Patents for H05K 1 - Printed circuits (98,583)
08/2007
08/30/2007US20070200217 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
08/30/2007US20070199736 Substrate with multilayer plated through hole and method for forming the multilayer plated through hole
08/30/2007US20070199735 Printed circuit board having inner via hole and manufacturing method thereof
08/30/2007US20070199733 Circuit board and method for manufacturing the same
08/30/2007DE19807956B4 Verfahren zum Trennen von Isoliersubstraten A method of separating insulating substrates
08/30/2007DE10241658B4 Verfahren zur Verzinnung von abisolierten Bereichen der Adern eines Flachkabels A method for tinning of stripped areas of the wires of a flat cable
08/30/2007DE102007008322A1 Computersystem mit anpaßbaren Platinen Computer system with customizable boards
08/30/2007DE102006061850A1 Verbindungsstruktur für eine Wandleranordnung Interconnect structure for a transducer assembly
08/30/2007DE102006026364A1 Inductive component e.g. coil, for surface mounted device printed circuit board assembly, has recess provided on side of supporting units for accommodating and guiding connecting cable of electrical components
08/30/2007DE10157443B4 Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil, Verwendung der Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil und Vefahren zur Herstellung eines elektronischen Vielschicht-Keramikbauteils Glass-ceramic composition for a ceramic electronic part, use of the glass-ceramic composition for a ceramic electronic component and Vefahren of manufacturing an electronic multilayer ceramic component
08/30/2007DE10044934B4 Vorrichtung zur Steuerung und/oder Regelung der Betriebsabläufe bei einem Kraftfahrzeug A device for controlling and / or regulating the operating procedures in a motor vehicle
08/30/2007CA2630535A1 Method and apparatus for using flex circuit technology to create an electrode
08/29/2007EP1827070A2 Thermal management of electronic devices
08/29/2007EP1827069A2 Printed wiring board and method of manufacturing the same
08/29/2007EP1827068A2 Printed wiring board and method of manufacturing the same
08/29/2007EP1827065A2 Printed wiring board and method of manufacturing the same
08/29/2007EP1827064A1 Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material
08/29/2007EP1827063A2 Spread illuminating apparatus
08/29/2007EP1827062A2 Electronic device
08/29/2007EP1827061A2 Facility and method for high-performance circuit board connection
08/29/2007EP1825726A1 A printed circuit board with combined digital and high frequency applications
08/29/2007EP1825591A1 Resonator for a voltage controlled oscillator and manufacturing method thereof
08/29/2007EP1661207B1 Flexible conformal antenna
08/29/2007EP1623612B1 An actuation membrane for application to a card slot of a system
08/29/2007EP1479274B1 Laminated socket contacts
08/29/2007EP1266426B1 Method for forming radio frequency antenna using conductive inks
08/29/2007EP1195356B1 Composite metal titanate in plate form and method for preparation thereof
08/29/2007CN200941722Y Radiator with positioner
08/29/2007CN200941716Y 固定栓结构 Fixed bolt structure
08/29/2007CN200941707Y High heat conductive metallic substrate
08/29/2007CN101027950A Flexible cable for high-speed interconnect
08/29/2007CN101027948A Electronics module and method for manufacturing the same
08/29/2007CN101027775A Manufacture of a layer including a component
08/29/2007CN101026936A Printed circuit board button solder pad holing method and its button solder pad
08/29/2007CN101026933A Printed circuit board waveguide
08/29/2007CN101026931A Right-angled signal line making method and its circuit board
08/29/2007CN101026930A Multi-layer board with decoupling function
08/29/2007CN101026929A Printed circuit board having inner via hole and manufacturing method thereof
08/29/2007CN101026928A Copper foil for super fine pitch printed circuit board
08/29/2007CN101026927A Core board comprising nickel layer, multilayer board and manufacturing method thereof
08/29/2007CN101026926A Radiator fastening device
08/29/2007CN101026925A Radiator fastening device
08/29/2007CN101026924A Radiator fastening device
08/29/2007CN101026923A Printed wiring board and connection configuration of the same
08/29/2007CN101026922A Circuit brard combination
08/29/2007CN101026272A Facility and method for high-performance circuit board connection
08/29/2007CN101026271A Circuit board connector extension
08/29/2007CN101026269A Flat earth terminal and method of surface-mounting same
08/29/2007CN101026099A Method for manufacturing a substrate with cavity
08/29/2007CN101025502A Production method of flexible electronic device
08/29/2007CN101024315A Laminate and its producing method
08/29/2007CN100334932C Part mounting recognition mark recognition device and method
08/29/2007CN100334925C Data bus connection for memory device
08/29/2007CN100334705C Power semiconductor module with detector for detecting main circuit current through power semiconductor element
08/29/2007CN100334700C Mold release layer transferring film and laminate film
08/29/2007CN100334603C Manufacturing method for metal depositing dielectric material
08/28/2007US7263248 Optical via to pass signals through a printed circuit board
08/28/2007US7262975 Multilayer printed wiring board
08/28/2007US7262973 Power conversion module device and power unit using the same
08/28/2007US7262822 Structure of liquid crystal display device for easy assembly and disassembly
08/28/2007US7262682 Resistor element, stress sensor, and method for manufacturing them
08/28/2007US7262583 Apparatus for providing regulated power to an integrated circuit
08/28/2007US7262497 Bumpless assembly package
08/28/2007US7262489 Three-dimensionally formed circuit sheet, component and method for manufacturing the same
08/28/2007US7262480 Semiconductor device, and method and apparatus for manufacturing semiconductor device
08/28/2007US7262368 Connection structures for microelectronic devices and methods for forming such structures
08/28/2007US7262365 Anti-abrasive mechanism confining flat flexible cable in position in flatbed image scanner
08/28/2007US7261944 At least monoaxially oriented polyester film containing a metal compound which on irradiation with electromagnetic radiation liberates a metal in elemental form coated with an aminosilane; film has a modulus of elasticity in at least one direction of greater than 500 N/mm2
08/28/2007US7261937 Fluoropolymer laminates and a process for manufacture thereof
08/28/2007US7261841 Thick film conductor case compositions for LTCC tape
08/28/2007US7261570 Method for attaching cable to circuit substrate
08/28/2007US7261569 Connection structure of printed wiring board
08/28/2007US7260890 Methods for fabricating three-dimensional all organic interconnect structures
08/28/2007US7260882 Methods for making electronic devices with small functional elements supported on a carriers
08/24/2007CA2537679A1 Electronic circuit prototyping apparatus
08/23/2007WO2007094359A1 Thermocurable resin composition comprising semi-ipn-type complex, and varnish, prepreg and metal-clad laminate sheet using the same
08/23/2007WO2007094177A1 Stainless steel substrate with conductive metal layer, hard disk suspension material and hard disk suspension manufactured by using the material
08/23/2007WO2007094167A1 Circuit board and process for producing the same
08/23/2007WO2007093294A2 Electrical power distribution unit and electrical punched grid therefor
08/23/2007WO2007074049A3 Electric device comprising a lubricated joint point and method for lubricating said type of joint point
08/23/2007WO2007060212A3 Module for insertion in a rack and method for cooling said module
08/23/2007US20070197058 Printed wiring board and connection configuration of the same
08/23/2007US20070197057 Type of improved connecting socket
08/23/2007US20070197054 Coaxial connector
08/23/2007US20070196671 Electromagnetic wave absorber
08/23/2007US20070195511 Component built-in wiring board and manufacturing method of component built-in wiring board
08/23/2007US20070195510 Configurable circuit board and fabrication method
08/23/2007US20070194433 Electronic circuit, a semiconductor device and a mounting substrate
08/23/2007US20070194432 Arrangement of non-signal through vias and wiring board applying the same
08/23/2007US20070194431 Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods
08/23/2007US20070193775 Impedance matching via structure for high-speed printed circuit boards and method of determining same
08/23/2007US20070193774 Electronic component mounting structure
08/23/2007US20070193773 Flexible printed circuit board and electronic component assembly
08/23/2007US20070193772 Optical fiber cable to inject or extract light
08/23/2007US20070193763 Leadframe-based module dc bus design to reduce module inductance
08/23/2007DE102006006561A1 Flip-Chip-Modul und Verfahren zum Austauschen eines Halbleiterchips eines Flip-Chip-Moduls Flip-chip module and method for replacing a semiconductor chip of a flip-chip module
08/23/2007DE102006006329A1 Control panel for printing machine, has two printed circuit boards arranged in modular construction and control elements are plugged on respective printed circuit board socket and control panel contains number of control elements
08/22/2007EP1821586A1 Printed board and printed board manufacturing method
08/22/2007EP1821570A1 Miniature silicon condenser microphone and method for producing same
08/22/2007EP1821368A1 Connector between substrates, and circuit board device using connector between substrates