Patents for H05K 1 - Printed circuits (98,583)
08/2007
08/22/2007EP1820637A1 Laminate for printed wiring board
08/22/2007EP1820379A1 Communications jack with printed wiring board having self-coupling conductors
08/22/2007EP1820378A1 Communications jack with printed wiring board having paired coupling conductors
08/22/2007EP1820235A1 A stripline arrangement and a method for production thereof
08/22/2007EP1819963A1 Light emitting module, lighting device, and display device
08/22/2007EP1819523A1 Printing screens, machine and method for screen printing
08/22/2007EP1421549B1 A pin pad
08/22/2007EP1377638B1 Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board
08/22/2007EP1269808B1 Method for fabricating electrical connecting elements, and connecting element
08/22/2007CN2938728Y Device for preventing electromagnetic interference
08/22/2007CN2938707Y Shield device
08/22/2007CN2938706Y Fixing device of corner wire
08/22/2007CN2938705Y Welding area of field effect tube
08/22/2007CN2938704Y High frequency circuit board device with synchronmous test function
08/22/2007CN2938703Y Flexible printed circuit board
08/22/2007CN2938702Y Printed circuit board with test point
08/22/2007CN2938461Y Signal interconnection device and signal interconnection system of printed circuit board
08/22/2007CN1333625C Deformation-resistant mounting for a circuit board in a portable device
08/22/2007CN1333624C Deformation-resistant mounting for a circuit board in a portable device
08/22/2007CN1333494C Connector, method for manufacturing the same, and wiring board structure employing it
08/22/2007CN1333460C High-frequency module board device
08/22/2007CN1333459C 电路装置 Circuit device
08/22/2007CN1333132C Collecting agent for glass fiber yarn and method for producing glass fiber yarn
08/22/2007CN1333015C Resin composition
08/22/2007CN1333014C Halogen-free resin composition
08/22/2007CN1332902C High thermal expansion glass and belt composition
08/22/2007CN101023717A 电极基板 The electrode substrate
08/22/2007CN101023716A 柔性印刷配线板 Flexible printed wiring board
08/22/2007CN101023565A Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
08/22/2007CN101022708A Temporary fixing structure for electronic parts
08/22/2007CN101022703A Method and process for embedding electrically conductive elements in a dielectric layer
08/22/2007CN101022700A Printing circuit board and method for testing anisotropic conducting membrance
08/22/2007CN101022699A Wired circuit board and production method thereof
08/22/2007CN101022698A Printed circuit board assembly and method of manufacturing the same
08/22/2007CN101022697A Multilayer circuit board and method for fabricating same
08/22/2007CN101022696A Multilayer circuit board with net grounded side characteristic impedance control method and structure
08/22/2007CN101022695A Circuit embedded in dielectric layer non-core band thin base sheet and manufacting method
08/22/2007CN101022694A 电路板 Circuit board
08/22/2007CN101022099A Thick film circuit, pin frame, circuit board and assembly thereof
08/21/2007US7260285 Optical module with flexible substrate
08/21/2007US7260233 Hearing aid or similar audio device and method for producing a hearing aid
08/21/2007US7259970 Substrate, connecting structure and electronic equipment
08/21/2007US7259968 Tailoring impedances of conductive traces in a circuit board
08/21/2007US7259823 Planar display module
08/21/2007US7259822 Image display device
08/21/2007US7259683 Rack
08/21/2007US7259639 Inductor topologies and decoupling structures for filters used in broadband applications, and design methodology thereof
08/21/2007US7259466 Low temperature bonding of multilayer substrates
08/21/2007US7259465 Semiconductor device with lead-free solder
08/21/2007US7259336 Technique for improving power and ground flooding
08/21/2007US7259335 Solder-bearing wafer for use in soldering operations
08/21/2007US7259334 Multi-layer printed circuit with low noise
08/21/2007US7259333 Composite laminate circuit structure
08/21/2007US7259213 Indole resins epoxy resins and resin compositions containing the same
08/21/2007US7259201 Flame retardant thermoplastic films and methods of making the same
08/21/2007US7258943 Fuel cell
08/21/2007US7258819 Voltage variable substrate material
08/21/2007US7258549 Connection member and mount assembly and production method of the same
08/21/2007US7258423 Recording head unit, method of manufacturing the same, and recording apparatus using the unit
08/21/2007US7258264 Methods for manufacturing optical modules using lead frame connectors
08/21/2007US7257891 Method for forming bonding pads
08/21/2007US7257880 Method for assembling an actuator head suspension
08/16/2007WO2007091976A1 Anodised aluminium, dielectric, and method
08/16/2007WO2007091807A1 Copper clad laminate for chip on film
08/16/2007WO2007091357A1 Wiring board, and liquid crystal module and display device provided with such wiring board
08/16/2007WO2007091329A1 Electronic component package
08/16/2007WO2007090589A2 Holder for a flexible circuit board
08/16/2007WO2007090335A1 Halogen-free phosphor-free fire-retardant epoxide resin composition
08/16/2007WO2007073572A3 New pad geometry for printed circuit boards
08/16/2007US20070191556 Polymeric epoxy resin composition
08/16/2007US20070191555 Thermosetting resin composition and its article
08/16/2007US20070190879 Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth
08/16/2007US20070190846 Multilayer printed wiring board and test body for printed wiring board
08/16/2007US20070190821 System and method for computer-aided plate punching
08/16/2007US20070190819 Printed board with a pin for mounting a component
08/16/2007US20070190816 Connector system for mating multiple variant circuit cards with a fixed circuit board
08/16/2007US20070190346 Metal-coated resin molded article and production method therefor
08/16/2007US20070189661 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly
08/16/2007US20070188998 Composite electronic component and method of manufacturing the same
08/16/2007US20070188997 Interconnect design for reducing radiated emissions
08/16/2007US20070188693 Drive ic and display device having the same
08/16/2007US20070188692 Driver module structure
08/16/2007US20070188261 Transmission line with a transforming impedance and solder lands
08/16/2007US20070188257 Electromagnetically shielded slot transmission line
08/16/2007US20070187809 RFIC die and package
08/16/2007US20070187237 Method and process for embedding electrically conductive elements in a dielectric layer
08/16/2007US20070187142 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate
08/16/2007US20070187141 Circuit board with configurable ground link
08/16/2007US20070187140 Printed wiring board with a pin for mounting a component and an electronic device using it
08/16/2007US20070187139 Bus structure
08/16/2007US20070187138 Wire bonding apparatus, record medium storing bonding control program, and bonding method
08/16/2007US20070187137 Ceramic multilayer substrate
08/16/2007US20070187136 Printed circuit board, method of producing the same, and electronic unit
08/16/2007US20070186414 Multilayer wiring board incorporating carbon fibers and glass fibers
08/16/2007US20070186413 Circuit board structure and method for fabricating the same
08/16/2007DE102006021569A1 Prüfsystem für einen Schaltungsträger Test system for a circuit carrier
08/16/2007DE102006004322A1 Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung Circuit board comprising additional functional elements and production methods and application
08/16/2007DE102006004321A1 Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung Bendable board with additional functional element and a Kerbfräsung and manufacturing and application
08/16/2007DE102006002899A1 Printed circuit board system has two printed circuit boards, where two parallel contacting elements are provided for contacting printed circuit boards and for clamping electrically connected conducting paths
08/16/2007DE10134011B4 Trägersubstrat, das zur Kontaktierung mit einer integrierten Schaltung vorgesehen ist Carrier substrate, which is provided for contacting with an integrated circuit