Patents for H05K 1 - Printed circuits (98,583)
08/2007
08/01/2007EP1354503B1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
08/01/2007CN2930231Y Automatic heat radiator
08/01/2007CN2930224Y Combined module with heat radiation fan and circuit board
08/01/2007CN2930196Y Soft and hard composite printed circuit board structure
08/01/2007CN2930195Y Flexible and rigid interconnected plate
08/01/2007CN1330227C Electromagnetic masking flexible circuit substrate
08/01/2007CN1330225C Multilayer printed circuit board
08/01/2007CN1330224C Protective circuit for storage battery, and storage battery pack
08/01/2007CN1330223C Electronic device and its design method and making process, circuit substrate and electronic equipment
08/01/2007CN1330222C A mechanism to cross high-speed differential pairs
08/01/2007CN1330221C Structure of signal transferring
08/01/2007CN1330220C Structure of signal transferring
08/01/2007CN1329980C Wiring part and its producing method
08/01/2007CN1329979C Film carrier tape for electronic part and its producing method
08/01/2007CN1329978C Substrate and method for producing same
08/01/2007CN1329932C Electronic element and inter base plate
08/01/2007CN1329575C Glass cloth and printed wiring board
08/01/2007CN1329355C Cured ethylene benzyl compounds and method for preparing same
08/01/2007CN1329326C Dielectric material and dielectric material sintered body and wiring board using such ceramic
08/01/2007CN1329186C Method for preparing flexible copper-cladded plate
08/01/2007CN1329130C Microdeposition control system and method
08/01/2007CN101010994A Method for manufacturing an electronics module
08/01/2007CN101010662A Touch panel
08/01/2007CN101009983A Structure and method for increasing the locking friction of the circuit board
08/01/2007CN101009978A Method for manufacturing electronic device
08/01/2007CN101009977A Quasi-waveguide printed circuit board structure
08/01/2007CN101009975A Method for manufacturing the lamination porcelain base board
08/01/2007CN101009974A Heat radiation substrate
08/01/2007CN101009973A Resin composite copper foil, printed wiring board, and production process thereof
08/01/2007CN101009972A Circuit board provided and transmission device with the same mounted
08/01/2007CN101009971A Wired-circuit-board assembly sheet
08/01/2007CN101009970A Multi-functional compound substrate structure
08/01/2007CN101009969A Using method of the printed circuit board and its printed circuit board
08/01/2007CN101009968A Electronic carrier board
08/01/2007CN101009408A Fixing member and fixing structure
08/01/2007CN101009407A Fixing member and mounting structure
08/01/2007CN101009406A Backboard connector combination
08/01/2007CN101009405A Expansion card slot component of the image display device
08/01/2007CN101009268A Base board and its electric test method
08/01/2007CN101009264A Wiring board and semiconductor apparatus
08/01/2007CN101009263A Printed circuit board for semiconductor package and method of manufacturing the same
08/01/2007CN101009205A Porous substrate with smooth surface and production method thereof
08/01/2007CN101008753A 显示装置 Display device
08/01/2007CN101007948A Preparation method of broad dielectric constant polytetrafluoroethylene mixed impregnant liquor for print circuit board
07/2007
07/31/2007US7251512 Water-proof collapsible cellular terminal apparatus
07/31/2007US7251139 Thermal management arrangement for standardized peripherals
07/31/2007US7250827 Circuitry module
07/31/2007US7250576 Chip package having chip extension and method
07/31/2007US7250355 Multilayered circuit substrate, semiconductor device and method of producing same
07/31/2007US7250352 Methods for manufacturing a hybrid integrated circuit device
07/31/2007US7250329 Method of fabricating a built-in chip type substrate
07/31/2007US7249895 Optical transceiver with capacitive coupled signal ground with chassis ground
07/26/2007WO2007083623A1 Polyimide resin composition and metal polyimide laminate
07/26/2007WO2007083526A1 Polyimide film and use thereof
07/26/2007WO2007024837A3 Fluoropolymer-glass fabric for circuit substrates
07/26/2007WO2006121486A3 High capacity thin module system and method
07/26/2007US20070173135 Printed wiring board for mounting semiconductor
07/26/2007US20070173120 Electrical connector with improved crosstalk compensation
07/26/2007US20070173085 Circular electrical connector
07/26/2007US20070173084 Board-to-board connecting structure
07/26/2007US20070173083 Connecting element, method for bus communications between a control unit for activating personal protective means as master and at least one connecting element for weight measurement in a seat as slave, and bus system
07/26/2007US20070173082 Embedded connector module
07/26/2007US20070173048 Method of manufacturing an electrical component
07/26/2007US20070172992 Methods for fabricating stiffeners for flexible substrates
07/26/2007US20070171620 Structure of USB connector of mini portable flash memory drive
07/26/2007US20070171619 Electronic circuit board intermediate member, manufacturing method therefor, manufacturing equipment therefor, method for rmanufacturing noncontact id card and the like, and equipment therefor
07/26/2007US20070171140 Radiating slit antenna system
07/26/2007US20070170942 Methods for fabricating fences on interposer substrates
07/26/2007US20070170598 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same
07/26/2007US20070170566 Semiconductor Device and Method of Manufacturing the Same, Circuit Board, and Electronic Instrument
07/26/2007US20070170403 High conductivity inks with improved adhesion
07/26/2007US20070169961 Technique for reducing via capacitance
07/26/2007US20070169960 Multilayer stacked wiring board
07/26/2007US20070169959 Microelectronic device with mixed dielectric
07/26/2007US20070169958 Mask for exposure
07/26/2007US20070169886 Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device
07/26/2007US20070169879 Method and apparatus for producing a detail
07/26/2007US20070169342 Connection pad layouts
07/26/2007US20070169341 Circuit board design
07/26/2007DE102004055955B4 Anordnung zum Kontaktieren einer in einem Gehäuse integrierten Schaltung Arrangement for contacting an integrated circuit contained in a housing
07/25/2007EP1811823A1 Multilayer printed wiring board
07/25/2007EP1811820A1 Process for producing metallized aluminum nitride substrate and substrate obtained thereby
07/25/2007EP1811819A1 Circuit board
07/25/2007EP1810553A1 Flexible multi-layer circuit board provided with opposing flexible conductive structures and method for the production thereof
07/25/2007EP1810552A1 Printed circuit board for high-speed electrical connectors
07/25/2007EP1810366A1 Antenna component
07/25/2007EP1738626B1 Process for manufacturing a power electronic appliance by bending
07/25/2007EP1460644B1 Electroconductive composition, electroconductive coating and method for forming electroconductive coating
07/25/2007EP1430757B1 Throughplating of flexible printed boards
07/25/2007EP1409577B1 Flame resistant thermoplastic moulding materials
07/25/2007EP0971570B1 Printed wiring board and its manufacturing method
07/25/2007CN2927622Y Rear panel
07/25/2007CN2927617Y Short extended card and radiating combined structure therefor
07/25/2007CN2927613Y 扣具 BUCKLE
07/25/2007CN2927611Y Single board, single-board member and computer housing
07/25/2007CN2927606Y Flexible printing circuit board against tearing
07/25/2007CN2927605Y Circuit board and its radiating metal surface arrangement shape
07/25/2007CN2927604Y Flexible printing circuit board against tearing
07/25/2007CN1328934C Printed circuit board for mounting a quad flat package IC, method of soldering a quad flat package IC, and air conditioning apparatus with such a printed circuit board
07/25/2007CN1328785C Method of manufacturing heat conductive substrate