Patents for H05K 1 - Printed circuits (98,583)
11/2007
11/29/2007US20070272433 Electrical assembly
11/29/2007US20070272124 Polyimide film
11/29/2007US20070271782 Electrical Multilayer Component with Solder Contact
11/29/2007DE4434846B4 Keramisches Formteil mit einem Prägemuster, Verfahren zu dessen Herstellung sowie seine Verwendung Ceramic molding with an embossing pattern, to processes for its preparation and its use
11/29/2007DE19980532B4 Verbindung eines Punktes einer elektronischen Karte mit gedruckter Schaltung auf einem diese Karte tragenden metallischen Substrat One point connected to an electronic card with printed circuit on a supporting this card metallic substrate
11/29/2007DE10353676B4 Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten A process for producing an ultra-thin module with rough contacts
11/29/2007DE10240730B4 Leiterplatte, Speichermodul und Herstellungsverfahren PCB, memory module and manufacturing method
11/29/2007DE102005023977B4 Vorrichtung und Verfahren zum Herstellen einer Vorrichtung Apparatus and method for manufacturing a device
11/29/2007DE102004018483B4 Verfahren zum Aufbringen von Beschichtungen auf bandförmigen Strukturen in der Halbleiterbauteilefertigung und Verwendung einer Vorrichtung zum Aufbringen von Beschichtungen auf bandförmigen Strukturen A method for applying coatings to the band-shaped structures in the semiconductor devices fabrication and use of an apparatus for applying coatings on strip-shaped structures
11/29/2007DE10066293B4 Induktiver Sensor Inductive sensor
11/28/2007EP1860691A1 Electronic circuit and method for manufacturing same
11/28/2007EP1860487A1 Liquid crystal television and panel-type display device
11/28/2007EP1860152A1 Cyclic olefin resin composition, and substrate provided from said resin composition
11/28/2007EP1859661A1 Rigid/flexible printed circuit board
11/28/2007EP1859490A1 Composite films suitable for use in opto-electronic and electronic devices
11/28/2007EP1859352A2 Advanced mezzanine card adapter
11/28/2007EP1859238A1 Solar sensor in mid-technology
11/28/2007EP1546819A4 Power control for instrumented medication package
11/28/2007EP1342294B1 I-channel surface-mount connector
11/28/2007CN200983720Y 传感器装置 The sensor device
11/28/2007CN200983719Y Welding tray on PCB
11/28/2007CN200983718Y Mainboard
11/28/2007CN200983717Y Intensity compensation structure for flexible circuit board and flexible circuit board with intensity compensation structure
11/28/2007CN200980665Y Human fat balance polar plate and PCB connecting structure
11/28/2007CN101080958A Component-containing module and method for producing the same
11/28/2007CN101080957A Laminate for flexible printed wiring boards
11/28/2007CN101080956A Printed wiring board
11/28/2007CN101080193A Method for making a miniaturized device in volume
11/28/2007CN101080162A Electromagnetic shielding soft base material
11/28/2007CN101080146A A method for making L2 blind hole of high-density interconnection circuit board
11/28/2007CN101080144A A method for making elastic circuit with the non-weaving cloth as base
11/28/2007CN101080142A Method for welding electronic part on base board
11/28/2007CN101080141A Printed circuit board unit
11/28/2007CN101080140A Soft printed circuit board and LCD module with this soft printed circuit board
11/28/2007CN101080139A Etched capacitor laminate for reducing electrical noise
11/28/2007CN101080138A Printed wiring board, method for forming the printed wiring board, and board interconnection structure
11/28/2007CN101080137A Multilayer printed circuit board and liquid crystal display unit
11/28/2007CN101080136A Printed circuit board and manufacturing method thereof
11/28/2007CN101080135A Damp-proof structure of circuit board
11/28/2007CN101080134A Printed circuit board for flat panel display, flat panel display having the same, and method thereof
11/28/2007CN101079439A Wiring board, electronic device, electrooptical device, and electronic apparatus
11/28/2007CN101079414A Module for utilizing two light emitting parts to mix into three-wave long white light and adjusting color temperature
11/28/2007CN101079407A Wiring board, method for manufacturing the same, and semiconductor device
11/28/2007CN101077962A Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board
11/28/2007CN101077956A Welding resistant agent composition for flexible substrate, flexible substrate and preparation method for the flexible substrate
11/28/2007CN100352320C Polyimide metal laminate
11/28/2007CN100352319C Circuit board with pin made of resin
11/28/2007CN100352318C Wiring board and magnetic disk apparatus
11/28/2007CN100352317C Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment
11/28/2007CN100352056C Optical device and production method thereof
11/28/2007CN100352049C Optimized electronic package
11/28/2007CN100352027C Method for manufacturing an electronic circuit device and electronic circuit device
11/28/2007CN100351863C Method for making a microcircuit card
11/28/2007CN100351688C Liquid crystal display
11/28/2007CN100351203C Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition
11/27/2007US7302621 High spread highly randomized generatable interleavers
11/27/2007US7302239 Wireless receiving device
11/27/2007US7302175 Lens barrel for camera
11/27/2007US7301781 Semiconductor module
11/27/2007US7301780 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
11/27/2007US7301776 Light-weight flash hard drive with plastic frame
11/27/2007US7301759 Portable electronic product with a bracket
11/27/2007US7301748 Universal energy conditioning interposer with circuit architecture
11/27/2007US7301531 Optical mouse having image lights source with different colors
11/27/2007US7301230 Circuit board with a thin-film layer configured to accommodate a passive element
11/27/2007US7301228 Semiconductor device, method for manufacturing same and thin plate interconnect line member
11/27/2007US7301108 Multi-layered interconnect structure using liquid crystalline polymer dielectric
11/27/2007US7301107 Semiconductor device having reduced intra-level and inter-level capacitance
11/27/2007US7301106 Image forming apparatus and electronic apparatus
11/27/2007US7301105 Printed wiring boards possessing regions with different coefficients of thermal expansion
11/27/2007US7301104 Double-sided flexible printed circuits
11/27/2007US7301103 Printed-wiring board, printed-circuit board and electronic apparatus
11/27/2007US7301102 Elevated track for support of signal lines on a printed circuit board assembly
11/27/2007US7301097 Printed-circuit board and electronic device
11/27/2007US7300972 Aromatic polyimides and which exhibits low reduction in heat resistance thermal decomposition temperature) and mechanical properties (elongation)
11/27/2007US7300897 porcelain composition comprising oxides of calcium, magnesium, silicon, bismuth, lithium, and optionally co-sintered with silver, gold and copper, having a low dielectric constant and loss for high frequency use in semiconductors or printed circuits
11/27/2007US7300865 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
11/27/2007US7300703 Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices
11/27/2007US7300615 High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials
11/27/2007US7300211 Device for sending or receiving optical signals
11/27/2007US7299964 Method and apparatus to create electrical junctions for information routing in textile structures
11/27/2007US7299546 Method for manufacturing an electronic module
11/22/2007WO2007133074A1 A process for preparing a heatsink system and heatsink system obtainable by said process
11/22/2007WO2007132751A1 Optoelectric hybrid film and electronic apparatus receiving the same
11/22/2007WO2007132722A1 Electronic component and method for manufacturing the same
11/22/2007WO2007132529A1 Metal composite film and process for producing the same
11/22/2007WO2007132301A1 Circuit connectors
11/22/2007WO2007131916A1 Process for determining the wetting capability of a soldering material
11/22/2007US20070270000 Memory card connector with improved foldable baffler
11/22/2007US20070269665 Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board
11/22/2007US20070268677 System and method for processor power delivery and thermal management
11/22/2007US20070268676 Driving circuit for illuminating and protecting multiple discharge lamps with trace-to-trace capacitance
11/22/2007US20070268675 Electronic device substrate, electronic device and methods for fabricating the same
11/22/2007US20070268087 High speed, controlled impedance air dielectric electronic backplane systems
11/22/2007US20070267217 Method for manufacturing a miniaturized three-dimensional electric component
11/22/2007US20070267216 Base of a circuit board with a heat dissipating capability
11/22/2007US20070267138 Methods for Fabricating Three-Dimensional All Organic Interconnect Structures
11/22/2007US20070267136 Method for Manufacturing an Electronics Module
11/22/2007US20070266558 Electronic Component and Method of Producing the Same
11/22/2007DE202007013457U1 Anordnung einer Diode auf einer Leiterplatte Arrangement of a diode on a printed circuit board