Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2007
08/16/2007CA2640658A1 Anodised aluminium, dielectric, and method
08/15/2007EP1819209A1 Wired circuit board and production method thereof
08/15/2007EP1818980A2 Substrate for high voltage modules
08/15/2007EP1818979A1 Electronic component and production method therefor
08/15/2007EP1818975A2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
08/15/2007EP1817947A1 Single or multi-layer printed circuit board with improved via design
08/15/2007EP1817945A1 Substrate
08/15/2007EP1695308B1 Improved resonance security tag and method of producing such a tag
08/15/2007EP1629420B1 Method for producing a contactless ticket
08/15/2007EP1412429B1 Flameproofed thermoplastic molding compounds
08/15/2007EP1354326B1 Flexible strip cable and method of manufacturing it
08/15/2007CN2935711Y Printed circuit board for lens module
08/15/2007CN2935403Y Wafer-type passive element substrate
08/15/2007CN1332588C Structure of soldering pad for improving stray effect
08/15/2007CN1332444C Semiconductor device and producing method thereof
08/15/2007CN1332244C Compact display assembly
08/15/2007CN1331902C Dyed fluoropolymers
08/15/2007CN101019474A Structured surface using ablatable radiation sensitive material
08/15/2007CN101019473A High density interconnect system having rapid fabrication cycle
08/15/2007CN101019472A Field device incorporating circuit card assembly as environmental and EMI/RFI shield
08/15/2007CN101018473A Mirroring shielding structure
08/15/2007CN101018463A Electronic device combination
08/15/2007CN101018456A Bare chip embedded PCB and method of the same
08/15/2007CN101018453A Wiring board and method for manufacturing the same and semiconductor device and method for manufacturing the same
08/15/2007CN101018452A Multilayer printed wiring board
08/15/2007CN101018451A Welding pad structure
08/15/2007CN101018450A Base board welding structure
08/15/2007CN101018449A Ceramic substrate
08/15/2007CN101018448A Combination of heat radiator buckle and heat radiation device
08/15/2007CN101018447A Circuit base board, its encapsulation structure, and making method of the encapsulation structure
08/15/2007CN101018446A A passive base board for the switch power module and its making method
08/15/2007CN101018445A Dual-axis circuit board
08/15/2007CN101017936A Connector for flexible printed circuit, flexible printed circuit inserting the same, and display device having the same
08/15/2007CN101017806A Package substrate
08/15/2007CN101017733A Ic插座 Ic Socket
08/15/2007CN101017259A Signal transmission film and display device including the same
08/15/2007CN101017185A Testing method of capacitance component mounted inside and testing system thereof
08/14/2007USRE39766 Multi-layer circuit board
08/14/2007US7257792 Wiring board design aiding apparatus, design aiding method, storage medium, and computer program
08/14/2007US7257751 Apparatus and method for random pattern built in self-test
08/14/2007US7257281 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
08/14/2007US7257007 Spacers for cells having spaced opposed substrates
08/14/2007US7257004 Power delivery system for integrated circuits
08/14/2007US7256980 Thin film capacitors on ceramic
08/14/2007US7256690 Anti-theft device
08/14/2007US7256484 Memory expansion and chip scale stacking system and method
08/14/2007US7256354 Technique for reducing the number of layers in a multilayer circuit board
08/14/2007US7256353 Metal/ceramic bonding substrate and method for producing same
08/14/2007US7256345 Cable and manufacturing method therefor
08/14/2007US7256071 Underfilling efficiency by modifying the substrate design of flip chips
08/14/2007US7255954 Energy devices
08/14/2007US7255931 Aluminum/ceramic bonding substrate and method for producing same
08/14/2007US7255927 Laminate composition
08/14/2007US7255925 Dielectrics accuracy; heat dissipation ; glass transition temperature; heat resistance; copper cladding laminate ; high speed signal transfer
08/14/2007US7255919 Mold release layer transferring film and laminate film
08/14/2007US7255802 Tape substrate and method for fabricating the same
08/14/2007US7255574 Electrical connector having an oscillating multilayered conducting body
08/09/2007WO2007089885A2 Passive impedance equalization of high speed serial links
08/09/2007WO2007089599A2 Led illumination assembly with compliant foil construction
08/09/2007WO2007088757A1 Memory card and memory card manufacturing method
08/09/2007WO2007088631A1 Connection portion of circuit board and connection structure of circuit board
08/09/2007WO2007087982A1 Printed circuit board with additional functional elements, method of production and use
08/09/2007WO2007087981A1 Flexible printed circuit board with additional functional element and a milled notch, method of production and use
08/09/2007WO2007087980A1 Printed circuit board with functional elements and selectively filled passage openings of good thermal conductivity and method of production and use
08/09/2007WO2007068018A3 Arrangement comprising at least one electronic component
08/09/2007US20070184968 Flat panel direct methanol fuel cell and method of making the same
08/09/2007US20070184966 Aluminum nitride powder and aluminum nitride sintered compact
08/09/2007US20070184743 Methods and devices for manufacturing of electrical components and laminated structures
08/09/2007US20070184724 NEXT high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
08/09/2007US20070184687 Circuit board provided with digging depth detection structure and transmission device with the same mounted
08/09/2007US20070184686 Wire harness checker and wire harness checking method
08/09/2007US20070184685 Universal serial bus flash drive with deploying and retracting functionalities
08/09/2007US20070184684 Automation system and method for identifying and correcting connection errors
08/09/2007US20070184682 Printed circuit connector
08/09/2007US20070184681 High frequency connector assembly
08/09/2007US20070184675 Printed circuit board
08/09/2007US20070184280 Epoxy compounds and cured epoxy resins obtained by curing the compounds
08/09/2007US20070182059 Resin molded article with reduced dielectric loss tangent and production method therefor
08/09/2007US20070182016 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
08/09/2007US20070182000 Module part
08/09/2007US20070181994 Circuit board manufacturing method and circuit board
08/09/2007US20070181858 Silver powder and method for producing same
08/09/2007US20070181338 Assembled device and signal feeding structure thereof
08/09/2007US20070181337 Direct wire attach
08/09/2007DE202006005045U1 Leiterplattenmodul PCB module
08/09/2007DE19757938B4 Isolationskamm für Multikontaktstecker Insulation comb for multi-contact connectors
08/09/2007DE10344644B4 Computermainboard Computer Mainboard
08/09/2007DE10211677B4 Anordnung zum Senden oder Empfangen von optischen Signalen Arrangement for transmitting or receiving optical signals
08/09/2007DE102007004088A1 Verfahren zum Herstellen einer Dünnfilmantenne A method of fabricating a thin film antenna
08/09/2007DE102006025219A1 Produkt mit Leiter aus Zink oder einer Zink-Aluminium-Legierung Product manager with zinc or zinc-aluminum alloy
08/09/2007DE102006004320A1 Leiterplatte mit funktionalen Elementen und selektiv gefüllten und thermisch leitfähigen Durchsteigelöchern sowie Herstellverfahren und Anwendung PCB with functional elements and selectively filled and thermally conductive step-through holes or production process and application
08/09/2007DE10084657B4 Modulkarte und Herstellverfahren für diese Module board and manufacturing method of this
08/08/2007EP1816905A2 Printed wiring board and method of manufacturing the same
08/08/2007EP1816762A1 Optical receiver
08/08/2007EP1816498A1 Photo-electricity combined-circuit mounted board and transmitting apparatus using the same
08/08/2007EP1815580A1 Suppressor for suppressing high-frequency interference emissions of a direct-current motor that can be operated in a number of stages and/or directions
08/08/2007EP1814955A1 Resin cured film for flexible printed wiring board and production process thereof
08/08/2007EP1625357B1 Measuring device comprising a probe
08/08/2007EP1592747B1 Poly(phenylene ether) resin composition, prepreg, and laminated sheet
08/08/2007EP1344396A4 Folder type multi display device
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