Patents for H05K 1 - Printed circuits (98,583)
09/2007
09/18/2007US7271461 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
09/18/2007US7271415 Flexible electronic device and production method of the same
09/18/2007US7271349 Via shielding for power/ground layers on printed circuit board
09/18/2007US7271348 Providing decoupling capacitors in a circuit board
09/18/2007US7271347 Wired circuit board
09/18/2007US7271225 having high flame retardancy; having a structural unit derived from a secondary phosphine preferably at least one selected from 1,4-cyclooctylenephosphine oxide and 1,5-cyclooctylenephosphine oxide
09/18/2007US7271206 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof
09/18/2007US7271095 Process for producing metallic interconnects and contact surfaces on electronic components
09/18/2007US7271084 Reinforced solder bump structure and method for forming a reinforced solder bump
09/18/2007US7271039 Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method
09/18/2007US7271028 High density electronic interconnection
09/18/2007US7271016 Methods and apparatus for a flexible circuit interposer
09/18/2007US7270845 dielectric compositions for forming dielectric layers that can be used as circuitized substrates and particularly those used in multilayered circuit boards, chip carriers, and the like; comprising: a cured epoxy resin material; and a particulate filler
09/18/2007US7270712 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
09/18/2007US7270398 Circuit board and liquid discharging apparatus
09/18/2007US7270274 Imaging module comprising support post for optical reader
09/18/2007US7269899 Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
09/18/2007US7269891 High density, zero-height, free floating interconnect system
09/18/2007CA2331813C Circuit board of protective circuit for storage battery, protective circuit device for storage,and storage battery pack
09/13/2007WO2007103949A2 Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores
09/13/2007WO2007102643A1 Circuit board for a solenoid valve manifold
09/13/2007WO2007102366A2 Device and connecting method
09/13/2007WO2007101825A1 Optoelectronic module
09/13/2007US20070212934 Circuit Board With At Least One Connection Bore For A Connection Wire Or Pin Of A Wired Electronic Component
09/13/2007US20070212914 Discrete electronic component and related assembling method
09/13/2007US20070212906 Thin multichip flex-module
09/13/2007US20070212905 Retaining device for heat sink
09/13/2007US20070212904 Busbar connection module
09/13/2007US20070212903 Non-leaded integrated circuit package system with multiple ground sites
09/13/2007US20070212901 Circuit Board With Holding Mechanism For Holding Wired Electronic Components Method For Manufacture Of Such A Circuit Board And Their Use In A Soldering Oven
09/13/2007US20070212564 Silver Powder Coated With Silver Compound And Method for Producing The Same
09/13/2007US20070211427 Shielding box
09/13/2007US20070210435 Stacked microelectronic dies and methods for stacking microelectronic dies
09/13/2007US20070210393 Lithographic Method Products Obtained And Use Of Said Method
09/13/2007US20070209831 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/13/2007US20070209830 Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
09/13/2007US20070209829 Suspension board with circuit
09/13/2007US20070209828 Small Form Factor PCBA Process Carrier
09/13/2007US20070209475 Flaky Copper Powder, Method For Producing The Same, And Conductive Paste
09/13/2007US20070209202 Method For the Production of Circuit Boards and/or Corresponding Constructs
09/13/2007DE202004021310U1 Gedruckte Leiterplatte und Aufbau mit schrägen Durchkontakten Printed circuit board and structure with sloping vias
09/13/2007DE112005000401T5 Systeme und Verfahren zur Erfassung von Fehlern in aufgedruckter Lötpaste Systems and methods for detecting errors in printed solder paste
09/13/2007DE102006010802A1 Optoelektronisches Modul The optoelectronic module
09/13/2007DE102005013763B4 Herstellungsverfahren für eine Anordnung zur Wärmeableitung A method for manufacturing an arrangement for heat dissipation
09/13/2007DE102005013123B4 Elektronischer Schalter für Hochfrequenz-Verbindungen Electronic switch for high frequency connections
09/13/2007DE10113474B4 Elektrische Schaltung Electrical circuit
09/12/2007EP1833285A1 Electronic component mounting method and electronic component mounting structure
09/12/2007EP1833284A1 System and Method for Assembling Components in an Electronic Device
09/12/2007EP1833101A2 Backlight unit equipped with light emitting diodes
09/12/2007EP1833088A1 Method of forming a crack-free connection between a heat sink and a substrate plate
09/12/2007EP1832148A1 Circuit boards
09/12/2007EP1832146A1 Semifinished product and support component based on said semifinished product
09/12/2007EP1348322B1 Interconnecting module for the base of electronic equipment casing
09/12/2007EP1281298B1 Circuit card assembly having controlled vibrational properties
09/12/2007EP0883173B1 Circuit board for mounting electronic parts
09/12/2007CN200947702Y Circuit board with soldering pad
09/12/2007CN200947476Y Motherboard and subcard interlinking system, middle installed backboard and extended connector
09/12/2007CN101036421A Solderless component packaging and mounting
09/12/2007CN101036226A Cooled integrated circuit
09/12/2007CN101036199A Conductive ink
09/12/2007CN101035419A Assembly having a structure for clamping the harnesses, image forming device, audio-video device, computer and household appliance
09/12/2007CN101035412A Method for manufacturing substrate by imprinting
09/12/2007CN101035411A 存储器模块 Memory Modules
09/12/2007CN101035410A 印刷电路板 A printed circuit board
09/12/2007CN101035409A LED backlight module circuit board for improving the heat radiation efficiency and its making method
09/12/2007CN101035408A 电路板 Circuit board
09/12/2007CN101035407A Printed circuit board having metal core
09/12/2007CN101035406A Embedded capacitor core having multilayer structure
09/12/2007CN101034216A 显示单元 The display unit
09/12/2007CN101033327A Resin composition and presoaking material, copper coating plate for printed circuit and printed circuit board using the same
09/12/2007CN100337515C Printed circuit board for connecting with external connector
09/12/2007CN100336864C 环氧树脂组合物 The epoxy resin composition
09/12/2007CN100336838C Epoxy resin compositions, methods of preparing, and articles made therefrom
09/12/2007CN100336771C Oxide ceramic material, ceramic substrate employing the same, ceramic laminate device, and power amplifier module
09/12/2007CN100336615C Fractionally collectable product
09/11/2007US7269844 Secure IR communication between a keypad and a token
09/11/2007US7269267 Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same
09/11/2007US7269033 Suppressor device
09/11/2007US7269032 Shielding for EMI-sensitive electronic components and or circuits of electronic devices
09/11/2007US7269031 Board-mounting device
09/11/2007US7269029 Rapid fire test board
09/11/2007US7269028 Trace-pad interface for improved signal quality
09/11/2007US7269022 Low height USB interface connecting device and a memory storage apparatus thereof
09/11/2007US7269021 Smart card containing a carrier body for receiving at least one system component having a plurality of electrical components and uniting electrical functions for operating the smart card
09/11/2007US7268776 Flat panel display with signal transmission patterns
09/11/2007US7268740 Method for forming radio frequency antenna
09/11/2007US7268739 Data processing terminal, parent substrate, child substrate, terminal design apparatus and method, computer program, and information storage medium
09/11/2007US7268637 Low cost RF oscillator devices manufactured from conductive loaded resin-based materials
09/11/2007US7268479 Low cost lighting circuits manufactured from conductive loaded resin-based materials
09/11/2007US7268408 Wiring board, method for manufacturing wiring board and electronic component using wiring board
09/11/2007US7268304 Microelectronic connection components having bondable wires
09/11/2007US7268303 Circuit board, mounting structure of ball grid array, electro-optic device and electronic device
09/11/2007US7268302 Low inductance mount for decoupling capacitors
09/11/2007US7268002 Packaging method, packaging structure and package substrate for electronic parts
09/11/2007US7267926 Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof
09/11/2007US7267883 For use in an electronic raw material for flexible printed circuit boards
09/11/2007US7267755 Multilater; dielectric and electroconductive layers
09/11/2007US7267713 an electroconductive metal, a glass frit of bismuth, boron, silicon, aluminum, zinc and nickel oxides, and an organic vehicle baked onto a glass substrate with a circuit pattern; a defogging glass for automobile windows
09/11/2007US7266888 Method for fabricating a warpage-preventive circuit board
09/11/2007US7266882 Method of manufacturing a miniaturized three- dimensional electric component