Patents for H05K 1 - Printed circuits (98,583) |
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06/08/2005 | CN1205662C Module with built-in electronic elements and method of manufacture thereof |
06/08/2005 | CN1205512C Pattern, wiring, circuit board, electron source and image forming device mfg. method |
06/08/2005 | CN1205257C Lowly-heat-expandable laminated board |
06/07/2005 | US6904236 Camera and photographing lens barrel |
06/07/2005 | US6903938 Printed circuit board |
06/07/2005 | US6903935 Memory card with a static electricity conducting board |
06/07/2005 | US6903934 Circuit board construction for use in small form factor fiber optic communication system transponders |
06/07/2005 | US6903919 Multilayer ceramic electronic component and mounting structure and method for the same |
06/07/2005 | US6903916 Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection |
06/07/2005 | US6903794 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
06/07/2005 | US6903700 High frequency circuit substrate and method for forming the same |
06/07/2005 | US6903634 Method of detuning resonant frequencies of a power distribution system |
06/07/2005 | US6903561 Circuitry for measuring mechanical stress impressed on a printed circuit board |
06/07/2005 | US6903541 Film-based microwave and millimeter-wave circuits and sensors |
06/07/2005 | US6903443 Semiconductor component and interconnect having conductive members and contacts on opposing sides |
06/07/2005 | US6903440 For circuit board mounting, which has a predetermined number of terminals mainly represented by a semiconductor active device such as an integrated circuit; particularly comprising a function for attenuating a high frequency current |
06/07/2005 | US6903175 Polymer synthesis and films therefrom |
06/07/2005 | US6902872 Microelectronics having circuit on multilayers including electrconductive laminates forming connection structures; print heads |
06/07/2005 | US6902824 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
06/07/2005 | US6902433 Connector receptacle |
06/07/2005 | US6902261 Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly |
06/07/2005 | US6902099 Method for manufacturing a circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and a method for manufacturing a magnetic head using the same |
06/07/2005 | US6902097 Electrically conductive wire |
06/07/2005 | US6901852 Uphill screen printing in the manufacturing of microelectronic components |
06/07/2005 | CA2357628C Oscillator and electronic apparatus using the same |
06/07/2005 | CA2328327C Plug connector |
06/07/2005 | CA2283963C Piezo-oscillator |
06/02/2005 | WO2005051059A1 Rough contacts |
06/02/2005 | WO2005051058A1 Circuit board and method for manufacturing same |
06/02/2005 | WO2005050877A1 Compact optical transceivers for host bus adaptors |
06/02/2005 | WO2005050780A1 Mobile communication terminal |
06/02/2005 | WO2005050733A1 Wiring structure for high-frequency wave, method for forming wiring structure for high-frequency wave, and method for shaping high-frequency signal waveform |
06/02/2005 | WO2005050708A2 Stair step printed circuit board structures for high speed signal transmissions |
06/02/2005 | WO2005050673A1 Functional paste |
06/02/2005 | WO2005050546A2 Acoustic wave touch detecting apparatus |
06/02/2005 | WO2005050227A1 Non-rigid conductor link measurement sensor and method for the production thereof |
06/02/2005 | WO2005011343A3 Circuit board with embedded components and method of manufacture |
06/02/2005 | WO2004095603A3 Method of producing membrane electrode assemblies |
06/02/2005 | WO2004071141A3 Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus |
06/02/2005 | US20050119381 Thermosetting resin composition and laminates and circuit board substrates made by using the same |
06/02/2005 | US20050118978 Microwave filter distributed on circuit board of wireless communication product |
06/02/2005 | US20050118910 Base material for laminate and process for producing the same |
06/02/2005 | US20050118846 Power connector |
06/02/2005 | US20050118750 Wiring board sheet and its manufacturing method,multilayer board and its manufacturing method |
06/02/2005 | US20050118438 Process for preparing metal-coated aromatic polyimide film |
06/02/2005 | US20050117835 Techniques for joining an opto-electronic module to a semiconductor package |
06/02/2005 | US20050117833 Optical transmission substrate, method for manufacturing optical transmission substrate and optoelectronic integrated circuit |
06/02/2005 | US20050117763 Hearing aid or similar audio device and method for producing a hearing aid |
06/02/2005 | US20050117351 Hybrid illuminator |
06/02/2005 | US20050117334 Light emitting device |
06/02/2005 | US20050117314 Assembly structure for hiding electronic components |
06/02/2005 | US20050117312 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
06/02/2005 | US20050117302 Module structure and module comprising it |
06/02/2005 | US20050117257 Method to form electrostatic discharge protection on flexible circuits |
06/02/2005 | US20050116387 Component packaging apparatus, systems, and methods |
06/02/2005 | US20050116339 Semiconductor device and method of fabricating the same, electronic module, together with electronic instrument |
06/02/2005 | US20050116332 Method and apparatus for molding module electronic devices and a module electronic device molded thereby |
06/02/2005 | US20050116330 Semiconductor module and method for mounting the same |
06/02/2005 | US20050116328 Substrate and method of manufacture thereof |
06/02/2005 | US20050116299 Component packaging apparatus, systems, and methods |
06/02/2005 | US20050116239 Circuit interconnect for optoelectronic device |
06/02/2005 | US20050116235 Illumination assembly |
06/02/2005 | US20050116224 Circuit board having test coupon and method for evaluating the circuit board |
06/02/2005 | US20050116203 Conductive composition, conductive film, and process for the formation of the film |
06/02/2005 | US20050116202 Printing of organic conductive polymers containing additives |
06/02/2005 | US20050116013 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers |
06/02/2005 | US20050115440 Granular matter filled weapon guidance electronics unit |
06/02/2005 | DE3913966B4 Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung Dispersion adhesive for electroless plating, as well as use for the preparation of a printed circuit |
06/02/2005 | DE10354118A1 Verfahren zur Herstellung von Leiterplatten und Leiterplatte Process for the preparation of printed circuit boards and printed circuit board |
06/02/2005 | DE10352920A1 Verfahren zur Befestigung von Flachbandkabelsystemen A method of securing the ribbon cable systems |
06/02/2005 | DE10351209A1 Unfired adhering ceramic foil used in multiple layer ceramic applications comprises an unfired ceramic foil and an adhesive layer |
06/02/2005 | DE10348909A1 Filter element for filtering electromagnetic waves, especially bandpass filter or band blocking filter, has resonator held at distance from contacting structure in recess in circuit board by suitable attachment arrangement |
06/02/2005 | DE10348421A1 Betriebsschaltung für Lampe mit Kühlkörper Operating circuit for lamp heatsink |
06/02/2005 | DE102004053680A1 Hybridbeleuchtungskörper Hybrid Lighting |
06/02/2005 | DE102004047007A1 Keramiksubstrat für elektronische Dünnschichtbauelemente, Verfahren für das Herstellen des Substrats und elektronisches Dünnschichtbauelement unter Verwendung des Substrats Ceramic substrates for electronic thin film device, method for manufacturing the substrate and electronic thin film device using the substrate |
06/02/2005 | DE102004030588A1 Verbindungsmaterialschablone und Verfahren zur Verwendung Connecting material mask and method of using |
06/02/2005 | CA2546047A1 Independently adjustable circuit board carrier |
06/01/2005 | EP1536673A1 Composite multi-layer substrate and module using the substrate |
06/01/2005 | EP1536672A1 Circuit board device and method for board-to-board connection |
06/01/2005 | EP1536553A1 Voltage controlled oscillator |
06/01/2005 | EP1536435A2 Printed circuit transformer |
06/01/2005 | EP1536372A1 Method of manufacturing data carriers and the data carrier obtained by this method |
06/01/2005 | EP1535954A1 Base film for membrane switch and membrane switch |
06/01/2005 | EP1535498A1 Controlled depth etched dielectric film |
06/01/2005 | EP1535372A1 Electrical socket |
06/01/2005 | EP1535162A1 Memory device supporting a dynamically configurable core organisation |
06/01/2005 | EP1535093A1 Printed circuit board comprising electrical conductor paths and means for electro-optical and/or opto-electrical conversion |
06/01/2005 | EP1534797A1 Aqueous formaldehyde-free composition and fiberglass insulation including the same |
06/01/2005 | EP1534788A1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
06/01/2005 | EP1421618B1 Power electronics component |
06/01/2005 | EP1125482B1 Stacked circuit board assembly adapted for heat dissipation |
06/01/2005 | EP1116424B1 Electronic assembly comprising a sole plate forming a heat sink |
06/01/2005 | CN2703295Y LED light source module for mark plate |
06/01/2005 | CN1623229A High-frequency module and its manufacturing method |
06/01/2005 | CN1622559A Portable terminal set |
06/01/2005 | CN1622448A Voltage controlled oscillator small in reduction of inductance and Q |
06/01/2005 | CN1622315A High performance chip carrier substrate |
06/01/2005 | CN1204793C A printed circuit board assembly with improved bypass decoupling for BGA packages |
06/01/2005 | CN1204791C Perforated copper foil excellent in laser perforating and production method therefor |
06/01/2005 | CN1204790C Lead frame and manufacture method thereof, and manufacture method of heat-conducting substrate |