux for soldering, soldering paste composition, and method of soldering
09/05/2012CN101772276B Method for installing press key in printed circuit board
09/05/2012CN101690430B Method for plating wiring board, and wiring board
09/05/2012CN101690428B Ceramic substrate and its manufacture method
09/05/2012CN101675716B Wiring board and method of manufacturing the same
09/05/2012CN101664733B Method for making prepreg used for thick copper multilayer printed circuit board and prepreg
09/05/2012CN101638785B Pretreatment liquid of organic weldable protective agent process
09/05/2012CN101510515B Circuit board, manufacturing method thereof and chip packaging structure
09/05/2012CN101501830B Method for producing an electric functional layer on a surface of a substrate
09/05/2012CN101467248B Heat dissipating wiring board and method for manufacturing same
09/05/2012CN101454108B Wave soldering tank
09/05/2012CN101322448B Process for producing metal wiring board
09/05/2012CN101304637B Wiring forming method of printed circuit board
09/05/2012CN101209929B Multilayer ceramics substrate
09/05/2012CN101200025B Use of liquid active additive in reducing viscosity of melted solder during soldering process
09/05/2012CN101199021B A method in the fabrication of a ferroelectric memory device
09/05/2012CN101098620B Method and device for micromachining materials
09/05/2012CN101038981B Electroconductive antenna producing method and device
09/04/2012US8259465 Chip card holder and electronic device using the same
09/04/2012US8259460 Submount for electronic components
09/04/2012US8259295 Fabrication method of semiconductor integrated circuit device
09/04/2012US8258411 Printed circuit board with improved via design
09/04/2012US8257779 Viscous material noncontact jetting system
09/04/2012US8257094 Connection terminal and transmission line
09/04/2012US8256111 Circuit board layout method
09/04/2012US8256110 Method of manufacturing electrical connector
09/04/2012US8256109 Method for checking and rotating electronic components
09/04/2012US8256108 Bonding method
09/04/2012US8256107 Method of manufacturing electronic-parts package
09/04/2012US8256106 Method for fabricating circuit board structure with capacitors embedded therein
09/04/2012CA2769923A1 Multi-plate board-embedded capacitor and methods for fabricating the same
08/2012
08/30/2012WO2012116157A2 Chip module embedded in pcb substrate
08/30/2012WO2012115556A1 A method for mounting connection pins in a component carrier, a die tool for mounting connection pins, a component carrier forming a module for an electronic assembly, and such an assembly
08/30/2012WO2012115554A1 A connection pin and a method for mounting a connection pin in a component carrier for an electronic assembly, and such a component carrier comprising connection pins
08/30/2012WO2012115268A1 Solder alloy for power device and soldered joint of high current density
08/30/2012WO2012115255A1 Light-shielding composition, method for producing a light-shielding composition, solder resist, method for forming a pattern, and solid-state imaging device
08/30/2012WO2012115165A1 Film forming method and film forming device
08/30/2012WO2012115108A1 Wiring formation method and device
08/30/2012WO2012115006A1 Screen and method for manufacturing solar cell
08/30/2012WO2012114689A1 Screen printer and screen printing method
08/30/2012WO2012072914A3 Machine for exposing panels
08/30/2012US20120220072 Copper nano paste, method for forming the copper nano paste, and method for forming electrode using the copper nano paste
08/30/2012US20120219263 Mounting devices for optical devices, and related sub-assemblies, apparatuses, and methods
08/30/2012US20120219257 Lens device attachment to printed circuit board
08/30/2012US20120218721 Method of manufacturing component built-in module and component built-in module
08/30/2012US20120218614 Method of manufacturing optical scanning apparatus and optical scanning apparatus
08/30/2012US20120217056 Electronic Component and Package for Device, and Method of Manufacturing the Same
08/30/2012US20120217048 Electronic modules having grounded electromagnetic shields
08/30/2012US20120217045 Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board
08/30/2012US20120216946 Method of manufacturing wiring substrate
08/30/2012DE112010000447T5 Elektronische Schaltungsvorrichtung An electronic circuit device
08/30/2012DE112006001048B4 Herstellungsverfahren für Schaltungsteile Production method for circuit parts
08/29/2012EP2493274A1 Metal layer structure of multilayer flexible borad and making method thereof
08/29/2012EP2493273A1 Device-mounting structure and device-mounting method
08/29/2012EP2493272A1 Device mounting structure and device mounting method
08/29/2012EP2491771A1 Coupling device, assembly having a coupling device, and method for producing an assembly having a coupling device
08/29/2012EP2491582A1 Method for producing vias
08/29/2012EP2491379A1 Process, kit and composition for detecting residues and contaminants in an object with three-dimensional geometry
08/29/2012CN202406395U Auxiliary joint for fixing multilayer PCB inner core board
08/29/2012CN202406394U Spray nozzle for heavy industrial process
08/29/2012CN202406393U Metal mask plate made from titanium carbide composite material
08/29/2012CN202406375U Circuit board processing structure
08/29/2012CN202398919U Automatic tin-immersion machine
08/29/2012CN102652147A Polymerizable compound and curable composition containing same
08/29/2012CN102652044A 回流炉 Reflow oven
08/29/2012CN102651946A Manufacturing process for step circuit of PCB (Printed Circuit Board)
08/29/2012CN102651945A Environment-friendly LED (Light-Emitting Diode) light bar circuit board and manufacturing method thereof
08/29/2012CN102651944A Wiring board and manufacturing method thereof
08/29/2012CN102131336B Circuit board and manufacture procedure thereof
08/29/2012CN102099193B Screen plate, interlayer insulation film, circuit board, active matrix circuit board, and image display apparatus
08/29/2012CN101990369B Method for manufacturing ceramic-based flexible circuit board
08/29/2012CN101977479B Electronic assembly and manufacturing method thereof
08/29/2012CN101914265B Non-halogen phosphorus-containing flame retardant high-frequency epoxy resin composition and application thereof to bonding sheet and copper-clad plate
08/29/2012CN101896036B Multilayer substrate and manufacturing method thereof
08/29/2012CN101878509B Electrically conductive paste, and electrical and electronic device comprising the same
08/29/2012CN101869008B Semiconductor device and multilayer wiring board
08/29/2012CN101859213B Making method of capacitor-type touch panel
08/29/2012CN101854775B Printed circuit board
08/29/2012CN101836515B Anisotropically conductive adhesive
08/29/2012CN101790288B Manufacturing method of novel printed circuit board
08/29/2012CN101790283B Printed wiring board
08/29/2012CN101772261B Multilayered printed wiring board
08/29/2012CN101768386B Ink and method adopting ink to prepare conductive line
08/29/2012CN101631425B Circuit board and coexistence wiring method thereof
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