Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2007
11/14/2007EP1855513A1 Expandable modular rack design
11/14/2007EP1855512A1 Assembly of a circuit board and a contact support which is held in a fixed spacing thereto
11/14/2007EP1855511A1 A process for preparing a heatsink system and heatsink system obtainable by said process
11/14/2007EP1855510A1 Flexible layer system
11/14/2007EP1855331A2 Wiring and organic transistor and manufacturing method thereof
11/14/2007EP1854342A1 Flexible electronic device
11/14/2007EP1854168A1 Film antenna for a motor vehicle
11/14/2007EP1396050A4 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials
11/14/2007EP1383458B1 Receiving device for drug blisters
11/14/2007EP1275696B1 Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal-clad laminate
11/14/2007EP1185153B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
11/14/2007EP1090401B1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor
11/14/2007EP0853342B1 Connecting structure between wiring board and plug member
11/14/2007CN200976711Y Flexible circuit based high-speed photoelectric devices
11/14/2007CN200976710Y Circuit welded plate
11/14/2007CN200976709Y Circuit board stack structure capable of suppressing electromagnetic radiation
11/14/2007CN200975614Y LED sheet material and LED lamps wick composed of same
11/14/2007CN101073191A Voltage regulator and method using substrate board with insulator layer and conductive traces
11/14/2007CN101072471A Glass circuit board and its manufacturing method
11/14/2007CN101072470A Glass circuit board and its manufacturing method
11/14/2007CN101072469A Trans-slot high-speed signal transmission line structure
11/14/2007CN101072468A Flexible printed circuit board substrate
11/14/2007CN101072467A Component-embedded board device and faulty wiring detecting method for the same
11/14/2007CN101072466A Soldering structure of through hole
11/14/2007CN101071812A Light-emitting diode packaging module
11/14/2007CN101071811A Semiconductor device, related method and printed circuit board
11/14/2007CN101071808A Optimized wire bonding of an integrated modulator and laser diode on a mount
11/14/2007CN101071118A Electronic device substrate, method for manufacturing substrate, compound, method for manufacturing same
11/14/2007CN101070603A Method for making electrochemical oriented growth Al2O3 super-thin film substrate
11/14/2007CN100349348C Offset pathway arrangements for energy conditioning
11/14/2007CN100349236C Mounting for electrical circuit in particular electrial breaker
11/14/2007CN100348411C Aluminium compoiste material for drilling lubrication
11/13/2007US7296299 Tamper-evident and/or tamper-resistant electronic components
11/13/2007US7295439 Heat sink fastening assembly
11/13/2007US7295196 Liquid crystal display panel with signal transmission patterns
11/13/2007US7295189 Printable electromechanical input means and an electronic device including such input means
11/13/2007US7295083 Structure for electromagnetically shielding a substrate
11/13/2007US7295034 Signal transmitting device suited to fast signal transmission
11/13/2007US7294929 Solder ball pad structure
11/13/2007US7294928 Components, methods and assemblies for stacked packages
11/13/2007US7294921 System-on-a-chip with multi-layered metallized through-hole interconnection
11/13/2007US7294909 Electronic package repair process
11/13/2007US7294905 Thin film capacitor and electronic circuit component
11/13/2007US7294904 Integrated circuit package with improved return loss
11/13/2007US7294791 Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same
11/13/2007US7294790 Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
11/13/2007US7294587 Component built-in module and method for producing the same
11/13/2007US7294532 Method for manufacturing semiconductor device
11/13/2007US7294529 Method for embedding a component in a base
11/13/2007US7294453 Electronic device manufacture
11/13/2007US7294451 Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
11/13/2007US7294390 Method for improving the thermal cycled adhesion of thick-film conductors on dielectric
11/13/2007US7294289 Conductive powder and method for preparing the same
11/13/2007US7293999 Housing of circuit boards
11/13/2007US7293347 Manufacturing method of head arm assembly
11/13/2007CA2317931C Interconnection unit for electronic components
11/13/2007CA2280115C Low temperature method and compositions for producing electrical conductors
11/13/2007CA2180543C Transmission-line network
11/08/2007WO2007126533A1 Capacitive polyimide laminate
11/08/2007WO2007125994A1 Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolytic copper foil
11/08/2007WO2007125979A1 Resin composition, prepreg, laminate, and wiring board
11/08/2007WO2007125849A1 Substrate joining member and three-dimensional structure using the same
11/08/2007WO2007125789A1 Connection structure and method of producing the same
11/08/2007WO2007125752A1 Article provided with feed circuit board
11/08/2007WO2007125683A1 Article provided with electromagnetically coupled module
11/08/2007US20070260035 Polyimide Resin, Laminate Film, Metal Layer-Bearing Laminate Film, and Semiconductor Device
11/08/2007US20070259542 Electronic Device Capable of Detecting a Category of an External Device and Related Method
11/08/2007US20070259541 Electrical interconnection device having dielectric coated metal substrate
11/08/2007US20070259537 Coated microwave plug connector and cooking appliance with such a microwave plug connector
11/08/2007US20070258676 Optical via to pass signals through a printed circuit board
11/08/2007US20070258225 Printed circuit board and method of manufacturing printed ciruit board
11/08/2007US20070258223 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor
11/08/2007US20070258222 Data processing terminal, parent board, child board, terminal designing apparatus and method, computer program, and information storage medium
11/08/2007US20070258221 Semiconductor Device
11/08/2007US20070257274 Lighting Device And Method
11/08/2007US20070256859 Ceramic multilayer substrate and its manufacturing method
11/08/2007US20070256858 Heat resistant substrate incorporated circuit wiring board
11/08/2007US20070256857 Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste
11/08/2007US20070256856 Terminal Portion of Flexible Print Circuit Board or Flexible Flat Cable
11/08/2007US20070256291 Electronic devices with small functional elements supported on a carrier
11/08/2007DE202007011113U1 Verdrahtungsleiterplatte Wiring board
11/08/2007DE10297237B4 Funtionalisierter Polyphenylenether Funtionalisierter polyphenylene ether
11/08/2007DE102007017005A1 Elektrisch leitende Zusammensetzung, Verfahren zur Herstellung einer elektrisch leitenden Schicht und elektrisch leitende Schicht Electroconductive composition, process for preparing an electrically conductive layer and electrically conductive layer
11/08/2007DE102006060385A1 Wire laying device for use during production of transponder unit , has wire guide for guiding wire in substrate, and melting mechanism for melting wire insulation in area of wire guide, where mechanism is integrated in device
11/08/2007DE10156263B4 Schaltungsanordnung in einem Gehäuse und Verfahren zur Herstellung einer in einem Gehäuse angeordneten Schaltungsanordnung A circuit arrangement in a housing, and method for manufacturing a housing arranged in a circuit arrangement
11/08/2007CA2649841A1 Resin composition, prepreg, laminate, and wiring board
11/07/2007EP1853095A1 Three-dimensional wiring body for mounting electronic component and electronic component mounting structure
11/07/2007EP1852306A1 Lamp with at least one illumination device for vehicles, preferably for motor vehicle
11/07/2007EP1852209A2 Laser machining apparatus and method for manufacturing a multilayered printed wiring board
11/07/2007EP1852208A2 Laser machining apparatus and method for manufacturing a multilayered printed wiring board
11/07/2007EP1852004A2 Recycling printed circuit boards
11/07/2007EP1852003A1 Method for forming electrically conductive patterns on an insulating substrate, and resulting device
11/07/2007EP1851833A1 Differential signal connector with wafer-style construction
11/07/2007EP1741322B1 Method for the production of circuit boards and/or corresponding constructs
11/07/2007EP1652232B1 Multichip circuit module and method for the production thereof
11/07/2007EP1101228A4 Polymer thick-film resistor printed on planar circuit board surface
11/07/2007EP0642699B1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device
11/07/2007CN200973203Y Printed circuit board structure of LED
11/07/2007CN200973202Y 电子元件 Electronic component
11/07/2007CN200973201Y Flexible impedance board
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