| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 10/03/2007 | CN100341146C Semiconductor device and its producing technology |
| 10/03/2007 | CN100341141C Wiring substrate |
| 10/03/2007 | CN100341127C 半导体器件 Semiconductor devices |
| 10/03/2007 | CN100341037C Plasma display apparatus |
| 10/03/2007 | CN100340922C Impression mask photoetching |
| 10/03/2007 | CN100340604C Thermosetting resin composition for high speed transmission circuit board |
| 10/03/2007 | CN100340384C Stamping device for generally flat articles |
| 10/02/2007 | US7278036 System and method for starting up plural electronic devices in an orderly manner |
| 10/02/2007 | US7277104 Video signal skew |
| 10/02/2007 | US7277002 Electronic transformer/inductor devices and methods for making same |
| 10/02/2007 | US7277000 Inductor and transformer |
| 10/02/2007 | US7276986 Method and apparatus for improving signal integrity in a high speed flex cable |
| 10/02/2007 | US7276922 Closed-grid bus architecture for wafer interconnect structure |
| 10/02/2007 | US7276840 Structure with a plurality of substrates, its manufacturing method and crystal oscillator with the structure |
| 10/02/2007 | US7276793 Semiconductor device and semiconductor module |
| 10/02/2007 | US7276791 Board having alternating rows of processors and memories |
| 10/02/2007 | US7276788 Hydrophobic foamed insulators for high density circuits |
| 10/02/2007 | US7276697 Infrared apparatus |
| 10/02/2007 | US7276668 Circuit board with mounting pads for reducing parasitic effect |
| 10/02/2007 | US7276563 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| 10/02/2007 | US7276287 Heating to melt, shaping the melt into the desired form, cooling below the crystalline melting temperature, to obtain an article which displays orientation of the polymer molecules |
| 10/02/2007 | US7276267 The first supporting substrate is a metallizeable plastic and the second supporting substrate a non-metallizeable plastic that is able to be activated by a laser beam to produce a metallization pattern connected with uncovered areas of the first substrate |
| 10/02/2007 | US7276185 Easily ensure the conductivity at the same level as an Ag bulk by a low temperature treatment |
| 10/02/2007 | US7275937 Optoelectronic module with components mounted on a flexible circuit |
| 10/02/2007 | US7275562 Extensible spiral for flex circuit |
| 10/02/2007 | US7275316 Method of embedding passive component within via |
| 10/02/2007 | US7275298 Ultrasonic printed circuit board transducer |
| 10/02/2007 | CA2402552C Electrocatalyst powders, methods for producing powders and devices fabricated from same |
| 10/02/2007 | CA2211875C Low dielectric loss glasses |
| 09/29/2007 | CA2582850A1 Zero parts strain relief |
| 09/29/2007 | CA2582704A1 Shield, and printed circuit board and electrical apparatus employing the same |
| 09/27/2007 | WO2007109773A2 Electromagnetic interference containment in a transceiver module |
| 09/27/2007 | WO2007108539A1 Flexible wiring board and heat seal connector |
| 09/27/2007 | WO2007108242A1 Epoxy resin curable composition for prepreg |
| 09/27/2007 | WO2007108207A1 Circuit board and connection substrate |
| 09/27/2007 | WO2007108188A1 Electroconductive ink |
| 09/27/2007 | WO2007108087A1 Insulating resin layer, insulating resin layer with carrier and multilayer printed wiring board |
| 09/27/2007 | WO2007107630A1 Manufacture of a circuit board and circuit board containing a component |
| 09/27/2007 | WO2007087981B1 Flexible printed circuit board with additional functional element and a milled notch, method of production and use |
| 09/27/2007 | WO2007079156A3 Substrates for electronic circuitry type applications |
| 09/27/2007 | WO2005091817A3 Method and apparatus for venting an electronic control module |
| 09/27/2007 | US20070225409 Method for Production Thermoplastic Resin Composition Containing Ultrafine Particles |
| 09/27/2007 | US20070224857 Cap for an electrical connector |
| 09/27/2007 | US20070224856 Positioning method and board |
| 09/27/2007 | US20070224854 Memory module, method of manufacturing a memory module and computer system |
| 09/27/2007 | US20070224853 Apparatus and method for environmentally isolated analysis |
| 09/27/2007 | US20070224852 Shielded electrical harness with an angled connector, and its method of fabrication |
| 09/27/2007 | US20070224851 Electromagnetic interference containment in a transceiver module |
| 09/27/2007 | US20070224850 Plug connection adapter |
| 09/27/2007 | US20070224735 Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus |
| 09/27/2007 | US20070224731 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 09/27/2007 | US20070224511 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment |
| 09/27/2007 | US20070222083 RF and MMIC stackable micro-modules |
| 09/27/2007 | US20070222062 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 09/27/2007 | US20070221931 Optoelectronic semiconductor device and light signal input/output device |
| 09/27/2007 | US20070221405 Multi-layer circuit board having ground shielding walls |
| 09/27/2007 | US20070221403 Signal transmission structure, package structure and bonding method thereof |
| 09/27/2007 | US20070221402 Soft wire bank joint device |
| 09/27/2007 | US20070221401 Releasably mountable electronics component |
| 09/27/2007 | US20070221400 Multilayer interconnection substrate, semiconductor device, and solder resist |
| 09/27/2007 | US20070221399 Electronic component and its manufacturing method |
| 09/27/2007 | US20070221398 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device |
| 09/27/2007 | US20070221315 Common carrier |
| 09/27/2007 | US20070220745 Method for Producing Traverse Connections in Printed Circuit Board Sets |
| 09/27/2007 | DE112005002368T5 Eine Vorrichtung und ein Verfahren zum Verbessern der Signalebenenübergänge bei gedruckten Schaltkarten An apparatus and a method for improving the signal level transitions in printed circuit boards |
| 09/27/2007 | DE10229692B4 Leiterplatte, Mehrchippackung und zugehöriges Herstellungsverfahren PCB, multi-chip package and manufacturing method thereof |
| 09/27/2007 | DE102006013825A1 Leiterplatten-Nutzen bzw. Leiterplatte mit Bauteilfixierung PCB benefit or printed circuit board with component fixation |
| 09/27/2007 | DE102006013206A1 Backplane for electronic subrack, has base backplane comprising contact strips, expansion space provided on base backplane, and additional backplane that is insertable into expansion space |
| 09/27/2007 | DE102006010071B3 Vorrichtung zur Stromverteilung Apparatus for power distribution |
| 09/27/2007 | DE102005021247B4 Eigenschaftsmessverfahren für Hochfrequenzschaltung, Kalibriermuster und Kalibriervorrichtung Property Measuring method for high frequency circuit calibration pattern and calibration |
| 09/26/2007 | EP1838141A1 Laminated body and method for producing the same |
| 09/26/2007 | EP1687831B1 Functional paste |
| 09/26/2007 | EP1604178A4 Liquid level sending unit with flexible sensor board |
| 09/26/2007 | EP1448316A4 Hot melt conductor paste composition |
| 09/26/2007 | CN200953710Y Electronic equipment with image picking function |
| 09/26/2007 | CN200953688Y Hard circuit board and vibrating motor with the same hard circuit board |
| 09/26/2007 | CN200953687Y Collecting device and circuit board with the same device |
| 09/26/2007 | CN200953686Y Circuit board with diversion sheet metal |
| 09/26/2007 | CN200953685Y Aluminium-base insulating oxidized magnetic control sputtering metallized circuit board |
| 09/26/2007 | CN200953684Y 软性印刷线路板fpc Fpc flexible printed circuit board |
| 09/26/2007 | CN200953683Y Flexible printed circuit board FPC |
| 09/26/2007 | CN200953260Y Protecting device for preventing elements damage |
| 09/26/2007 | CN200952660Y Soft linear LED light source |
| 09/26/2007 | CN101044802A Method for mounting an electronic component on a preferably soft support, and resulting electronic enitity, such as a passport |
| 09/26/2007 | CN101044801A Circuit board assembly with reduced capacitive coupling |
| 09/26/2007 | CN101043796A Electronic device combined plurality of connecting ports as shell structure |
| 09/26/2007 | CN101043793A Connection device |
| 09/26/2007 | CN101043792A Flexible PCB embedded in portable terminal machine and its manufacturing method |
| 09/26/2007 | CN101043791A Insulation structure for high thermal condition and its manufacturing method |
| 09/26/2007 | CN101043790A Multilayer printed wiring board and method of measuring characteristic impedance |
| 09/26/2007 | CN101043789A Heat radiating device |
| 09/26/2007 | CN101043788A Printed circuit boards |
| 09/26/2007 | CN101043787A Wiring board in which silver is deposited near via-conductor and method for manufacturing wiring board |
| 09/26/2007 | CN101043112A Cross talk reduction for electrical connectors |
| 09/26/2007 | CN101043111A Cross talk reduction for electrical connectors |
| 09/26/2007 | CN101043073A Battery seat and circuit board with this battery seat |
| 09/26/2007 | CN101042946A Silver alloy material, circuit board, electronic device and method of producing circuit board |
| 09/26/2007 | CN101042875A Magnetic head folding tabs assembly, flexible printed circuit thereof and testing method |
| 09/26/2007 | CN100340142C Deformation-resistant mounting for a circuit board in a portable device |
| 09/26/2007 | CN100340140C Flexible printed circuit board and process for producing the same |