Patents for H05K 1 - Printed circuits (98,583)
08/2008
08/20/2008CN101248113A Fluoropolymer-glass fabric for circuit substrates
08/20/2008CN101247699A Circuit boards with embedded resistors
08/20/2008CN101247698A Hard circuit board of flat oscillating motor
08/20/2008CN101247697A Reusable flexible printed circuit board
08/20/2008CN101247675A Microphone and its mounting structure
08/20/2008CN101246871A Multi-layer ceramic substrate and its preparing process
08/20/2008CN100413386C Method of mounting wafer on printed wiring substrate
08/20/2008CN100413385C Film bearing band for arranging electronic parts and printing screen mask for coating welding retardant
08/20/2008CN100413384C Multi-layer printed circuit board and fabricating method thereof
08/20/2008CN100413383C Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
08/20/2008CN100413152C Completely integrated Ethernet connector
08/20/2008CN100413070C Module with a built-in component, electronic device with the same, and manufacturing method of module with a built-in component
08/20/2008CN100413056C 电路装置及其制造方法 Circuit device and manufacturing method thereof
08/20/2008CN100413029C Method of manufacturing circuit device
08/20/2008CN100412995C Constrained sintering method for asymmetrical configurational dielectric layer
08/20/2008CN100412873C System and method for modifying electronic design data
08/20/2008CN100412624C Optical modulator, optical device and projector
08/19/2008US7414875 Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules
08/19/2008US7414851 Display apparatus and flexible substrate
08/19/2008US7414228 High frequency heating apparatus
08/19/2008US7413975 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
08/19/2008US7413815 Thin laminate as embedded capacitance material in printed circuit boards
08/19/2008US7413801 Insulation: a nonwoven web of glass fibers; an aqueous hydroxy functional carboxy functional polymer fromalpha , beta -ethylenically unsaturated hydroxy functional monomer, and acrylic acid; a chain transfer agent, and a condensation accelerator,
08/19/2008US7413791 Poly (phenylene ether) resin composition, prepreg, and laminated sheet
08/19/2008US7413481 Systems for and methods of circuit construction
08/19/2008US7413452 Interconnector, method for manufacturing a plasma display device using the same, and a plasma display device with the same
08/19/2008US7413445 Electronic control unit having watertight sealing agent
08/19/2008US7412923 Stencil device for accurately applying solder paste to a printed circuit board
08/19/2008CA2343173C Method for producing multi-layer circuits
08/14/2008WO2008098060A2 Enhanced localized distributive capacitance for circuit boards
08/14/2008WO2008097090A1 Sealed ball grid array package
08/14/2008WO2008096540A1 Laminated body, circuit board including laminated body, semiconductor package and method for manufacturing laminated body
08/14/2008WO2008096464A1 Printed circuit board and method for manufacturing the printed circuit board
08/14/2008WO2008096450A1 Circuit board, multilayer circuit board, and electronic device
08/14/2008WO2008095816A1 Connection system for printed circuit boards
08/14/2008WO2008095338A1 A mutual connection structure between multi-layer boards and manufacturing method thereof
08/14/2008WO2008095337A1 A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof
08/14/2008WO2008065524A3 Secure mmc standard smartcard with multi-application operation capability, process of operation
08/14/2008US20080193747 Composite Films Suitable For Use In Opto-Electronic And Electronic Devices
08/14/2008US20080192453 Multilayer interconnection substrate and manufacturing method therefor
08/14/2008US20080192452 Passive electronic device
08/14/2008US20080192450 Electronics Module and Method for Manufacturing the Same
08/14/2008US20080192445 Electronic Controller for a Motor Vehicle, in Particular for a Gearbox Controller
08/14/2008US20080192074 Method and Device for the Production of a Three-Dimensional Multi-Material Component by Means of Ink-Jet-Type Printing
08/14/2008US20080191720 Multilayer Substrate and Probe Card
08/14/2008US20080191613 Display Device and Method of Manufacturing the Same
08/14/2008US20080191033 Memory Cards Having Two Standard Sets Of Contacts
08/14/2008US20080190659 System For And Method Of Planarizing The Contact Region Of A Via By Use Of A Continuous Inline Vacuum Deposition Process
08/14/2008US20080190658 Multilayer printed wiring board
08/14/2008US20080190657 Circuit Board
08/14/2008US20080190656 Trimming Of Embedded Passive Components Using Pulsed Heating
08/14/2008US20080190655 Component With Buried Ductile Conductive Bumps And Method Of Electrical Connection Between Said Component And A Component Equipped With Hard Conductive Points
08/14/2008US20080190654 Printed Wiring Board
08/14/2008US20080190653 Method and System of Heat Conductor
08/14/2008US20080190652 Wired circuit board and method for producing the same
08/14/2008US20080190651 Multi-Layered Printed Circuit Board Comprising Conductive Test Surfaces, and Method for Determining a Misalignment of an Inner Layer
08/14/2008US20080189943 Multilayered printed circuit board and manufacturing method thereof
08/14/2008US20080189941 Method of Manufacture of Electronic or Functional Devices
08/14/2008DE10208737B4 Adaptervorrichtung für Speichermodule The adapter device for memory modules
08/14/2008DE102007006462A1 Electronic switching arrangement, has printed circuit board laid against another printed circuit board such that electronic component i.e. high-frequency component, of latter circuit board is taken up by recess of former circuit board
08/14/2008DE102007006177A1 Masseanschluss mit Vibrationsdämpfer für elektronische Geräte Ground connection with vibration damper for electronic devices
08/14/2008DE102007005862A1 Schaltungsvorrichtung mit bebondetem SMD-Bauteil Circuit device having bebondetem SMD
08/13/2008EP1956876A1 Ceramic substrate, electronic device, and process for producing ceramic substrate
08/13/2008EP1956875A2 Wired circuit board and method for producing the same
08/13/2008EP1956874A1 Wiring system with integrated electronics
08/13/2008EP1956873A2 Electronic device and method of manufacturing the same
08/13/2008EP1956652A1 Sealed ball grid array package
08/13/2008EP1956616A1 Methods of making high capacitance density embedded ceramic capacitors
08/13/2008EP1956615A2 Electronic device and RF module
08/13/2008EP1956519A1 A sensor boresight unit and a modular unit
08/13/2008EP1956104A1 Working method of a metallic material and a manufacturing method of an electronic component
08/13/2008EP1955374A1 3d electronic module
08/13/2008EP1954250A2 Films and capsules made from modified carboxymethycellulose materials and methods of making same
08/13/2008EP1880587B1 Printed circuit board
08/13/2008EP1534788B1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating
08/13/2008EP1454516B1 Power module and power module assembly
08/13/2008EP1454508B1 Flexible electric circuit for heating comprising a metallised fabric
08/13/2008EP1418833B1 Swallowable in vivo sensing capsule with a circuit board having rigid sections and flexible sections
08/13/2008EP1145610B1 Electronic control device
08/13/2008CN101243339A Optical waveguide device and method for fabricating optical waveguide device
08/13/2008CN101242735A A clip for fixing of shield can
08/13/2008CN101242734A Shielding device for preventing electromagnetic interference
08/13/2008CN101242711A Test mark structure, substrate sheet laminate and design method thereof, multilayered circuit substrate, and method for inspecting lamination matching precision of the multilayered circuit substrate
08/13/2008CN101242710A Multilayer circuit board and its making method
08/13/2008CN101242709A Circuit board for wireless transmission
08/13/2008CN101242708A Wired circuit substrate and method for producing the same
08/13/2008CN101242707A Circuit board and its design method
08/13/2008CN101242173A Cycle timing intelligent electronic switch
08/13/2008CN101241906A Semiconductor device and manufacturing method thereof, semiconductor package, electronic device and manufacturing method thereof, and electronic apparatus
08/13/2008CN101241895A Printed circuit board and semiconductor memory module using the same
08/13/2008CN101241795A Inductor devices
08/13/2008CN101241243A Device comprising flexible printed circuit and connection auxiliary member
08/13/2008CN101240109A Resin composition and semi-solidifying sheet for printed board prepared from the same
08/13/2008CN100411500C Multichip module including substrate with an array of interconnect structures
08/13/2008CN100411498C Assembly of FPC and PCB
08/13/2008CN100411255C Printed circuit board type connector using surface mount and through hole technologies
08/13/2008CN100411204C Light-emitting diode thermal management system
08/13/2008CN100411163C Semiconductor device of chip on film
08/13/2008CN100411155C Laminated electronic part and its manufacturing method
08/13/2008CN100411154C 电路装置及其制造方法 Circuit device and manufacturing method thereof