| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/25/2007 | US7311530 Dual segment molded lead frame connector for optical transceiver modules |
| 12/25/2007 | US7310869 Flat connector, ink jet head and method of manufacturing them |
| 12/21/2007 | WO2007146665A2 Power distribution system for integrated circuits |
| 12/21/2007 | WO2007146580A1 Printed circuit board with coextensive electrical connectors and contact pad areas |
| 12/21/2007 | WO2007146566A2 Apparatus with a packed circuitry within a lightbulb |
| 12/21/2007 | WO2007146546A2 Single or multi-layer printed circuit board with improved edge via design |
| 12/21/2007 | WO2007146384A1 Improved electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part ii |
| 12/21/2007 | WO2007146383A1 Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components |
| 12/21/2007 | WO2007145630A1 Glass flux assisted sintering of chemical solution deposited thin dielectric films |
| 12/21/2007 | WO2007145237A1 Heat dissipating wiring board and method for manufacturing same |
| 12/21/2007 | WO2007145164A1 Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil |
| 12/21/2007 | WO2007120203A3 Flame retardant compositions with a phosphorated compound |
| 12/21/2007 | WO2004047510A3 A method of supporting electronic components and an electronic device with elastic support for an electronic component |
| 12/20/2007 | US20070293061 Trailer lamp assembly |
| 12/20/2007 | US20070292709 Metal-Clad White Laminate |
| 12/20/2007 | US20070292697 Metal Base Circuit Substrate For An Optical Device And Method Manufacturing The Aforementioned Substrate |
| 12/20/2007 | US20070292668 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| 12/20/2007 | US20070291503 Light-Emitting Diode Arrangement for a High-Power Ligth-Emitting Diode and Method for Producing a Light-Emitting Diode Arrangement |
| 12/20/2007 | US20070291473 Methods and apparatus relating to improved visual recognition and safety |
| 12/20/2007 | US20070291459 Circuit board for reducing electromagnetic interference |
| 12/20/2007 | US20070291454 Hybrid circuit board and display device having the same |
| 12/20/2007 | US20070290603 Display Apparatus |
| 12/20/2007 | US20070290374 Component with Encapsulation Suitable for Wlp and Production Method |
| 12/20/2007 | US20070290327 Circuit board and method for manufacturing semiconductor modules and circuit boards |
| 12/20/2007 | US20070289773 High speed interposer |
| 12/20/2007 | US20070289772 Electronic Circuit |
| 12/20/2007 | US20070289771 Semiconductor device |
| 12/20/2007 | DE102006027779A1 Verfahren zur Fixierung eines elektrischen oder elektronischen Bauteils, insbesondere einer Leiterplatte, in einem Gehäuse sowie Fixierelement dafür A method for fixing an electrical or electronic component, in particular a printed circuit board in a housing and fixing for |
| 12/20/2007 | DE102006027748A1 Printed circuit board for airbag control device of motor vehicle, has protection section that has passage openings for pressing pins, where passage openings of section lie over passage openings of pressing sockets |
| 12/20/2007 | DE10196916B4 Symbol-basierte Signalgebung für ein elektromagnetisch gekoppeltes Bussystem Symbol-based signaling for an electromagnetically-coupled bus system |
| 12/19/2007 | EP1868423A1 Multilayer build-up wiring board |
| 12/19/2007 | EP1868422A2 Electronic component built-in substrate and method of manufacturing the same |
| 12/19/2007 | EP1868242A2 Power semiconductor module and fabrication method thereof |
| 12/19/2007 | EP1867222A1 Interlocking means |
| 12/19/2007 | EP1866961A2 Micro solder pot |
| 12/19/2007 | EP1866454A1 Treatment of flexible web material |
| 12/19/2007 | EP1595432B1 Device and method for damping cavity resonance in a multi-layer carrier module |
| 12/19/2007 | EP1275682B1 Lowly heat-expandable laminate |
| 12/19/2007 | EP1176641B1 Front-and-back electrically conductive substrate and method for manufacturing same |
| 12/19/2007 | EP0857402B1 High performance flexible laminate |
| 12/19/2007 | CN200994249Y Electronic assembly locked bottom board |
| 12/19/2007 | CN200994225Y Circuit substrate structure |
| 12/19/2007 | CN200994224Y Printed circuit board medium structure |
| 12/19/2007 | CN200994223Y Back-adhesive reinforced board for flexible circuit board |
| 12/19/2007 | CN200993962Y Improved optical-sensing packaging module |
| 12/19/2007 | CN101091422A Printed board and method for manufacturing same |
| 12/19/2007 | CN101091421A 模块 Modules |
| 12/19/2007 | CN101090817A Laminate for printed wiring board |
| 12/19/2007 | CN101090618A Fastening device for heat sink |
| 12/19/2007 | CN101090613A Improvements in or relating to devices |
| 12/19/2007 | CN101090607A Circuit substrate and method for making the same, and circuit assembly using the same |
| 12/19/2007 | CN101090605A Printed circuit board and circuit structure for power supply |
| 12/19/2007 | CN101090604A Circuit board with honeycomb resin discharge channel |
| 12/19/2007 | CN101090603A Printed circuit board and method for manufacturing a solderless electrical connection |
| 12/19/2007 | CN101090602A Flexible printing circuit substrate and semiconductor device |
| 12/19/2007 | CN101090601A Punching hole pad structure for circuit board and its hole punching method |
| 12/19/2007 | CN101090600A Printed circuit board, printed circuit subboard and manufacturing process of printed circuit board |
| 12/19/2007 | CN101090599A 电路板 Circuit board |
| 12/19/2007 | CN101090105A 线路板与电路结构 Circuit board and the circuit configuration |
| 12/19/2007 | CN101090101A Ic chip package, and image display apparatus using same |
| 12/19/2007 | CN101090078A Semiconductor package structure and method for manufacturing the semiconduct package structure |
| 12/19/2007 | CN101090075A Manufacturing method for vertical built-in capacity substrate and its structure |
| 12/19/2007 | CN101090074A Printed circuit board for package of electronic components and manufacturing method thereof |
| 12/19/2007 | CN101089635A Device for current overload prealarm promption on PCB circuit board |
| 12/19/2007 | CN101089453A Device for connecting lamp with power supply in backlight unit |
| 12/19/2007 | CN100356824C Metal mask and method of printing lead-free solder paste using same |
| 12/19/2007 | CN100356823C Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 12/19/2007 | CN100356822C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 12/19/2007 | CN100356553C Thin flm bearing belt of mounting electronic parts, its prodn. method and printing screen for coating welding resistance agent |
| 12/19/2007 | CN100356539C RFID tag and method of manufacturing the same |
| 12/19/2007 | CN100356361C Multi-configuration GPU interface device |
| 12/19/2007 | CN100355829C Resin composition, prepreg, laminate sheet and printed wiring board using the same |
| 12/19/2007 | CN100355587C Method for producing a partially metallised film-type element |
| 12/18/2007 | US7310458 Stacked module systems and methods |
| 12/18/2007 | US7310438 Systems for detecting defects in printed solder paste |
| 12/18/2007 | US7310243 Method and components for implementing EMC shielded resonance damping |
| 12/18/2007 | US7310240 Method for increasing stability of system memory through enhanced quality of supply power |
| 12/18/2007 | US7310239 IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader |
| 12/18/2007 | US7310238 Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board |
| 12/18/2007 | US7309924 UBM for fine pitch solder ball and flip-chip packaging method using the same |
| 12/18/2007 | US7309917 Multilayer board and a semiconductor device |
| 12/18/2007 | US7309839 Storage device for integrated circuits and method of employing a storage device |
| 12/18/2007 | US7309838 Multi-layered circuit board assembly with improved thermal dissipation |
| 12/18/2007 | US7309724 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 12/18/2007 | US7309669 Dielectric material and dielectric sintered body, and wiring board using the same |
| 12/18/2007 | US7309657 Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board |
| 12/18/2007 | US7309261 Electrical connector with improved crosstalk compensation |
| 12/18/2007 | US7309260 Wireless communication module |
| 12/18/2007 | US7309242 Power connector |
| 12/18/2007 | US7309240 Apparatus and electronic apparatus |
| 12/18/2007 | US7308756 Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method |
| 12/18/2007 | US7308754 Methods for trimming electrical parameters in an electrical circuit |
| 12/18/2007 | CA2392322C Differential signal electrical connectors |
| 12/13/2007 | WO2007141997A1 High frequency circuit component |
| 12/13/2007 | WO2007141827A1 Light emitting element mounting substrate, light source, lighting device, display device, traffic light, and method for fabricating light emitting element mounting substrate |
| 12/13/2007 | WO2007140495A2 Method for manufacturing a circuit carrier |
| 12/13/2007 | WO2007140494A1 Circuit carrier |
| 12/13/2007 | WO2007115238A3 Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same |
| 12/13/2007 | WO2007089599A3 Led illumination assembly with compliant foil construction |
| 12/13/2007 | WO2007078867A3 Quasi-waveguide printed circuit board structure |