Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2007
11/22/2007DE202005021376U1 Elektrisches/elektronisches Installationsgerät Electrical / electronic installation device
11/22/2007DE19523364B4 Leiterplatte Circuit board
11/22/2007DE10201045B4 Flexibler LED-Schaltkreis zur rückseitigen Durchleuchtung Flexible LED circuit for rear-ray
11/22/2007DE102007004815A1 Device e.g. tire pressure sensor, has radio-technical device formed for transmitting and/or receiving electromagnetic radiations, where circuit elements of radio-technical device are accommodated inside printed circuit board
11/22/2007DE102006028692A1 Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium Electrically conductive connection with insulating compound medium
11/22/2007DE102004043478B4 Abschirmgehäuse Shield
11/22/2007DE102004007701B4 Elektrischer Isolator mit Oberflächenbeschichtung An electrical insulator with surface coating
11/22/2007DE10116797B4 Elektrischer Verbinder The electrical connector
11/22/2007CA2651649A1 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
11/21/2007EP1858307A1 Multilayer printed wiring board
11/21/2007EP1858306A1 Three-dimensional wiring body for mounting electronic component and electronic component mounting structure
11/21/2007EP1856799A1 Improving the quality of analog wideband appliances
11/21/2007EP1856723A2 Simultaneous and selective partitioning of via structures using plating resist
11/21/2007EP1668056A4 Epoxy resin compositions, processes utilzing same and articles made therefrom
11/21/2007EP1647036B1 Inductive-system
11/21/2007EP1199588B1 method of manufacturing an optoelectronic substrate
11/21/2007CN200980221Y A heat radiating circuit board
11/21/2007CN200980220Y A structure of heat radiating circuit board
11/21/2007CN200980206Y A substrate for wave soldering parameter acquisition unit
11/21/2007CN200980204Y A reduction in signal line structure in circuit board corresponding to key
11/21/2007CN200980203Y 一种印刷线路板 A printed wiring board
11/21/2007CN200980202Y A copper foil board with metal matrix
11/21/2007CN200980201Y A slotted structure of circuit board with noise repression
11/21/2007CN200980200Y 一种挠性印制电路板 A flexible printed circuit board
11/21/2007CN200980063Y A capacitor used by vehicles
11/21/2007CN200979114Y LED lamp curtain wall
11/21/2007CN101076885A Stacked body for cof substrate, method for manufacturing such stacked body for cof substrate, and cof film carrier tape formed by using such stacked body for cof substrate
11/21/2007CN101076572A Conductive silver dispersions and uses thereof
11/21/2007CN101076229A Method for producing printing-circuit board conducting hole
11/21/2007CN101076228A Wave guide tube printed circuit board structure for printing
11/21/2007CN101076225A Printed circuit board assembly and method of producing the same
11/21/2007CN101076224A Aluminum-base printing circuit board and its production
11/21/2007CN101076223A Metal circuit board of aluminum baseplate magnetic-controlled sputtering-jetted and LED illuminating device
11/21/2007CN101076081A Camera assembly package
11/21/2007CN101075813A High-speed signal transmission-line structure of connected-pole parallel series
11/21/2007CN101075037A 显示装置 Display device
11/21/2007CN101075028A Printing-circuit board module for liquid-crystal display device
11/21/2007CN100350823C Vibrator holder
11/21/2007CN100350822C Vibrator holder
11/21/2007CN100350820C Process for thick film circuit patterning
11/21/2007CN100350819C Structure of base plate for packaging ball grid array
11/21/2007CN100350680C Electronic device, connector assembly and signal line
11/21/2007CN100350677C 连接装置 Connecting device
11/21/2007CN100350606C Voltage variable material for direct application and devices employing same
11/21/2007CN100350517C 层压体及其用途 Laminate and its use
11/21/2007CN100349966C Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler
11/21/2007CN100349903C NOvel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, compositions and laminates devived therefrom
11/21/2007CN100349734C Fluoropolymer laminates and a process for manufacture thereof
11/21/2007CN100349723C System and method for bending a substantially rigid substrate
11/20/2007US7299312 Telecommunication apparatus
11/20/2007US7298628 Power delivery to base of processor
11/20/2007US7298623 Organic substrate with integral thermal dissipation channels, and method for producing same
11/20/2007US7298616 Cooling device capable of reducing thickness of electronic apparatus
11/20/2007US7298040 Wire bonding method and apparatus for integrated circuit
11/20/2007US7298039 Electronic circuit device
11/20/2007US7297878 High frequency laminated component and its manufacturing method
11/20/2007US7297877 Substrate with micro-via structures by laser technique
11/20/2007US7297876 Circuit board and method of manufacturing the same
11/20/2007US7297875 Fusion bonded assembly with attached leads
11/20/2007US7297722 Radially multi-branched polymer and porous film using the same
11/20/2007US7297627 Multilayer substrate
11/20/2007US7297572 Fabrication method for electronic system modules
11/20/2007US7297563 Method of making contact pin card system
11/20/2007US7297562 Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
11/20/2007US7297423 An insulator containing dispersed superparamagnetic nanoparticles having a blocking temperature at 80 degrees C. or lower, a volume filling rate between 5 and 60%, and whose surfaces are coated with an organic stabilizer.
11/20/2007US7297024 Universal-serial-bus (USB) flash-memory device with metal wrap formed over plastic housing
11/20/2007US7297006 Flexible connector with printed circuit lines encircling two axes
11/20/2007US7296754 IC card module
11/20/2007US7296346 Plating buss and a method of use thereof
11/15/2007WO2007129711A1 Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
11/15/2007WO2007129231A1 Thermal surface mounting of multiple leds onto a heatsink
11/15/2007WO2007128592A1 Conductor track carrier
11/15/2007WO2007089885A3 Passive impedance equalization of high speed serial links
11/15/2007WO2007069224A3 Enhanced substrate using metamaterials
11/15/2007WO2006112474A3 Fiber-resin composite material, multilayer body, printed wiring board, amd method for manufacturing printed wiring board
11/15/2007US20070265423 Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof
11/15/2007US20070264850 Headset for a functional device
11/15/2007US20070264848 Connector
11/15/2007US20070264813 Process for producing a film carrier tape for mounting an electronic part
11/15/2007US20070263370 Multilayer printed wiring board for semiconductor devices and method for manufacturing the board
11/15/2007US20070263365 Ic Card
11/15/2007US20070263339 Materials for Forming Capacitor Layer and Printed Wiring Board Having Embedded Capacitor Circuit Obtained by Using the Same
11/15/2007US20070263157 Planar display module
11/15/2007US20070262467 Semiconductor Device Having a Chip Stack on a Rewiring Plate
11/15/2007US20070262463 Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elements
11/15/2007US20070261883 Methods For Improving The Flux Compatibility Of Underfill Formulations
11/15/2007US20070261882 Printed Circuit Board and Heat Dissipating Metal Surface Layout thereof
11/15/2007DE102007021064A1 Platine mit eingebetteten Bauteilen und Verfahren zur Erkennung einer fehlerhaften Verdrahtung Board with embedded components and method for detecting faulty wiring
11/15/2007DE102007013410A1 Verfahren zum Ausbilden von Diamant-Mikrokanal-Strukturen und daraus resultierende Vorrichtungen A method for forming diamond micro-channel structures and resultant devices
11/15/2007DE102006047171A1 Generator Generator
11/15/2007DE102006022748A1 Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung A semiconductor device comprising surface mount components and process for its preparation
11/15/2007DE102006022107A1 Anordnung einer Leiterplatte und einem dazu in einem festen Abstand gehaltenen Kontaktträger Arrangement of a circuit board and a held to a fixed distance contact support
11/15/2007DE102006021973A1 Leuchte mit wenigstens einer Leuchtmitteleinheit für Fahrzeuge, vorzugsweise für Kraftfahrzeuge Luminaire with at least one lighting unit for vehicles, preferably for motor vehicles
11/15/2007DE102006021096A1 Leiterbahnträger Conductor carrier
11/15/2007DE102006019895A1 Power measuring device for use as battery sensor for measuring e.g. battery power, of vehicle, has connecting unit for connecting contact unit with connector of board, where press fit is provided between connecting unit and hole
11/15/2007DE102006018796A1 Elektrisches/elektronisches Installationsgerät Electrical / electronic installation device
11/15/2007DE102004052909B4 Gedruckte Leiterplatte mit einem Sensor für ein schwaches Magnetfeld und Verfahren zur Herstellung Printed circuit board having a sensor for weak magnetic field and methods for preparing
11/15/2007DE10102353B4 LED-Signalmodul LED signal module
11/15/2007DE10064969B4 Filtervorrichtung für mindestens eine von außen an ein Gehäuse anzuschließende elektrische Leitung Filter device for at least one to be connected externally to a housing electric line
11/14/2007EP1855515A1 Printed board and method for manufacturing same
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