| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/11/2007 | US7266869 Method for manufacturing a piezoelectric oscillator |
| 09/11/2007 | CA2362387C Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 09/07/2007 | WO2007099992A1 Substrate and device |
| 09/07/2007 | WO2007099965A1 Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure |
| 09/07/2007 | WO2007099866A1 Electronic component mounted body, electronic component with solder bump, solder resin mixed material, electronic component mounting method and electronic component manufacturing method |
| 09/07/2007 | WO2007099641A1 Board structure for product board, product board manufacturing method, and electronic apparatus |
| 09/07/2007 | WO2007099596A1 Wiring board, method for arranging wiring pattern |
| 09/07/2007 | WO2007098946A1 Signal routing in a multilayered printed circuit board |
| 09/06/2007 | US20070207642 Method and system for easing attachment of a peripheral cable to a personal computer |
| 09/06/2007 | US20070207640 Assembly having a structure for clamping the harnesses and image-forming machine |
| 09/06/2007 | US20070207639 Electric connection box |
| 09/06/2007 | US20070207638 Bus Joint Assembly |
| 09/06/2007 | US20070207632 Midplane with offset connectors |
| 09/06/2007 | US20070207631 Bicycle bottom bracket assembly and adapter device for such an assembly |
| 09/06/2007 | US20070207557 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 09/06/2007 | US20070207337 Electrodeposited Copper Foil with Carrier Foil on which a Resin Layer for Forming Insulating Layer is Formed, Copper-Clad Laminate, Printed Wiring Board, Method for Manufacturing Multilayer Copper-Clad Laminate, and Method for Manufacturing Printed Wiring Board |
| 09/06/2007 | US20070207326 Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish |
| 09/06/2007 | US20070206367 Electronic device |
| 09/06/2007 | US20070206366 Method for embedding a component in a base |
| 09/06/2007 | US20070206364 Methods of forming a flexible circuit board |
| 09/06/2007 | US20070205847 Via transmission lines for multilayer printed circuit boards |
| 09/06/2007 | US20070205667 Serial ATA cable with light display feature |
| 09/06/2007 | US20070205018 Multilayer printed board, electronic apparatus, and packaging method |
| 09/06/2007 | US20070205017 Circuit device and method of manufacturing the same |
| 09/06/2007 | DE112005002748T5 Mit Adhäsionshilfsmittel ausgestattete Metallfolie und Leiterplatte, bei der diese verwendet wird Equipped with metal foil adhesion aids and PCB in which it is used |
| 09/06/2007 | DE102007005920A1 Leiterplatte mit einem eingebetteten Nacktchip und Verfahren derselben Circuit board with an embedded bare chip and method thereof |
| 09/06/2007 | DE102006013812A1 Dünnfilmkondensator und Verfahren zur Herstellung desselben, elektronische Anordnung und Leiterplatte Thin film capacitor and methods of manufacturing the same, electronic device and printed circuit board |
| 09/06/2007 | DE102006009812A1 Electrical circuit for controlling electric heater in motor vehicle, has power semiconductor, e.g. MOSFET, mounted on metallic intermediate plate in surface mounted technology, where intermediate plate is retained by mounting plate |
| 09/05/2007 | EP1830613A1 Laminate for flexible printed wiring boards |
| 09/05/2007 | EP1830612A2 Suspension board with circuit |
| 09/05/2007 | EP1830611A1 Printed wiring board and production method of printed wiring borad |
| 09/05/2007 | EP1830336A1 Flexible substrate supprerssed from being plastically deformed, and flexible image display device |
| 09/05/2007 | EP1829691A1 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip |
| 09/05/2007 | EP1728414B1 Device provided with an electric motor and a main printed circuit board and mounting method |
| 09/05/2007 | EP1364562B1 Vacuum deposited circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
| 09/05/2007 | CN200944703Y Circuit board assembly |
| 09/05/2007 | CN200944702Y 柔性印刷电路结构 A flexible printed circuit structure |
| 09/05/2007 | CN101032192A Passive device structure |
| 09/05/2007 | CN101032191A Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate |
| 09/05/2007 | CN101031413A Laminate composition for producing reduced curl flat thin core laminate |
| 09/05/2007 | CN101031185A Connection configuration for rigid substrates |
| 09/05/2007 | CN101031184A Soldering structure of through hole |
| 09/05/2007 | CN101031183A Suspension board with circuit |
| 09/05/2007 | CN101031182A Printing circuit-board and its designing method |
| 09/05/2007 | CN101030457A Conductor composition and method for production thereof |
| 09/05/2007 | CN100336426C Multilayer printed wiring board and method ofr producing multilayer printed wiring board |
| 09/05/2007 | CN100336425C Hybrid integrated circuit device |
| 09/05/2007 | CN100336424C 印刷电路板 A printed circuit board |
| 09/05/2007 | CN100336423C Circuit board consisting of grain structure magnetic film |
| 09/05/2007 | CN100336291C Switching power supply unit |
| 09/05/2007 | CN100336219C Structure comprising a barrier layer of a tungsten alloy and manufacturing method thereof |
| 09/05/2007 | CN100336209C Hybrid integrated circuit device and manufacturing method of the same |
| 09/05/2007 | CN100336207C Semiconductor device and its manufacturing method |
| 09/05/2007 | CN100336183C Method for production of dielectric layers using polyfunctional carbosilanes |
| 09/05/2007 | CN100336139C Formation of thin film resistors |
| 09/05/2007 | CN100336098C Signal transmission device for liquid crystal display |
| 09/05/2007 | CN100335586C Wiring-connecting material and process for producing circuit board with the same |
| 09/05/2007 | CN100335585C Wiring-connecting material and process for producing circuit board with the same |
| 09/05/2007 | CN100335584C Wiring-connecting material and process for producing circuit board with the same |
| 09/05/2007 | CN100335534C Polyimide film and method for production thereof, and polyimide/metal laminate using polyimide |
| 09/04/2007 | US7266262 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof |
| 09/04/2007 | US7266003 Programmable power supply |
| 09/04/2007 | US7265990 Chipset coupling apparatus |
| 09/04/2007 | US7265983 Power unit comprising a heat sink, and assembly method |
| 09/04/2007 | US7265804 Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix |
| 09/04/2007 | US7265563 Test method for semiconductor components using anisotropic conductive polymer contact system |
| 09/04/2007 | US7265533 Non-intrusive power monitor |
| 09/04/2007 | US7265446 Mounting structure for semiconductor parts and semiconductor device |
| 09/04/2007 | US7265300 Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes |
| 09/04/2007 | US7265299 Method for reducing voltage drop across metal lines of electroluminescence display devices |
| 09/04/2007 | US7265298 Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device |
| 09/04/2007 | US7265071 Oxides of Lithium, Calcium, Strontium, titanium, Bismuth, and Lanthanide or Yttrium; improved sinterability even at a low temperature, enables firing without marked deterioration of dielectric characteristics |
| 09/04/2007 | US7265043 Methods for making microwave circuits |
| 09/04/2007 | US7264977 Method of RFIC die-package configuration |
| 09/04/2007 | US7264876 Useful electrical, mechanical, and chemical properties including applications in antennas, electromagnetic and electro-optic devices, and high-toughness materials |
| 09/04/2007 | US7264483 Modules for fixing flexible printed circuit boards and flat display devices utilizing the same |
| 09/04/2007 | US7264482 Anisotropic conductive sheet |
| 09/04/2007 | US7264480 Display device |
| 09/04/2007 | US7263768 Method of making a semiconductor device having an opening in a solder mask |
| 09/04/2007 | US7263766 Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate |
| 08/30/2007 | WO2007097440A1 Printed wiring board and process for producing the same |
| 08/30/2007 | WO2007097249A1 Porous film and layered product including porous film |
| 08/30/2007 | WO2007097209A1 Epoxy resin composition |
| 08/30/2007 | WO2007078924A3 Printed circuit board waveguide |
| 08/30/2007 | WO2006138667A3 Rf front-end module for picocell and microcell base station transceivers |
| 08/30/2007 | US20070204201 High reliability memory module with a fault tolerant address and command bus |
| 08/30/2007 | US20070204200 High reliability memory module with a fault tolerant address and command bus |
| 08/30/2007 | US20070203270 Dispersion of a phosphinic or diphosphinic salt or a polymer of a phosphinate; optionally a nitrogen- or nitrogen-phosphorus synergist; and a liquid that may be a diol or polyol, a diisocyanate, a diamine, an olefin, a polyester, an anhydride or a organophosphorus compound; polymer molding compositions |
| 08/30/2007 | US20070202720 Inseparable PCB module |
| 08/30/2007 | US20070202719 Board mounted terminal construction |
| 08/30/2007 | US20070202716 Soldering Nest For A Bus Bar |
| 08/30/2007 | US20070202714 Test contact system for testing integrated circuits with packages having an array of signal and power contacts |
| 08/30/2007 | US20070202713 Connector Employing Flexible Printed Board |
| 08/30/2007 | US20070201846 Camera Unit Incorporating A Lidded Printhead Unit |
| 08/30/2007 | US20070201845 Camera Incorporating A Releasable Print Roll Unit |
| 08/30/2007 | US20070201216 Housing comprising a liquid-tight electric bushing |
| 08/30/2007 | US20070201213 Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same |
| 08/30/2007 | US20070200554 Solid or three-dimensional circuit board |
| 08/30/2007 | US20070200274 Fluoropolymer laminates and a process for manufacture thereof |
| 08/30/2007 | US20070200227 Power semiconductor arrangement |