Patents for H05K 1 - Printed circuits (98,583)
06/2007
06/06/2007CN1320714C Wire distribution method and connecting structure
06/06/2007CN1320648C Electronic module
06/06/2007CN1320495C Equipment and method for processing integrated circuit
06/06/2007CN1319909C Microwave dielectric composition and method for producing same
06/05/2007US7228101 Satellite broadcast reception converter
06/05/2007US7227758 Printed circuit board assembly with integrated connector
06/05/2007US7227712 Disk drive apparatus and method of mounting same
06/05/2007US7227352 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe
06/05/2007US7227268 Placement of sacrificial solder balls underneath the PBGA substrate
06/05/2007US7227258 Mounting structure in integrated circuit module
06/05/2007US7227179 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
06/05/2007US7227156 System and method for attenuating the effect of ambient light on an optical sensor
06/05/2007US7226969 Aerogel/PTFE composite insulating material
06/05/2007US7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
06/05/2007US7226806 Wet etched insulator and electronic circuit component
06/05/2007US7226654 Laminated wiring board and its mounting structure
06/05/2007US7226653 Printed circuit board and method for producing a printed circuit board
06/05/2007US7226299 Circular electrical connector
06/05/2007US7225538 Resilient contact structures formed and then attached to a substrate
06/05/2007CA2206004C A thermosetting material
05/2007
05/31/2007WO2007061658A1 Coaxial resonator based voltage controlled oscillator/phased locked loop sythesizer module
05/31/2007WO2007061086A1 Curable resin composition and use thereof
05/31/2007WO2007060966A1 Electronic component mounting board and method for manufacturing such board
05/31/2007WO2007060784A1 Circuit module and method for fabricating the same
05/31/2007US20070123645 Ultraviolet curable silver composition and related method
05/31/2007US20070123112 Inductive and capacitive coupling balancing electrical connector
05/31/2007US20070123082 Interconnect Assemblies And Methods
05/31/2007US20070123072 Connector mounting construction and method
05/31/2007US20070123071 Usb connector with clipping grooves
05/31/2007US20070123068 Conductive ball arraying apparatus
05/31/2007US20070123057 Overvoltage protection materials and process for preparing same
05/31/2007US20070122941 Terminal device communicating with contact-less IC media, and a communication method performed in the terminal device
05/31/2007US20070122932 Methods and compositions for the formation of recessed electrical features on a substrate
05/31/2007US20070122637 Aromatic liquid-crystalline polyester film and metal laminated article
05/31/2007US20070122553 forming a frame having an undercut near the bottom on an electrode film, forming the patterned thin film by plating through the use of the frame; patterned thin film includes linear portions disposed side by side, and each linear portions has a portion having greater width, close to the electrode film
05/31/2007US20070122549 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition
05/31/2007US20070122073 Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof
05/31/2007US20070121305 Multilayer wiring board for an electronic device
05/31/2007US20070120880 Inkjet ink composition
05/31/2007US20070120680 Resonance security tag with and method of producing such a tag
05/31/2007US20070120575 Multiple Channel Modules and Bus Systems Using Same
05/31/2007US20070120273 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
05/31/2007US20070120229 Wet etched insulator and electronic circuit component
05/31/2007US20070120223 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
05/31/2007US20070119619 Multilayered wiring board and method for fabricating the same
05/31/2007US20070119618 Wiring board, electronic component mounting structure, and electronic component mounting method
05/31/2007US20070119617 Method for manufacturing component built-in module, and component built-in module
05/31/2007US20070119616 Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor device
05/31/2007US20070119615 Printed wiring board
05/31/2007US20070119614 Wiring board and method for producing the same
05/31/2007DE19963264B4 Trägermaterial für elektronische Hochleistungs-Bauelemente in SMD-Bauform und ein damit hergestelltes elektronisches Hochleistungs-Bauelement Support material for high performance electronic components in SMD style and thus produced high-performance electronic component
05/31/2007DE112005001446T5 Motorsteuerung Motor control
05/31/2007DE102005055950A1 Vorrichtung zur Passivierung wenigstens eines Bauelements durch ein Gehäuse und Verfahren zur Herstellung einer Vorrichtung Apparatus for passivation at least of a device through a housing and method for producing a device
05/31/2007DE102005055695A1 Anordnung von elektrischen Leitern und Verfahren zur Verschaltung der Leiter Arrangement of electrical conductors and method for connecting the conductor
05/31/2007DE102005054266B3 Schaltfeld Switching field
05/31/2007DE102005041131A1 Übertrager Transformer
05/30/2007EP1791410A2 Multilayer printed circuit board
05/30/2007EP1791409A1 Multilayer circuit board and method for manufacturing the same
05/30/2007EP1791405A2 Wiring board and method of manufacturing same
05/30/2007EP1791404A1 Electronic component and manufacturing method thereof
05/30/2007EP1791403A2 Printed wiring board
05/30/2007EP1791396A1 Controllable electrothermal element of ptc thick film circuit
05/30/2007EP1790204A1 Field device incorporating circuit card assembly as environmental and emi/rfi shield
05/30/2007EP1790043A1 High speed differential transmission structures without grounds
05/30/2007EP1789827A1 Optoelectronic flip-chip package with optical waveguide accommodated in upper layers of substrate board
05/30/2007EP1714533B1 Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board
05/30/2007EP1446993A4 I-channel surface-mount connector with extended flanges
05/30/2007EP1392495B1 Three-dimensional nonwoven substrate for circuit board
05/30/2007EP1272019B1 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof
05/30/2007EP1259103B1 Multilayer printed wiring board and method for producing multilayer printed wiring board
05/30/2007EP1060645B1 Electric conductor with a surface structure in the form of flanges and etched grooves
05/30/2007EP0966185B1 Method of manufacturing a printed wiring board
05/30/2007CN2907199Y Electronic component shielding shell and circuit board combination using the same
05/30/2007CN2907175Y Folding resistant low-profile resilient plate with a welded stable section
05/30/2007CN2907174Y Folding resistant low-profile resilient plate with a coated stable section
05/30/2007CN1973587A Hybrid electronic component and method for manufacturing the same
05/30/2007CN1973369A Process for producing a ceramic printed-circuit board
05/30/2007CN1973312A Display
05/30/2007CN1972585A Electronic device with dual heat radiation structure
05/30/2007CN1972580A Top or bottom part of a rack
05/30/2007CN1972570A Manufacture process of conductive structure formation of circuit board
05/30/2007CN1972569A A manufacturing method of via-hole of circuit board
05/30/2007CN1972568A A manufacturing method of formation of circuit board electricity connection end
05/30/2007CN1972563A Conductor-clad laminate, wiring circuit board, and processes for producing the same
05/30/2007CN1972562A A manufacturing method of pad on circuit board substrate and pad
05/30/2007CN1972561A Pcb
05/30/2007CN1972560A A flexible printed circuit board and its manufacturing method
05/30/2007CN1972559A Hybrid multilayered circuit board and its manufacturing method
05/30/2007CN1972558A Flexible printed circuit board and module and device having same
05/30/2007CN1972557A Flexible copper clad laminate, film carrier tape manufactured using the same, and method for manufacturing same, and flexible printed circuit board, and semiconductor device
05/30/2007CN1972556A Via stub termination structures and methods for making same
05/30/2007CN1972555A Printed circuit board and inspected-unit
05/30/2007CN1972554A 薄型化电路板结构 Thinning circuit board structure
05/30/2007CN1971942A Low-inductance gated thyristor and its power semiconductor assembly
05/30/2007CN1971899A Package substrate
05/30/2007CN1971401A Camera module using a printed circuit board having the end difference
05/30/2007CN1971344A 显示模组 Display module
05/30/2007CN1319425C Plane display capable of preventing heat expansion effect accumulating and its printing circuit board
05/30/2007CN1319424C Digital network
05/30/2007CN1319423C Printed wiring board and semiconductor device