| Patents for H05K 1 - Printed circuits (98,583) |
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| 10/24/2007 | CN100345466C Multilayer substrate including components therein |
| 10/24/2007 | CN100345440C Imaging apparatus |
| 10/24/2007 | CN100345291C Semiconductor device and electronic device, and methods for manufacturing thereof |
| 10/24/2007 | CN100345279C Component built-in module and method of manufacturing the same |
| 10/24/2007 | CN100345268C 半导体装置 Semiconductor device |
| 10/24/2007 | CN100344725C Luminescent gel coats and moldable resins |
| 10/24/2007 | CN100344695C Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil |
| 10/24/2007 | CN100344528C Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material |
| 10/24/2007 | CN100344445C Bonding layer for bonding resin on copper surface |
| 10/23/2007 | US7286943 In-vehicle electronic device, thermal flowmeter and electronic circuit board |
| 10/23/2007 | US7286370 Wired circuit board and connection structure of wired circuit board |
| 10/23/2007 | US7286367 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board |
| 10/23/2007 | US7286366 Multilayer circuit board with embedded components and method of manufacture |
| 10/23/2007 | US7286365 Electronic substrate for a three-dimensional electronic module |
| 10/23/2007 | US7286361 Heatsink |
| 10/23/2007 | US7286030 Electromagnetic relay |
| 10/23/2007 | US7286029 Passive devices formed in grooves on a substrate and a method of manufacture |
| 10/23/2007 | US7285975 Termination providing apparatus mounted on memory module or socket and memory system using the apparatus |
| 10/23/2007 | US7285917 Connection member and driving device of plasma display panel |
| 10/23/2007 | US7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 10/23/2007 | US7285856 Package for semiconductor devices |
| 10/23/2007 | US7285841 Method of manufacturing signal processing apparatus |
| 10/23/2007 | US7285734 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 10/23/2007 | US7285730 Ceramic circuit board and method for manufacturing the same |
| 10/23/2007 | US7285729 Printed circuit board |
| 10/23/2007 | US7285728 Electronic parts packaging structure and method of manufacturing the same |
| 10/23/2007 | US7285727 Flexible wiring boards for double-side connection |
| 10/23/2007 | US7285507 Ceramic composition being fired at low temperature and having high strength and method for preparing the same, and laminated electronic parts using the same |
| 10/23/2007 | US7285429 Mounting device for high frequency microwave devices |
| 10/23/2007 | US7285321 Vaiations in glass transition temperature between layers; electroconductive layer |
| 10/23/2007 | US7285232 Conductive powder, glass powder and an organic vehicle; for forming a conductor having superior platability and a high density= |
| 10/23/2007 | US7284990 PCB and connector design |
| 10/23/2007 | US7284704 Combined electromagnetic and optical communication system |
| 10/23/2007 | US7284323 Process of fabricating conductive column |
| 10/23/2007 | US7284320 Multilayer printed wiring board and method of manufacturing the same |
| 10/23/2007 | US7284317 Method of producing printed circuit board with embedded resistor |
| 10/23/2007 | US7284311 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 10/18/2007 | WO2007117873A1 Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor |
| 10/18/2007 | WO2007116855A1 Multilayer printed wiring board and method for manufacturing same |
| 10/18/2007 | WO2007116657A1 Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate |
| 10/18/2007 | WO2007116088A1 Glass pane having soldered electrical terminal connections |
| 10/18/2007 | WO2007115520A1 Method for production of an electronic assembly |
| 10/18/2007 | WO2007072379A3 An electronic device, a housing part, and a method of manufacturing a housing part |
| 10/18/2007 | WO2002003422A3 Integrated circuits packaging system and method |
| 10/18/2007 | US20070243729 Electric power supply device for slide structure |
| 10/18/2007 | US20070243728 Communications Connectors with Jackwire Contacts and Printed Circuit Boards |
| 10/18/2007 | US20070243726 Reversible universal serial bus connection interface for USB connectors and universal serial bus ports |
| 10/18/2007 | US20070243459 Method and apparatus for thin-film battery having ultra-thin electrolyte |
| 10/18/2007 | US20070243409 Process for Producing Ceramic Sheet, Ceramic Substrate Utilizing The Same and Use Thereof |
| 10/18/2007 | US20070242440 Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board |
| 10/18/2007 | US20070240901 Wiring board and method for fabricating the same |
| 10/18/2007 | US20070240900 Multilayer printed wiring board and component mounting method thereof |
| 10/18/2007 | US20070240899 Circuit device |
| 10/18/2007 | US20070240303 Printed circuit board including embedded capacitors and method of manufacturing the same |
| 10/18/2007 | DE202007011034U1 Elektronische Baugruppe Electronic assembly |
| 10/18/2007 | DE10341884B4 Flexible Schaltungsträgeranordnung Flexible circuit board assembly |
| 10/18/2007 | DE102007008491A1 Leiterplatte mit innenliegender Duchgangsbohrung und Herstellungsverfahren dafür Circuit board with internal Duch hole and manufacturing method thereof |
| 10/18/2007 | DE102006020600A1 Verfahren und Anordnung zur Positionierung von Hochleistungs-LEDs Method and apparatus for positioning of High Power LEDs |
| 10/18/2007 | DE102006017992A1 Datenträger-/Sendevorrichtung und Verfahren zur Herstellung einer Datenträger-/Sendevorrichtung Disk / transmitting device and method for producing a disc / transmission device |
| 10/18/2007 | DE102006017540A1 Textilsystem mit einer Vielzahl von elektronischen Funktionselementen Textile system including a plurality of electronic function elements |
| 10/18/2007 | DE102006017297A1 Connecting component for use in mobile telephone, has contacting section inserted in conductor substrate retaining recess, where longitudinal end of section is arranged at specific distance from boundary wall |
| 10/18/2007 | DE102006017101A1 Rigid-flexible printed circuit board for electrical device, has sliding bow fastened to contact of multi-contact components e.g. unpackaged power semiconductor, with conductive adhesive that is applied by dosing machine |
| 10/18/2007 | DE102006016964A1 Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe sowie Trägerkörper hierfür A process for preparing an electronic assembly and electronic assembly support body therefor |
| 10/18/2007 | DE102006016090A1 Solder material producing method for e.g. flip-chip-connection between substrate and semiconductor, involves converting surface of passivation layer into finely nubby or slightly wettable surface by surface treatment |
| 10/18/2007 | DE102005051806B4 Lichtleiteranordnung und Leiterplatte An optical fiber assembly and PCB |
| 10/18/2007 | DE102004062885B4 Anordnung mit einer elektronischen Leiterplatte und mindestens einem Halbleiterbaustein und Verfahren Arrangement with an electronic circuit board and at least one semiconductor device and method |
| 10/17/2007 | EP1845766A1 Hold down device |
| 10/17/2007 | EP1845760A1 Connection component, multilayer substrate |
| 10/17/2007 | EP1845759A1 Conductive connecting pin and package substrate |
| 10/17/2007 | EP1509992B1 Circuit arrangement for controlling electromotive driving means of a mobile working machine, particularly of an industrial truck |
| 10/17/2007 | EP1110268B1 Method for vertical connection of conductors in a device in the microwave range |
| 10/17/2007 | EP1023820B1 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
| 10/17/2007 | EP1018146A4 Improved transformer operations |
| 10/17/2007 | CN200962690Y Bending-resistance circuit board |
| 10/17/2007 | CN200962689Y Printed board connection structure |
| 10/17/2007 | CN200962688Y Circuit board with the waterproof layer |
| 10/17/2007 | CN200961826Y LED lumination lamp bulb |
| 10/17/2007 | CN101057531A Single or multi-layer printed circuit board with improved via design |
| 10/17/2007 | CN101057365A 天线组件 Antenna assembly |
| 10/17/2007 | CN101056512A Device with circuit board |
| 10/17/2007 | CN101056506A Casing of encapsulated circuit board |
| 10/17/2007 | CN101056504A Printed circuit board using bump and method for manufacturing thereof |
| 10/17/2007 | CN101056502A Electronic device for avoiding excessive glue pollution |
| 10/17/2007 | CN101056501A Circuit board and manufacturing method thereof |
| 10/17/2007 | CN101056500A Application of epoxy resin-aluminium nitride composite material preparing high density printed circuit board |
| 10/17/2007 | CN101056499A Organic encapsulant compositions for protection of electronic components |
| 10/17/2007 | CN101056498A Wired circuit board assembly sheet |
| 10/17/2007 | CN101056497A 传感器安装结构 Sensor mounting structure |
| 10/17/2007 | CN101056496A 柔性基板 Flexible substrates |
| 10/17/2007 | CN101055863A 线路板与电路结构 Circuit board and the circuit configuration |
| 10/17/2007 | CN101055862A Wiring board, semiconductor device using the same, and method for manufacturing wiring board |
| 10/17/2007 | CN101055859A Catheter core mounting composition for semiconductor component, method of component mounting and semiconductor device |
| 10/17/2007 | CN100344192C 高频开关和无线电通信装置 High-frequency switching and radio communication devices |
| 10/17/2007 | CN100344003C Light source unit |
| 10/17/2007 | CN100343989C 集成电路芯片组件 IC chip assembly |
| 10/17/2007 | CN100343678C Probe for high electric current |
| 10/17/2007 | CN100343313C Method of making liquid crystal polymer films |
| 10/16/2007 | US7283660 Multi-layer printed circuit board fabrication system and method |
| 10/16/2007 | US7283373 Electronic device |
| 10/16/2007 | US7283371 Device carrier system |