| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/29/2013 | CN103121142A Adjusting device for guide rail angle of crest welder |
| 05/29/2013 | CN103121137A Soldering tin device |
| 05/29/2013 | CN103121134A Adjusting device for width between guide rails |
| 05/29/2013 | CN101990499B Method and apparatus for applying an accurate print pressure during production |
| 05/29/2013 | CN101754582B Method for mounting enhancing plate in printed circuit substrate |
| 05/29/2013 | CN101307174B Surface-mounting electronic component |
| 05/28/2013 | US8451617 Integrated circuit board |
| 05/28/2013 | US8450622 Multilayer wiring substrate and method of manufacturing the same |
| 05/28/2013 | US8449949 Compositions and methods for creating electronic circuitry |
| 05/28/2013 | US8448834 Board printing system |
| 05/28/2013 | US8448333 Method for manufacturing wiring board and method for manufacturing inkjet printhead substrate |
| 05/28/2013 | US8448332 Method and device for transporting electronic modules |
| 05/28/2013 | CA2520241C Metal base circuit board and its production process |
| 05/28/2013 | CA2491276C Procedure for brazing an electronic component onto an electronic board, procedure for repairing the board and facility for implementing the procedure |
| 05/23/2013 | WO2013073518A1 Carboxyl-containing resin, resin composition for use in solder resist, and manufacturing process for carboxyl-containing resin |
| 05/23/2013 | WO2013073440A1 Transfer substrate for forming metal wiring line and method for forming metal wiring line by means of said transfer substrate |
| 05/23/2013 | WO2013073427A1 Screen printer |
| 05/23/2013 | WO2013073426A1 Mask printing method and device |
| 05/23/2013 | WO2013073370A1 Metal film material production method, and metal film material using same |
| 05/23/2013 | WO2013072457A1 Embedded metal structures in ceramic substrates |
| 05/23/2013 | WO2013071864A1 Method for performing chip level electromagnetic interference reduction, and associated apparatus |
| 05/23/2013 | WO2013071795A1 Method for manufacturing rigid-flexible printed circuit board and the rigid-flexible printed circuit board |
| 05/23/2013 | WO2013071790A1 Method for preventing circuit board solder mask ink from blocking holes |
| 05/23/2013 | WO2013071519A1 Fabrication of three-dimensional printed circuit board structures |
| 05/23/2013 | WO2013071475A1 Aqueous phase pore sealing agent improving pcb coating oxidation-resistant and corrosion-resistant properties and method for using same |
| 05/23/2013 | US20130131769 Printed circuit board connection to feedthrough |
| 05/23/2013 | US20130131485 Tetrode for measuring bio-signals and method of manufacturing the same |
| 05/23/2013 | US20130130492 System and method for improving solder joint reliability in an integrated circuit package |
| 05/23/2013 | US20130130089 Low cost electrical terminals manufactured from conductive loaded resin-based materials |
| 05/23/2013 | US20130129916 Conductive pattern forming method and conductive pattern forming system |
| 05/23/2013 | US20130128487 Air cavity package configured to electrically couple to a printed circuit board and method of providing same |
| 05/23/2013 | US20130128472 Printed circuit board and manufacturing method thereof |
| 05/23/2013 | US20130127741 Touch panel and method for manufacturing the same |
| 05/23/2013 | US20130127480 Single substrate capacitive touch sensor with integrated dielectric and ground shield layer |
| 05/23/2013 | US20130126226 Method of making a support structure |
| 05/23/2013 | US20130126224 Printed circuit board and method of manufacturing the same |
| 05/23/2013 | US20130126223 Printed circuit board and method of manufacturing the same |
| 05/23/2013 | US20130126222 Method for producing an electrical multi-layer component and electrical multi-layer component |
| 05/23/2013 | US20130126221 Method for manufacturing layered circuit board, layered circuit board, and electronic device |
| 05/23/2013 | US20130126215 Printed circuit board and method for manufacturing the same |
| 05/23/2013 | US20130125393 Flip chip package for monolithic switching regulator |
| 05/23/2013 | US20130125392 Mounting of Components Using Solder Paste Fiducials |
| 05/23/2013 | US20130125391 Mounting apparatus, method of mounting electronic component, method of manufacturing substrate, and program |
| 05/23/2013 | DE10347035B4 Verfahren und Vorrichtung zum Erzeugen elektrisch leitender Strukturen auf einem Substrat für einen elektronischen Datenträger Method and device for producing electrically conductive structures on a substrate for an electronic data carrier |
| 05/23/2013 | DE102012110960A1 Kupfer-Umhüllungslaminat aus Metall und Verfahren zur Herstellung einer Metallkern-Schaltungsplatine dasselbe verwendend Copper-cladding laminate of metal and process for producing a metal-core circuit board using the same |
| 05/23/2013 | DE102011086898A1 Electric circuit for automatic gear box module of motor car, has connection pin that is integrally connected to pad in solder side and is arranged in solder meniscus such that it is not arranged protruding |
| 05/23/2013 | DE102011086707A1 Schaltungsanordnung für elektronische und/oder elektrische Bauteile Circuit arrangement for electronic and / or electrical components |
| 05/23/2013 | DE102011086546A1 Optoelectronic component i.e. high power-LED, and printed circuit board i.e. metal printed circuit board, arrangement for use in e.g. monitor, has fastening devices for fastening component to board, where one of devices has polymer-layer |
| 05/23/2013 | DE102009030249B4 Verfahren und Vorrichtung zum Laserlöten Method and apparatus for laser soldering |
| 05/23/2013 | DE102009011553B4 Verfahren zur Herstellung eines gegenüber elektrischem Strom isolierten Materials sowie dadurch hergestelltes isoliertes Material A method for producing an electric current as well as isolated material produced thereby isolated material |
| 05/23/2013 | DE102004032184B4 Laserstrahlbearbeitungsverfahren und Laserstrahlbearbeitungsmaschine bzw. -vorrichtung Laser beam machining method and laser processing machine |
| 05/23/2013 | CA2854034A1 Fabrication of three-dimensional printed circuit board structures |
| 05/22/2013 | EP2595462A2 Layered composite circuit with integrated components which are accessible from outside |
| 05/22/2013 | EP2595461A1 Assembly with a circuit board and a connection element |
| 05/22/2013 | EP2594662A1 Aqueous composition for etching of copper and copper alloys |
| 05/22/2013 | EP2593980A1 An oled device and a method of manufacturing the same |
| 05/22/2013 | CN202949656U Protective cover of connector |
| 05/22/2013 | CN202949655U Welding supporting plate for printed circuit board |
| 05/22/2013 | CN202949654U Wave-soldering jig in wave-soldering furnace |
| 05/22/2013 | CN202949653U Wave-soldering bracket |
| 05/22/2013 | CN202949652U Machine platform structure special for light emitting diode (LED) chip mounter |
| 05/22/2013 | CN202949651U Linear guideway transmission device of light emitting diode (LED) chip mounter |
| 05/22/2013 | CN202949650U Automatic adding device of antioxidant liquid medicine |
| 05/22/2013 | CN202949649U Solder mask nail bed for circuit board |
| 05/22/2013 | CN202949648U Heavy copper wire decontamination ultrasonic vibration filtration processing device |
| 05/22/2013 | CN202949647U Circuit board locating device |
| 05/22/2013 | CN202949646U Production die and production device for preparing organic ceramic circuit board |
| 05/22/2013 | CN202945324U PCB (Printed Circuit Board) copper immersion line medicinal liquid addition detecting and temperature-control system |
| 05/22/2013 | CN202943348U Wave soldering nozzle choke flow device |
| 05/22/2013 | CN1931947B Adhesive composition for circuit connection |
| 05/22/2013 | CN1910013B Production method for pattern-worked porous molding fluororesin or nonwoven fabric |
| 05/22/2013 | CN103120038A Structural body and wiring substrate |
| 05/22/2013 | CN103120037A Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
| 05/22/2013 | CN103120034A Multi-cavity wiring board and method for manufacturing same |
| 05/22/2013 | CN103119710A Method for manufacturing package substrate for semiconductor element mounting |
| 05/22/2013 | CN103119109A Curable composition for inkjet, and method for producing electronic component |
| 05/22/2013 | CN103119082A Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers |
| 05/22/2013 | CN103118507A Production method of multilayer printed circuit board |
| 05/22/2013 | CN103118506A Electroplating hole filling method for via hole on bonding pad |
| 05/22/2013 | CN103118505A Rigid-flexible board and method for manufacturing same |
| 05/22/2013 | CN103118504A Hot wind heating device of printed circuit board (PCB) repair work station |
| 05/22/2013 | CN103118503A Image pickup telescopic device used for ball grid array (BGA) repair workstation |
| 05/22/2013 | CN103118502A Mechanism facilitating installation of ball grid array (BGA) repair workstation hot wind nozzle |
| 05/22/2013 | CN103118501A Wave crest nozzle installation structure |
| 05/22/2013 | CN103118500A Printed circuit board (PCB) clamping conveying assembly |
| 05/22/2013 | CN103118499A Preheating hot wind unit used for crest welder |
| 05/22/2013 | CN103118498A Imaging system used for ball grid array (BGA) repair work |
| 05/22/2013 | CN103118497A Ball grid array (BGA) repairing workstation structure with higher positional accuracy |
| 05/22/2013 | CN103118496A Method for improving solder-mask cracking in heavy copper printed circuit boards |
| 05/22/2013 | CN103118495A PCB (printed circuit board) manufacturing process |
| 05/22/2013 | CN103118494A Pressing runner plate of electric press for pressing processing of printed circuit boards |
| 05/22/2013 | CN103118493A Production method of filler blocks in production of rigid-flex printed circuit boards |
| 05/22/2013 | CN103118492A Aluminum substrate, method for manufacturing same and LED light source with aluminum substrate |
| 05/22/2013 | CN103118489A Sunken soft and hard composite panel and manufacturing method thereof |
| 05/22/2013 | CN103118487A Metal-based circuit board with ultrahigh heat-conducting property and preparation method thereof |
| 05/22/2013 | CN103118486A Aluminum based circuit board with component plug holes and manufacturing method of aluminum based circuit board |
| 05/22/2013 | CN103118485A Printed circuit board for testing electric-resistant chemical migration performances |
| 05/22/2013 | CN103118482A Circuit board with quality identification tag and identification method thereof |
| 05/22/2013 | CN103118481A 印刷配线板 A printed wiring board |
| 05/22/2013 | CN103117228A Manufacturing method for COB (chip on board) packaging aluminum substrate |