| Patents for H05K 1 - Printed circuits (98,583) |
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| 10/09/2007 | US7280008 Printed-circuit board, electronic part having shield structure, and radio communication apparatus |
| 10/09/2007 | US7279798 High wireability microvia substrate |
| 10/09/2007 | US7279794 Semiconductor device and electronic device, and methods for manufacturing thereof |
| 10/09/2007 | US7279778 Semiconductor package having a high-speed signal input/output terminal |
| 10/09/2007 | US7279777 Organic polymers, laminates, and capacitors |
| 10/09/2007 | US7279771 Wiring board mounting a capacitor |
| 10/09/2007 | US7279642 Component with ultra-high frequency connections in a substrate |
| 10/09/2007 | US7279641 Wiring board and wiring apparatus |
| 10/09/2007 | US7279574 Heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate |
| 10/09/2007 | US7279365 Method of manufacturing heat conductive substrate |
| 10/09/2007 | US7279356 Depopulation of a ball grid array to allow via placement |
| 10/09/2007 | US7279217 Multilayer ceramic device, method for manufacturing the same, and ceramic device |
| 10/09/2007 | US7279216 Identifiable flexible printed circuit board and method of fabricating the same |
| 10/09/2007 | US7279108 Plating a resistive material onto a portion of the insulative substrate which is between the metallic areas, such that the resistive material connects the metallic areas, and thereafter trimming at least a portion of the resistive material from the insulative substrate |
| 10/09/2007 | US7278858 Socket with integral, retractable socket contact protector |
| 10/09/2007 | US7278711 Nozzle arrangement incorporating a lever based ink displacement mechanism |
| 10/09/2007 | US7278564 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus |
| 10/09/2007 | US7278459 Common carrier |
| 10/09/2007 | US7278207 Method of making an electronic package |
| 10/09/2007 | US7278193 Device for coupling PCB sheet |
| 10/04/2007 | WO2007112269A1 Transesophageal ultrasound probe with thin and flexible wiring |
| 10/04/2007 | WO2007111290A1 Method for manufacturing substrate having electric component |
| 10/04/2007 | WO2007111268A1 Process for producing copper wiring polyimide film, and copper wiring polyimide film |
| 10/04/2007 | WO2007111236A1 Photoelectric wiring board, optical communication device and method for manufacturing optical communication device |
| 10/04/2007 | WO2007110616A1 Electrical connector |
| 10/04/2007 | WO2007110612A1 Electrical connector |
| 10/04/2007 | WO2007110610A1 Electrical connector |
| 10/04/2007 | WO2007079121A3 Interconnected ic packages with vertical smt pads |
| 10/04/2007 | WO2007064466A3 Telco hub and method |
| 10/04/2007 | WO2007061429A3 Printed circuit boards and the like with improved signal integrity for differential signal pairs |
| 10/04/2007 | US20070234180 High spread highly randomized generatable interleavers |
| 10/04/2007 | US20070232096 Arrangement With a Contract Element |
| 10/04/2007 | US20070232095 QFN housing having optimized connecting surface geometry |
| 10/04/2007 | US20070232094 Structure for a motor/generator and method of manufacturing same |
| 10/04/2007 | US20070232093 Method and electronic device for communicating with external module |
| 10/04/2007 | US20070232089 Bridge modules for connecting plural groups of electronic modules |
| 10/04/2007 | US20070232088 Coaxial connector and coaxial cable connector assembly and related method |
| 10/04/2007 | US20070230151 Circuit substrate and electronic apparatus, fabrication process thereof |
| 10/04/2007 | US20070230150 Power supply structure for high power circuit packages |
| 10/04/2007 | US20070228566 Ball grid array package construction with raised solder ball pads |
| 10/04/2007 | US20070228547 Integrated Circuit (IC) Carrier Assembly Incorporating An Integrated Circuit (IC) Retainer |
| 10/04/2007 | US20070228443 Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layer |
| 10/04/2007 | US20070228110 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out |
| 10/04/2007 | US20070227769 Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member |
| 10/04/2007 | US20070227768 Flexible printed circuit board and hard disk drive employing the same |
| 10/04/2007 | US20070227767 Connecting device for eletronic components |
| 10/04/2007 | US20070227765 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 10/04/2007 | US20070227764 Printed Circuit Board and Manufacturing Method Thereof |
| 10/04/2007 | US20070227763 Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same |
| 10/04/2007 | US20070227762 Multilayer circuit board with grounding grids and method for controlling characteristic impedance of the multilayer circuit board |
| 10/04/2007 | US20070227761 Heat Conduction From an Embedded Component |
| 10/04/2007 | US20070226996 Hybrid integrated circuit device and method of manufacturing the same |
| 10/04/2007 | US20070226972 Common carrier |
| 10/04/2007 | DE202006020076U1 Leiterkartenanordnung Circuit card assembly |
| 10/04/2007 | DE19912605B4 Leiterplattenverstärkungsglied und elektronische Baugruppe Circuit board reinforcing member and electronic assembly |
| 10/04/2007 | DE19904363B4 Schaltungsanordnung zum Entstören von integrierten Schaltkreisen Circuit arrangement for suppressing of integrated circuits |
| 10/04/2007 | DE102007014433A1 Trägerkörper für Bauelemente oder Schaltungen Body for devices and circuits |
| 10/04/2007 | DE102006015508A1 Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester mit besonderer Eignung für Folien-Hinterspritzverfahren (In-mold-labeling), Verfahren zu ihrer Herstellung und ihre Verwendung Oriented, can be structured by means of electromagnetic radiation of thermoplastic polyester film which is particularly suitable for film insert molding process (in-mold labeling), processes for their preparation and their use |
| 10/04/2007 | DE102006015084A1 Halogenfreie flammgeschützte Epoxidharz-Formulierungen Halogen-free flame-retardant epoxy resin formulations |
| 10/04/2007 | DE10144704B4 Verfahren zum Verbinden eines Bauelements mit einem Träger A method for connecting a component with a carrier |
| 10/03/2007 | EP1841300A1 Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layer |
| 10/03/2007 | EP1841299A2 Connecting device for electronic components |
| 10/03/2007 | EP1841298A2 Plated vias exit structure for printed circuit board |
| 10/03/2007 | EP1841297A1 High frequency module |
| 10/03/2007 | EP1841296A1 Flexible printed circuit board and hard disc drive employing the same |
| 10/03/2007 | EP1840914A1 Capacitor layer forming material, process for producing the same, and printed wiring board having built-in capacitor layer obtained using the material |
| 10/03/2007 | EP1840165A1 Melt-processible poly(tetrafluoroethylene) |
| 10/03/2007 | EP1839466A2 Improved matched-impedance surface-mount technology footprints |
| 10/03/2007 | EP1157821B1 Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
| 10/03/2007 | CN200956686Y Circuit board fixing post |
| 10/03/2007 | CN200956685Y Electronic element-component package aluminium substrate |
| 10/03/2007 | CN200956684Y Signal transfer board |
| 10/03/2007 | CN101049056A Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 10/03/2007 | CN101049055A Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material |
| 10/03/2007 | CN101048866A Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same |
| 10/03/2007 | CN101048863A 电子部件模块以及无线通信设备 Electronics module and a wireless communication device |
| 10/03/2007 | CN101048054A Fixing device for radiator |
| 10/03/2007 | CN101048041A Method for connecting flexible printed circuit board and flexible circuit component and correlation structure |
| 10/03/2007 | CN101048039A Optical/electrical circuit interconnect board and evaluation method therefor |
| 10/03/2007 | CN101048038A Electronic unit and electronic apparatus having the same |
| 10/03/2007 | CN101048037A Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layer |
| 10/03/2007 | CN101048036A Built-in film risitance and its manufacturing method, multi-layer substrate |
| 10/03/2007 | CN101048035A Adjustable resistance in multi-layer substrate and forming method thereof |
| 10/03/2007 | CN101048034A Circuitboard interconnection system, connector component, circuit board and circuit board processing method |
| 10/03/2007 | CN101048033A 印刷电路板 A printed circuit board |
| 10/03/2007 | CN101048032A Ground plane of printed circuit board |
| 10/03/2007 | CN101048031A Printing plate, printing board, and printing method for printed board |
| 10/03/2007 | CN101048030A Printed wiring board, semiconductor package with printed wiring board and electronic device having printed circuit board |
| 10/03/2007 | CN101047398A 高频模块 High-frequency module |
| 10/03/2007 | CN101047161A Design of low inductance embedded capacitor layer connections |
| 10/03/2007 | CN101047159A Multilayer interconnection substrate, semiconductor device, and solder resist |
| 10/03/2007 | CN101047067A Thin film capacitor and method of manufacturing the thin film capacitor |
| 10/03/2007 | CN101047064A Internal electrode paste, multilayer ceramic electronic device and the production method |
| 10/03/2007 | CN101047063A 电容结构 Capacitance structure |
| 10/03/2007 | CN101047062A Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component |
| 10/03/2007 | CN101047049A Electroconductive paste composition and printed wiring board |
| 10/03/2007 | CN101047048A Conductive composition and conductive paste |
| 10/03/2007 | CN100341391C Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| 10/03/2007 | CN100341242C Master slice and substrate element and producing method therefor |
| 10/03/2007 | CN100341148C Wiring substrate |