Patents for H05K 1 - Printed circuits (98,583)
01/1999
01/05/1999US5855063 Method of making contact pad having metallically anchored elastomeric electrical contacts
01/05/1999CA2056789C A process for the manufacture of a fibrous preform formed of refractory fibers for producing a composite material article
12/1998
12/30/1998WO1998059286A1 Long-lasting flexible circuitry
12/30/1998WO1998058825A2 Window wiper motor system for an automotive vehicle
12/30/1998EP0888038A1 Surface mounted electronic parts and manufacturing method therefor
12/30/1998EP0888036A1 LCD assembly with reduced thickness and method for assembling the same
12/30/1998EP0887856A1 Method of manufacturing electronic components
12/30/1998EP0887766A2 IC card having a slit for protecting an IC module from an external stress
12/30/1998EP0887734A2 High speed electrical signal interconnect structure
12/30/1998EP0887234A1 Assembly for top of vehicle steering column and manufacturing procedure
12/30/1998EP0887230A1 Steering column switching combination for automotive vehicle
12/30/1998EP0887132A2 Copper fine powder and method for preparing the same
12/30/1998EP0886996A2 Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation
12/30/1998EP0886991A1 Conducting foil for conductively connecting electric and/or electronic components
12/30/1998EP0886894A2 Contact carriers (tiles) for populating larger substrates with spring contacts
12/30/1998EP0886872A1 Method of producing a fibre-reinforced insulating body
12/30/1998CN1203610A Microporous polytetrafluoroethylene (PTFE) bodies with filler
12/30/1998CN1203511A Circuit substrate, circuit-formed suspension substrate, and production method thereof
12/30/1998CN1203454A 多芯片模块 A multi-chip module
12/30/1998CN1203430A Conductive paste, its manufacturing method, and printed wiring board using same
12/30/1998CN1203153A IC card having slit protecting IC module from external stress
12/30/1998CN1203150A Laminate produced by using vegetable oil modified phenolic resin
12/30/1998CN1041479C Component module
12/30/1998CN1041470C Organic chip carriers for wire bond-type chips
12/30/1998CA2294286A1 Long-lasting flexible circuitry
12/30/1998CA2293218A1 Window wiper motor system for an automotive vehicle
12/30/1998CA2241612A1 Mechanism for connecting printed circuit boards of separate devices
12/29/1998US5854740 Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor
12/29/1998US5854724 Magnetic head suspension assembly
12/29/1998US5854534 For coupling an integrated circuit chip to a multichip module substrate
12/29/1998US5854507 Multiple chip assembly
12/29/1998US5854371 Phosphorus-modified epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a curing agent
12/29/1998US5854361 Process for preparing phosphorus-modified epoxy resins
12/29/1998US5854126 Method for forming metallization in semiconductor devices with a self-planarizing material
12/29/1998US5853907 Aromatic polyamide film, method for producing the same, and magnetic recording medium and solar cell using the same
12/29/1998US5852871 Method of making raised contacts on electronic components
12/29/1998US5852870 Method of making grid array assembly
12/23/1998WO1998058390A1 Resistance wiring board and method for manufacturing the same
12/23/1998WO1998058372A1 Storage medium having electronic circuit and method for manufacturing thereof
12/23/1998EP0886462A2 Device for housing electrical components
12/23/1998EP0886461A1 Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
12/23/1998EP0885458A1 Method for making electrical connections
12/23/1998EP0843621A4 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
12/23/1998EP0573534B1 Powder coating method for producing circuit board laminae and the like
12/23/1998CN1202977A Flexible coil winding structure of flyback transformer and manufacturing process thereof
12/23/1998CN1202794A Circuit board with primary and secondary through holes
12/23/1998CN1202631A Liquid-crystal display panel and method of inspecting liquid-crystal display panel
12/22/1998US5852725 PCI/ISA bus single board computer card/CPU card and backplane using eisa bus connectors and eisa bus slots
12/22/1998US5852548 Enhanced heat transfer in printed circuit boards and electronic components thereof
12/22/1998US5852397 Electrical devices
12/22/1998US5852391 Microwave/millimeter-wave functional module package
12/22/1998US5852324 Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes
12/22/1998US5852257 Optical module with fluxless laser reflow soldered joints
12/22/1998US5851681 Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board
12/22/1998US5851646 Prepreg, process for producing the same and printed circuit substrate/board using the same
12/22/1998US5850693 Method of manufacturing an array of surface mount contacts
12/22/1998US5850677 To a circuit board
12/17/1998WO1998057396A1 Contact pin
12/17/1998WO1998057387A1 Orthogonally mounted substrate based resonator
12/17/1998WO1998057357A2 Multiple board package employing solder balls and fabrication method and apparatus
12/17/1998WO1998057298A1 Method for making a contactless smart card
12/17/1998WO1998057226A2 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate
12/17/1998WO1998056987A1 Heat-resistant fiber paper
12/17/1998WO1998039732A3 Chip card module and chip card comprising the latter
12/17/1998DE19724909A1 Semiconductor device with mount for its securing to PCB
12/17/1998CA2293460A1 Method for making a contactless smart card
12/17/1998CA2292671A1 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate
12/17/1998CA2289538A1 Orthogonally mounted substrate based resonator
12/16/1998EP0884775A1 Electronic component and manufacturing method therefor
12/16/1998EP0884128A1 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
12/16/1998EP0883980A1 High speed depaneling apparatus and method
12/16/1998EP0883977A1 Non-ohmic energy coupling for cross talk reduction
12/16/1998EP0883906A1 Electrical and electromagnetic apparatuses using laminated structures having thermoplastic elastomeric and conductive layers
12/16/1998EP0883880A2 Thermoplastic elastomeric substrate material with tunable dielectric properties and laminates thereof
12/16/1998EP0883862A1 Integrated circuit card comprising a conductor pattern made of a conductive polymer
12/16/1998EP0852897A4 Method for surface mounting a heatsink to a printed circuit board
12/16/1998EP0583407B1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
12/16/1998CN1202276A Circuit board for mounting electronic parts
12/16/1998CN1202083A Assembly containing modular jack and light emitting diode
12/16/1998CN1202010A Static electricity removing structure for portable electronic devices
12/16/1998CN1201989A High-voltage variable resistor
12/16/1998CN1041209C 聚合薄膜 Polymeric films
12/15/1998US5850171 Process for manufacturing resistor-networks with higher circuit density, smaller input/output pitches, and lower precision tolerance
12/15/1998US5850047 Production of copper powder
12/15/1998US5849932 Bismaleimide compound and process for producing the same
12/15/1998US5849857 Production method for photo-sensitive resin and liquid photo-sensitive resin composition
12/15/1998US5849623 Method of forming thin film resistors on organic surfaces
12/15/1998US5849460 Photosensitive resin composition and method for using the same in manufacture of circuit boards
12/15/1998US5849397 Aromatic polyimide film and polyimide/copper foil composite sheet
12/15/1998US5849396 Multilayer electronic structure and its preparation
12/15/1998US5849355 Electroless copper plating
12/15/1998US5849221 Raw material for producing powder of indium-tin oxide aciculae and method of producing the raw material, powder of indium-tin oxide aciculae and method of producing the powder, electroconductive paste and light-transmitting electroconductive film
12/15/1998US5849170 Electroless/electrolytic methods for the preparation of metallized ceramic substrates
12/15/1998US5848466 Method for forming a microelectronic assembly
12/15/1998US5848462 Method for mounting an electronic component on a wiring substrate and an illuminating switch unit using this mounting method
12/15/1998CA2134257C Ball grid array plastic package
12/10/1998WO1998056018A2 Planar inductive devices
12/10/1998WO1998056011A1 Insulating materials containing cycloolefinic polymers
12/10/1998WO1998055669A2 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
12/10/1998WO1998055547A1 Liquid crystalline polyester compositions containing carbon black