Patents for H05K 1 - Printed circuits (98,583)
07/2007
07/25/2007CN1328784C COF flexible printed circuit board and method for making said circuit board
07/25/2007CN1328775C Shadow-creating apparatus
07/25/2007CN1328769C COF film carrier tape and its manufacturing method
07/25/2007CN1328756C Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
07/25/2007CN1328733C Conductor for flat cabal and its producing method and flat cabal
07/25/2007CN1328196C Etching solution for forming an embedded resistor
07/25/2007CN101006612A High speed differential transmission structures without grounds
07/25/2007CN101006352A Substrate with patterned conductive layer
07/25/2007CN101006128A Ethoxysilane containing fiberglass binder
07/25/2007CN101005948A Metal clad white laminated body
07/25/2007CN101005750A Heat sink
07/25/2007CN101005732A 印刷电路板组件 Printed circuit board assembly
07/25/2007CN101005731A EMI supppression method for audio frequency signal
07/25/2007CN101005730A Circuit board for reducing electromagnetic interference of electronic product
07/25/2007CN101005729A Interconnect structure for transducer assembly
07/25/2007CN101004979A Double layer capacitor and its combination and method for mounting it on print circuit board
07/25/2007CN101004870A Power supply circuit and image display apparatus using the same
07/25/2007CN101004248A Plate type light fixture of light emitting diode
07/25/2007CN101003690A Heat radiation insulation resin composition and printing circuit board using same
07/24/2007US7249338 High speed bus with radio frequency microstrip
07/24/2007US7249337 Method for optimizing high frequency performance of via structures
07/24/2007US7248903 Mobile instrument with flexible printed wiring board
07/24/2007US7248756 Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry
07/24/2007US7248483 High power density insulated metal substrate based power converter assembly with very low BUS impedance
07/24/2007US7248482 Module with built-in circuit component and method for producing the same
07/24/2007US7248473 Printed circuit board having larger space for electronic components and contributing to efficient cooling
07/24/2007US7248355 Using special visibility materials proximate candidate component locations to enhance recognition
07/24/2007US7248134 Inductor and capacitor formed of build-up vias
07/24/2007US7247945 Semiconductor apparatus
07/24/2007US7247942 Techniques for joining an opto-electronic module to a semiconductor package
07/24/2007US7247941 Printed circuit board assembly with strain-alleviating structures
07/24/2007US7247938 Carrier, method of manufacturing a carrier and an electronic device
07/24/2007US7247932 Chip package with capacitor
07/24/2007US7247800 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder
07/24/2007US7247682 Thermosetting resin and photocurable resin, suitable for use in electronics requiring low dielectric constant, low dielectric loss at tangent and high toughness
07/24/2007US7247590 Blend of liquid crystalline aromatic polyester and dielectric ceramics
07/24/2007US7247363 Supported greensheet structure and method in MLC processing
07/24/2007US7247178 Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
07/24/2007US7247057 Connector assembly of connector and transmission board
07/24/2007US7247035 Enhanced stress metal spring contactor
07/24/2007US7247032 Electronic device with integral connectors
07/24/2007US7247031 Electric junction box and its assembling process
07/24/2007US7246910 Vehicle rearview mirror system with compass sensor and method of making same
07/24/2007CA2489818C A system for dispensing a viscous material onto a substrate
07/19/2007WO2007080943A1 Three-dimensional circuit board and its manufacturing method
07/19/2007WO2007080927A1 Fixer, surface-mount component using the fixer, and mounting structure using the fixer
07/19/2007WO2007080926A1 Inter-substrate bonding chip part, its manufacturing method, and wiring substrate connection method using the same
07/19/2007WO2007080863A1 Semiconductor device, printed wiring board mounted with such semiconductor device, and connection structure for those
07/19/2007WO2007080027A1 Arrangement for cooling power components on printed circuit boards and method for producing the same
07/19/2007US20070167572 Curable dielectric polynorbornene composition and circuit boards made therefrom
07/19/2007US20070167059 Electronic Device with Integral Connectors
07/19/2007US20070167041 Modules forfixing flexible printed circuit boards and flat display devices utilizing the same
07/19/2007US20070167040 Electric junction box
07/19/2007US20070167039 Portable computer
07/19/2007US20070167037 Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board
07/19/2007US20070167034 Method for minimizing the instalation height of electrical components
07/19/2007US20070166886 Method for manufacturing an electronic module
07/19/2007US20070166876 Components, methods and assemblies for multi-chip packages
07/19/2007US20070166558 Writable and printable colloidal gold solution
07/19/2007US20070165990 Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof
07/19/2007US20070165390 Printed circuit board
07/19/2007US20070165388 Interconnection pattern design
07/19/2007US20070165364 Optimization of the number of power outputs for an integrated circuit
07/19/2007US20070164450 Integrated circuit (IC) carrier assembly with suspension means
07/19/2007US20070164260 Mixed conductive power and use thereof
07/19/2007US20070163801 Patch panel with modules
07/19/2007US20070163358 Board deflection metrology using photoelectric amplifiers
07/19/2007US20070163111 Method for manufacturing a multilayer flexible wiring board
07/19/2007DE202007006461U1 Befestigung für Kühlkörper Attachment for heat sink
07/19/2007DE202006004369U1 Abdeckblech für elektronische Baugruppen mit Antenne und Chip zur Identifizierung per Hochfrequenz Cover plate for electronic modules with antenna and chip for identification by high-frequency
07/19/2007DE10210286B4 Bei Niedrigtemperatur gebrannte Porzellangegenstände und ihre Verwendung für elektronische Bauteile Fired at a low temperature porcelain objects and their use for electronic components
07/19/2007DE102006000935A1 Monolithisches keramisches Bauelement und Verfahren zur Herstellung Monolithic ceramic component and methods for making
07/19/2007DE102006000852A1 Drahtverlegevorrichtung und Verfahren zur Verlegung eines Antennendrahtes Wire-laying apparatus and method of installing an antenna wire
07/19/2007DE102005059651A1 Einrichtung zum Schutz gestanzter Leiterbahnen Means for protecting punched conductor tracks
07/18/2007EP1809083A2 Multilayer printed circuit board
07/18/2007EP1808058A1 Method for producing a three-dimensional circuit
07/18/2007EP1773928A4 Ethoxysilane containing fiberglass binder
07/18/2007EP1517794A4 Ink jet printhead chip with predetermined micro-electromechanical systems height
07/18/2007CN2925006Y Electric automobile controller electrolytic capacitor fixing device
07/18/2007CN2925005Y Circuit board structure improvement capable of jointing radiator
07/18/2007CN2925004Y Welded body and circuit board
07/18/2007CN1327749C Method for processing hole on ceramic sheet
07/18/2007CN1327748C Solder structure and soldering method of electronic assembly
07/18/2007CN1327747C Circuit board assembly and disc coil
07/18/2007CN1327746C Circuit board device and method for board-to-board connection
07/18/2007CN1327570C Shielded carrier for land grid array connectors and a process for fabricating same
07/18/2007CN1327519C Device package, a printed wiring board, and an electronic apparatus
07/18/2007CN1327515C Circuit board and method of manufacturing the same
07/18/2007CN1327514C Wiring substrate and method of manufacturing the same
07/18/2007CN1327499C Method for mfg. semiconductor assembly
07/18/2007CN1327449C Electronical encapsulation for high frequency semiconductor device
07/18/2007CN1327320C Acoustic wave touch detecting apparatus
07/18/2007CN101002515A Method of manufacturing an electronic circuit assembly using direct write techniques
07/18/2007CN101002512A Metal foil provided with adhesion auxiliary material and printed wiring board using same
07/18/2007CN101002511A Flex-rigid wiring board and manufacturing method thereof
07/18/2007CN101002366A Design and method for plating PCI express (PCIE) edge connector
07/18/2007CN101002320A Integrated circuit module and multi-chip circuit module comprising an integrated circuit module of this type
07/18/2007CN101001502A Key-press welding plate hole of printed circuit board and its hole covering method
07/18/2007CN101001501A Mixed composite substrate
07/18/2007CN101000903A Printed circuit board and method of manufacturing semiconductor package using the same