Patents for H05K 1 - Printed circuits (98,583)
11/1998
11/25/1998CN1199956A High frequency amplifier with guard circuit and radio wave transmission apparatus including the same
11/25/1998CN1199910A Printed circuit transformer hybrids for mixers
11/25/1998CN1199874A Positive-tone photoimageable crosslinkable coating
11/25/1998CN1040921C Conductive polymer compositions
11/25/1998CN1040868C Partially crystallizable low temperature melting glass
11/24/1998US5841686 Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate
11/24/1998US5841640 IC socket
11/24/1998US5841638 Stacked memory for flight recorders
11/24/1998US5841635 Flexible printed circuit for split keyboard and method of assembly
11/24/1998US5841620 To protect telephone communication equipment from power/transient surges
11/24/1998US5841414 Liquid crystal display device
11/24/1998US5841202 EMI prevention circuit for a car-mounted electronic control unit
11/24/1998US5841190 High density multi-layered printed wiring board, multi-chip carrier and semiconductor package
11/24/1998US5841075 Method for reducing via inductance in an electronic assembly and article
11/24/1998US5841074 For distributing power from a power source
11/24/1998US5840432 Composite metal powder comprising particles of non-noble metal having flat shape covered with noble metal and having layer of mixture of the two between
11/24/1998US5840417 A multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive; useful in the assembly of multi-chip modules and multilayer electronic devices
11/24/1998US5840402 Metallized laminate material having ordered distribution of conductive through holes
11/24/1998US5840382 Ceramic substrate, glass adhesive layer; nonwarping, noncracking; capacitors, resistors
11/24/1998US5840218 Resistance material composition
11/24/1998US5839193 Method of making laminated structures for a disk drive suspension assembly
11/24/1998US5839188 Method of manufacturing a printed circuit assembly
11/24/1998CA2142611C A multiple layer printed circuit board
11/24/1998CA2064784C Capacitor laminate for printed circuit board
11/19/1998WO1998052393A1 Surface mount power supply device
11/19/1998WO1998052391A1 Methods of fixturing flexible circuit substrates and a processing carrier, and processing a flexible circuit
11/19/1998WO1998052384A2 Flexible lighting element circuit and method of manufacturing the same
11/19/1998WO1998051998A1 Measuring system
11/19/1998WO1998051756A1 Adhesive, method for bonding, and assemblies of mounted boards
11/19/1998WO1998051485A1 Very ultra thin conductor layers for printed wiring boards
11/19/1998DE19821702A1 Instrument panel for vehicle
11/19/1998DE19821226A1 Resin composition useful as electrically resistive element or moisture resistant coating
11/19/1998DE19720661A1 Substrate for circuit board
11/19/1998DE19720196A1 Messwerk Measuring equipment
11/19/1998DE19720167A1 Remote electrical component connection structure for automatic transmission
11/19/1998CA2289733A1 Adhesive, method for bonding, and assemblies of mounted boards
11/19/1998CA2289628A1 Very ultra thin conductor layers for printed wiring boards
11/18/1998EP0878987A1 Printed circuit board
11/18/1998EP0878985A2 Electronic part for mounting on a substrate
11/18/1998EP0878984A1 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
11/18/1998EP0878355A2 Method and apparatus for dispensing fluid on a non-planar substrate
11/18/1998EP0780005B1 Ic support element
11/18/1998EP0775375B1 Low cross-talk network connector
11/18/1998CN1199538A Magnetic prepreg, its mfg. method and printed wiring board employing said prepreg
11/18/1998CN1199079A Laminate of liquid crystal polyester resin composition
11/18/1998CN1199057A Soldifiable resin composition, solidified resin and resistance body
11/17/1998US5838554 Small form factor power supply
11/17/1998US5838549 Memory module and an IC card
11/17/1998US5838547 Electrical safety barrier
11/17/1998US5838546 Mounting structure for a semiconductor circuit
11/17/1998US5838519 Printed circuit board, magnetic disk apparatus with the printed circuit board, and method for connecting the printed circuit board
11/17/1998US5838412 Liquid crystal display device assembled by flip chip technology comprising a folded multi-layered flexible driving circuit substrate
11/17/1998US5838400 Liquid crystal display device with reduced frame portion surrounding display area
11/17/1998US5838070 Apparatus having a substrate and electronic circuit solder-connected with the substrate
11/17/1998US5838069 Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same
11/17/1998US5838064 For cooling an electronic device
11/17/1998US5837978 For controlling an application of radiation to a workpiece in a cavity
11/17/1998US5837940 Conductive surface and method with nonuniform dielectric
11/17/1998US5837624 Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom
11/17/1998US5837609 Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part
11/17/1998US5837427 Sequestering stacking dielectric and conductors
11/17/1998US5837380 Multilayer structures and process for fabricating the same
11/17/1998US5837368 Insulating film with improved punching characteristics and lead frame using the same
11/17/1998US5837356 Impact strength, semiconductor housing package
11/17/1998US5837155 Insulating resin composition for build-up by copper foil lamination and method for production of multilayer printed circuit board using the composition
11/17/1998US5836790 Radio telephone connector
11/15/1998CA2232172A1 Method and apparatus for dispensing fluid on a non-planar substrate
11/12/1998WO1998051137A1 Method for mounting a cooling element on an apparatus and such a cooling element
11/12/1998WO1998051136A1 Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid
11/12/1998WO1998051135A1 Improvements in the manufacturing processes of service boxes and their parts
11/12/1998WO1998050954A1 Stacked semiconductor devices, particularly memory chips
11/12/1998WO1998050952A1 Ball grid array semiconductor package and method for making the same
11/12/1998WO1998050903A1 Board for mounting display element
11/12/1998WO1998050601A1 Metal paste and method for production of metal film
11/12/1998WO1998050255A2 Sensor circuit, specially for an automobiles
11/12/1998WO1998050249A2 Detection circuit and corresponding carrier
11/12/1998WO1998050218A1 Extruded core laminates for circuit boards
11/12/1998DE19819217A1 Electronic component base plate
11/12/1998DE19818751A1 Multi-layer electric circuit board
11/12/1998DE19739581C1 Electric device esp electric toothbrush
11/12/1998DE19719763A1 Micro-hybrid circuit using multi-chip module
11/12/1998DE19719455A1 Sensorschaltung, insbesondere für Kraftfahrzeuge Sensor circuit, especially for motor vehicles
11/12/1998DE19719449A1 Electrical connection method for circuit boards
11/12/1998DE19719235A1 Verfahren zur Kontaktierung wenigstens einer Leiterplatte oder wenigstens eines Stanzgitters und wenigstens eines Hybrids A process for contacting at least a printed circuit board or at least one punched grid and at least a hybrid
11/12/1998DE19718835A1 Electrohydraulic pressure regulating device
11/12/1998CA2286030A1 Improvements in the manufacturing processes of service boxes and their parts
11/11/1998EP0877539A1 Improvements in the manufacturing processes of service boxes and their parts
11/11/1998EP0877452A2 Laser sub-mount
11/11/1998EP0877350A1 Board for mounting display element
11/11/1998EP0876743A2 Control device, especially for a motor vehicle
11/11/1998EP0876691A1 Solder element
11/11/1998EP0876619A1 Machine for the electric test of printed circuits with adjustable position of the sound needles
11/11/1998EP0876306A1 Method of applying a silver layer to a glass substrate
11/11/1998EP0859686A4 Fabricating interconnects and tips using sacrificial substrates
11/11/1998EP0679128B1 An apparatus forming a junction box comprising a shunt busbar disposed therein
11/11/1998CN1198873A Method for plating independent conductor circuit
11/11/1998CN1198840A Method for transferring conductor pattern to film carrier, mask used for the method and film carrier
11/11/1998CN1198594A 多芯片模块 A multi-chip module
11/11/1998CN1198593A 多芯片模块 A multi-chip module
11/11/1998CN1198540A Display device