Patents for H05K 1 - Printed circuits (98,583)
12/2007
12/06/2007US20070279874 PC card kit and PC card
12/06/2007US20070279873 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
12/06/2007US20070279518 Optical Module
12/06/2007US20070278676 Process for reforming a plastic packaged integrated circuit die and a reformed plastic packaged integrated circuit die
12/06/2007US20070278654 Method of making an electronic package
12/06/2007US20070278002 Method and apparatus for a low thermal impedance printed circuit board assembly
12/06/2007US20070278001 Method and apparatus for a high frequency coaxial through hole via in multilayer printed circuit boards
12/06/2007US20070278000 Component-embedded printed wiring board, manufacturing method for component-embedded printed wiring board, and electronic apparatus
12/06/2007US20070277999 Circuit board and electrical connection box having the same
12/06/2007US20070277998 Printed wiring board, its manufacturing method, and electronic equipment
12/06/2007US20070277997 Substrate and layout method
12/06/2007DE102007024435A1 Multi-layer plate, has electrical device connected with one of the intermediate layer connectors and/or conductive samples and including electrode made of material that has melting point higher than temperature in heating process
12/06/2007DE102006024466A1 Support carrier for electronic light sensitive sensors of camera, has mechanical coding corresponding to mechanical coding on circuit board
12/06/2007CA2650108A1 Electrical assembly
12/05/2007EP1863327A1 Process for producing wiring board, and wiring board
12/05/2007EP1863326A1 Printed wiring board
12/05/2007EP1863131A2 High frequency bus system
12/05/2007EP1863130A2 High frequency bus system
12/05/2007EP1862493A1 Prepreg and conductive layer-laminated substrate for printed wiring board
12/05/2007EP1862041A2 Printed circuit for five leds in series
12/05/2007EP1861867A1 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
12/05/2007EP1861651A1 Flat illuminating device
12/05/2007EP1757174A4 High current charge pump for intelligent power switch driver
12/05/2007EP1561243B1 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and microelectromechanical technologies on low loss substrates
12/05/2007EP1359175B1 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
12/05/2007EP1070389B1 Component carrier
12/05/2007EP1050077B1 High-density computer modules with stacked parallel-plane packaging
12/05/2007CN200987236Y PCB printed inductor
12/05/2007CN200987146Y Duplex filter and printed circuit boards having the same
12/05/2007CN101084703A Multilayer printed circuit board and method for manufacturing same
12/05/2007CN101084608A Electrical power connector
12/05/2007CN101083897A Electromagnetic shielding device and method for making the same
12/05/2007CN101083895A Re-workable heat sink attachment assembly
12/05/2007CN101083876A Nano spraying circuit board producing method and equipment and material configuration
12/05/2007CN101083874A Display apparatus and circuit apparatus
12/05/2007CN101083873A 电路板产品与印刷电路板 Circuit board products and printed circuit board
12/05/2007CN101083872A Printed wiring board, its manufacturing method, and electronic equipment
12/05/2007CN101083871A Transmission line design for cross groove structure
12/05/2007CN101083870A Circuit board arrangement
12/05/2007CN101083256A Semiconductor device
12/05/2007CN101083246A Electric connection distributing structure for passive element
12/05/2007CN101083245A Semiconductor package structure for integrated passive element
12/05/2007CN101083232A Rfid tag and method of manufacturing the same
12/05/2007CN101083213A Method and structure for preparing printed circuit board for light emitting diode
12/05/2007CN101083082A Carriage assembly and storage medium drive
12/05/2007CN101082773A Photo- and thermo-setting solder resist composition and printed wire board using same
12/05/2007CN101082738A 背光模块 Backlight module
12/05/2007CN101082412A Illuminating apparatus
12/05/2007CN101081921A Resin composition for printed wiring board film and use thereof
12/05/2007CN101081903A Prepreg and conductive layer-laminated substrate for printed wiring board
12/05/2007CN100353819C Copper foil on thin-film for integrated circuit chip, plasma displaying device or high-efficient printing circuit board
12/05/2007CN100353818C 信号传输结构 Signal transmission structure
12/05/2007CN100353817C Pin-free socket compatible with optical-electrical interconnects
12/05/2007CN100353539C LSI packaging and assembly method thereof
12/05/2007CN100353472C Wiring substrate, input device using the same wiring substrate, and method of manufacturing the same input device
12/05/2007CN100353375C Chipcard and method for production of a chipcard
12/04/2007US7305509 Method and apparatus for zero stub serial termination capacitor of resistor mounting option in an information handling system
12/04/2007US7305222 Radio frequency integrated circuit having reduced receiver noise levels
12/04/2007US7304913 Drug delivery management system
12/04/2007US7304857 Sensor node and circuit board arrangement
12/04/2007US7304856 Assembly for holding circuit cards
12/04/2007US7304500 Programmable logic module and upgrade method thereof
12/04/2007US7304377 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
12/04/2007US7304364 Embossed mask lithography
12/04/2007US7304249 Bonding pads for a printed circuit board
12/04/2007US7304248 Multi-layer printed circuit board and method for manufacturing the same
12/04/2007US7304247 Circuit board with at least one electronic component
12/04/2007US7303978 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
12/04/2007US7303932 Support body for semiconductor element, method for manufacturing the same and semiconductor device
12/04/2007US7303811 Porous insulating film and its laminates
12/04/2007US7303698 Thick film conductor case compositions for LTCC tape
12/04/2007US7303640 Orientation equipment with multiple PCBS
12/04/2007US7303337 Optical communications module
12/04/2007US7303262 Ink jet printhead chip with predetermined micro-electromechanical systems height
12/04/2007US7303138 Integrated circuit card having staggered sequences of connector terminals
12/04/2007US7303113 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
12/04/2007US7302757 Micro-bumps to enhance LGA interconnections
12/04/2007US7302756 Bond finger on via substrate, process of making same, package made thereby, and method of assembling same
12/04/2007CA2437781C Method for manufacturing metal powder
12/04/2007CA2432507C High efficiency three port circuit
12/04/2007CA2356943C Electrically conductive ceramics
11/2007
11/29/2007WO2007135997A1 Printed board
11/29/2007WO2007135972A1 Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier sheet
11/29/2007WO2007135879A1 Circuit board device, wiring board connecting method, and circuit board module device
11/29/2007WO2007106642A3 Method for forming embedded capacitors on a printed circuit board, and resultant printed circuit board
11/29/2007US20070275578 Wiring board, mount structure, and method for manufacturing the same
11/29/2007US20070275577 Circuit board
11/29/2007US20070275576 Detachable lamp socket
11/29/2007US20070275250 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent
11/29/2007US20070275222 Porous insulating film and its laminates
11/29/2007US20070274060 Wiring board, semiconductor device, and method for manufacturing wiring board
11/29/2007US20070274056 Circuit Assembly and Method of its Manufacture
11/29/2007US20070274055 Surface Mountable Device
11/29/2007US20070274047 Ai/Ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/Ain Joint Material
11/29/2007US20070273820 Liquid crystal display module
11/29/2007US20070273605 Method for forming radio frequency antenna
11/29/2007US20070272437 Printed circuit board and semiconductor package using the same
11/29/2007US20070272436 Printed circuit board unit
11/29/2007US20070272435 Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
11/29/2007US20070272434 Printed circuit board and manufacturing method thereof