| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/12/2005 | US20050098868 Multi-chips module assembly package |
| 05/12/2005 | US20050098857 Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
| 05/12/2005 | US20050098775 Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment |
| 05/12/2005 | US20050098613 Method for diffusion bond welding for use in a multilayer electronic assembly |
| 05/12/2005 | US20050098607 Method and structure for implementing column attach coupled noise suppressor |
| 05/12/2005 | US20050098533 Method and structure for substrate having inserted electrodes for flat display device and the device using the structure |
| 05/12/2005 | US20050098348 High-frequency signal transmitting device |
| 05/12/2005 | US20050098347 Multi-layer printed circuit board and fabricating method thereof |
| 05/12/2005 | US20050098346 Reducing noise effects in circuit boards |
| 05/12/2005 | US20050098335 Clamp remover |
| 05/12/2005 | US20050098318 High-temperature circuits |
| 05/12/2005 | US20050098254 Method and apparatus for determining processing size of bonding material |
| 05/12/2005 | US20050097988 Generating an aerosol including a nickel metal precursor and moving the droplets through a heating zone to form nickel particles; while in the aerosol stream forming a coating on the particles, the coating comprising a material is different than the nickel-containing material; flat panel displays |
| 05/12/2005 | DE4335879B4 Anordnung zur Qualitätskontrolle und -überwachung von durchkontaktierten Mehrlagen-Leiterplatten Arrangement for quality control and monitoring of plated through multi-layer printed circuit boards |
| 05/12/2005 | DE10392578T5 System und Verfahren zur Herstellung von gedruckten Schaltungsplatinen unter Verwendung von nichtgleichmässig modifizierten Bildern System and method for manufacture of printed circuit boards using non-uniformly modified images |
| 05/12/2005 | DE10358149B3 Process for contact-free transport and treatment of flat material by wet chemical and/or electrolytic processing useful in the transport and treatment, e.g. cleaning and etching, of conductive films and plates |
| 05/12/2005 | CA2542132A1 Method of fabricating an rf substrate with selected electrical properties |
| 05/11/2005 | EP1530411A1 Circuit assembly, producing method of the same, distribution unit and bus bar substrate |
| 05/11/2005 | EP1530401A2 Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same |
| 05/11/2005 | EP1530145A2 Marking method |
| 05/11/2005 | EP1529812A1 Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto |
| 05/11/2005 | EP1529796A1 Photosensitive ceramic compositions containing polycarbonate polymers |
| 05/11/2005 | EP1529419A1 An electronic product, a body and a method of manufacturing |
| 05/11/2005 | EP1529020A1 The use of zeolites in preparing low temperature ceramics |
| 05/11/2005 | EP1182659B1 Magnetic tape cassette |
| 05/11/2005 | CN2699625Y Surface adhesive ground spring leaf |
| 05/11/2005 | CN1615676A Circuit-component-containing module |
| 05/11/2005 | CN1615560A Grouped element transmission channel link termination assemblies |
| 05/11/2005 | CN1615559A Grouped element transmission channel link |
| 05/11/2005 | CN1615444A Flexible test head interface |
| 05/11/2005 | CN1615070A Manufacture of PCB with resistors embedded |
| 05/11/2005 | CN1615069A Multi-layer printed circuit board and fabricating method thereof |
| 05/11/2005 | CN1615068A Flexible electric circuit board |
| 05/11/2005 | CN1615067A Differential wire assembling method for eliminating high speed board interferes |
| 05/11/2005 | CN1615055A Conductive unit of display device and organic electric excited luminous display device therewith |
| 05/11/2005 | CN1615050A Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same |
| 05/11/2005 | CN1614757A High density microvia substrate with high wireability |
| 05/11/2005 | CN1614713A Stacked memory, memory module and memory system |
| 05/11/2005 | CN1614699A Circuit board transmitting high frequency signal |
| 05/11/2005 | CN1201649C Improved structure for packing image sensor |
| 05/11/2005 | CN1201646C Protective hood for circuit board and circuit with protective hood |
| 05/11/2005 | CN1201643C 电子电路组件 Electronic circuit assembly |
| 05/11/2005 | CN1201642C Printed circuit plate and its mfg. method |
| 05/11/2005 | CN1201641C Duplicated material and making method thereof, and distribution substrate made of same |
| 05/11/2005 | CN1201615C High-frequency circuit board and high-frequency antenna switch module using same |
| 05/11/2005 | CN1201440C Connection terminal and method for mounting the same terminal on electric circuit board |
| 05/11/2005 | CN1201348C Electronic device and manufacture thereof |
| 05/11/2005 | CN1201340C Flat flexible electric cable with earthing conductor |
| 05/11/2005 | CN1201204C Method for forming pattern of non-photo-imaing ceramic strip |
| 05/11/2005 | CN1201161C Probe card for probing wafers with raised contact elements |
| 05/11/2005 | CN1200976C Heat resistant compsns. |
| 05/11/2005 | CN1200808C Polyester film and its producing method |
| 05/10/2005 | US6891967 Systems and methods for detecting defects in printed solder paste |
| 05/10/2005 | US6891810 Wireless access system and associated method using multiple modulation formats in TDD frames according to subscriber service type |
| 05/10/2005 | US6891732 Multilayer circuit board and semiconductor device using the same |
| 05/10/2005 | US6891731 Crosstalk cancellation for integrated circuit package configuration |
| 05/10/2005 | US6891729 Memory module |
| 05/10/2005 | US6891463 Mounting structure of fuse connection terminals on board |
| 05/10/2005 | US6891272 Multi-path via interconnection structures and methods for manufacturing the same |
| 05/10/2005 | US6891258 Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit |
| 05/10/2005 | US6891200 Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
| 05/10/2005 | US6891198 Film carrier tape for mounting an electronic part |
| 05/10/2005 | US6891190 Organic semiconductor device and method |
| 05/10/2005 | US6891109 Monolithic ceramic substrate and method for making the same |
| 05/10/2005 | US6890792 Method of formation of a capacitor with a solid electrolyte layer comprising an organic semiconductor, and method of production of circuit board |
| 05/10/2005 | US6890663 Process of forming a pattern on a substrate |
| 05/10/2005 | US6890641 Low dielectric materials and methods of producing same |
| 05/10/2005 | US6890636 Thermally stable, non-woven, fibrous paper, derivatives thereof, and methods for manufacturing the same |
| 05/10/2005 | US6890635 Polymeric matrix consisting of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes |
| 05/10/2005 | US6890629 Integrated thin film capacitor/inductor/interconnect system and method |
| 05/10/2005 | US6890626 Imide-benzoxazole polycondensate and process for producing the same |
| 05/10/2005 | US6890449 Method for manufacturing printed-circuit board |
| 05/10/2005 | US6890202 Connector for module |
| 05/10/2005 | US6890184 Electrical connector for conveying signals between two circuit boards |
| 05/10/2005 | US6889738 Method and apparatus for determining processing size of bonding material |
| 05/10/2005 | US6889432 First electric conductor wiring meets requirement of high-density fine wiring because it is formed by plating; second electric conductor wiring is formed by subtractive method, thus, flexing characteristic can be obtained |
| 05/10/2005 | US6889431 Manufacturing method of electronic circuit including multilayer circuit board |
| 05/10/2005 | US6889426 To prevent dimensional change during heating and rolling, circuit board is heated in its rolled state; spacers are used to prevent uncured thermosetting resin from contacting the wired circuit board which is wound over it |
| 05/10/2005 | CA2266713C Electric device, electric apparatus of lighting device |
| 05/06/2005 | WO2005041626A1 A method of producing a conductive layer on a substrate |
| 05/06/2005 | WO2005041625A1 Electronic component, for example position sensor |
| 05/06/2005 | WO2005041431A1 Full duplex transmission method |
| 05/06/2005 | WO2005041352A1 Device with integrated antenna for encapsulation of radio electronics and a method for fabrication of such devices |
| 05/06/2005 | WO2005041213A1 Conductive paste |
| 05/06/2005 | WO2005041002A1 Circuit security |
| 05/06/2005 | WO2005040277A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 05/06/2005 | WO2005010990A3 Memory stack using flexible circuit and low-profile contacts |
| 05/06/2005 | CA2543316A1 Circuit security |
| 05/06/2005 | CA2540552A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 05/05/2005 | US20050097583 Complex electronic device having circuit board for operation button control and device units connected by bent or folded flexible flat cables |
| 05/05/2005 | US20050097381 Clock circuitry on plural integrated circuits |
| 05/05/2005 | US20050097249 Memory systems and methods |
| 05/05/2005 | US20050097218 System, method & device for tuning a switched transmission line for ethernet local area network-on-motherboard (LOM) |
| 05/05/2005 | US20050096429 Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto |
| 05/05/2005 | US20050096409 Ink composition and method for use thereof in the manufacturing of electrochemical sensors |
| 05/05/2005 | US20050095906 Socket connector with reliable retaining means |
| 05/05/2005 | US20050095878 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
| 05/05/2005 | US20050095866 Method for forming patterned conductive film, electrooptical device, and electronic appliance |
| 05/05/2005 | US20050095748 Method for the selective surface treatment of planar workpieces |
| 05/05/2005 | US20050095747 Method of RFIC die-package configuration |