| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/30/2008 | US7429789 Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 09/30/2008 | US7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
| 09/30/2008 | US7429786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides |
| 09/30/2008 | US7429510 Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate |
| 09/30/2008 | US7429179 Contact terminal having compliant contact portion for use with land array connector terminal |
| 09/30/2008 | US7429178 Modular jack with removable contact array |
| 09/30/2008 | US7428979 Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process |
| 09/30/2008 | CA2371986C Low cost antennas using conductive plastics or conductive composites |
| 09/30/2008 | CA2336889C A thermal management device and method of making such a device |
| 09/30/2008 | CA2302899C Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same |
| 09/25/2008 | WO2008116098A2 Right angle connection system for ate interface |
| 09/25/2008 | WO2008114858A1 Resin composition for forming insulating layer of printed wiring board |
| 09/25/2008 | WO2008114766A1 Novel polyvalent hydroxy compound, method for producing the compound, epoxy resin and epoxy resin composition each using the compound, and cured product of the composition |
| 09/25/2008 | WO2008114674A1 Insulating composite body, method for producing the same, and use of insulating composite body |
| 09/25/2008 | WO2008114642A1 Film and flexible metal-clad laminate |
| 09/25/2008 | WO2008114546A1 Wiring board module and method for manufacturing the wiring board module |
| 09/25/2008 | WO2008114539A1 Non-adhesive-type flexible laminate and method for production thereof |
| 09/25/2008 | WO2008114434A1 Mount substrate, process for producing the same, semiconductor device and process for producing the same |
| 09/25/2008 | WO2008114066A1 Prototype modules for construction of electronic devices incorporating electronic tubes |
| 09/25/2008 | WO2008113994A1 Electrical connection of components |
| 09/25/2008 | WO2008113622A1 Electronic component having flexible printed circuit board technology |
| 09/25/2008 | WO2008113304A1 Panel devices comprising electric circuit boards and method for the production thereof |
| 09/25/2008 | WO2008049504A3 Module |
| 09/25/2008 | WO2008009283A8 Resistor assembly and method for producing said assembly |
| 09/25/2008 | US20080233769 Right Angle Connection System for ATE Interface |
| 09/25/2008 | US20080233422 Coated nickel-containing powders |
| 09/25/2008 | US20080233386 molding containing epoxy resins, hardening agent consisting of phenolated compound, and layered silicate, excels in dielectric characteristics and dimensional stability at high temperature |
| 09/25/2008 | US20080232676 Fabrication method of semiconductor integrated circuit device |
| 09/25/2008 | US20080232076 Attaching/Detaching Structure Of Electronic Device |
| 09/25/2008 | US20080232074 Circuit Card Assembly Including Individually Testable Layers |
| 09/25/2008 | US20080232047 Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus |
| 09/25/2008 | US20080231388 Broadband Balancing Transformer |
| 09/25/2008 | US20080231305 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 09/25/2008 | US20080230914 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/25/2008 | US20080230512 Printed Circuit Board and Method for Processing Printed Circuit Board |
| 09/25/2008 | US20080230264 Interconnection structure and method thereof |
| 09/25/2008 | US20080230263 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board |
| 09/25/2008 | US20080230262 Electrically stable copper filled electrically conductive adhesive |
| 09/25/2008 | US20080230261 flexible printed circuits; dielectric, flowability, heat resistance, adhesiveness, and processability; a polyimide resin, an monomeric aromatic amine, an epoxy resin (polyepoxide), and an imidazole compound; 1,3-bis(3-aminophenoxy)benzene |
| 09/25/2008 | US20080230260 Flip-chip substrate |
| 09/25/2008 | US20080230259 Method and Structure for Implementing Control of Mechanical Flexibility With Variable Pitch Meshed Reference Planes Yielding Nearly Constant Signal Impedance |
| 09/25/2008 | US20080230258 Printed circuit board, design method thereof and mainboard of terminal product |
| 09/25/2008 | DE10247409B4 Keramischer Substratkörper und Verfahren zu dessen Herstellung Ceramic substrate body and process for its preparation |
| 09/25/2008 | DE102008012256A1 Elektronik-Komponenten-Montageplatte An electronic components mounting plate |
| 09/25/2008 | DE102007014579A1 Microphone, has micro phone housing and micro phone capsule and electrical circuits are provided on printed circuit board for signal processing of signals recorded by micro phone capsule |
| 09/25/2008 | DE10125570B4 Verfahren zum Verbinden von Leiterbahnen mit Kunststoffoberflächen A method for connecting conductor tracks with plastic surfaces, |
| 09/24/2008 | EP1973392A1 Safety and control device for a home electrical appliance |
| 09/24/2008 | EP1973391A2 Optical communication device |
| 09/24/2008 | EP1973390A1 Electronic component, in particular a sensor module, with an electronic circuit for recording and/or processing data and method for its production |
| 09/24/2008 | EP1973190A1 Integrated electronic components and methods of formation thereof |
| 09/24/2008 | EP1973180A2 Protection circuit board for secondary battery |
| 09/24/2008 | EP1972660A1 Conductive composition, conductive paint, and method of forming conductive paint |
| 09/24/2008 | EP1733429A4 Limiter and semiconductor device using the same |
| 09/24/2008 | EP1506568A4 Direct-connect signaling system |
| 09/24/2008 | EP1457043B1 Apparatus and method for sharing signal control lines |
| 09/24/2008 | EP1200968A4 Aqueous carbon composition and method for coating a non conductive substrate |
| 09/24/2008 | CN201123195Y Bus cable locating structure |
| 09/24/2008 | CN201123172Y Otter board |
| 09/24/2008 | CN201123171Y Circuit structure with over-hanged micro-blind hole |
| 09/24/2008 | CN201123170Y Wireless transceiving electronic device and printed circuit board |
| 09/24/2008 | CN201123169Y Circuit board with improved weld penetration hole structure and battery set with the same |
| 09/24/2008 | CN201122462Y Printing type ultra-thin coaxial transmission line |
| 09/24/2008 | CN201121808Y Bending-resistant flexible neon tube lamp |
| 09/24/2008 | CN101273672A Optical transceiver module having a dual segment molded lead frame connector |
| 09/24/2008 | CN101273494A Electric connection construction |
| 09/24/2008 | CN101272991A COG dielectric composition for use with nickel electrodes |
| 09/24/2008 | CN101272133A Band pass filter |
| 09/24/2008 | CN101271992A Lange coupler bridle wire structure and implementing method |
| 09/24/2008 | CN101271886A High-density circuit module |
| 09/24/2008 | CN101271883A Production method of circuit substrates and inductor wire |
| 09/24/2008 | CN101271879A Element-mounting board and semiconductor module |
| 09/24/2008 | CN101271646A Display panel, its pin joint and detecting method |
| 09/24/2008 | CN101271205A Liquid crystal display apparatus |
| 09/24/2008 | CN101271192A Imaging block and imaging apparatus |
| 09/24/2008 | CN100421533C Method for producing electronic circuit and electronic circuit substrate |
| 09/24/2008 | CN100421227C Manufacturing method of electronic part and wiring substrate |
| 09/24/2008 | CN100421204C Plasma display |
| 09/23/2008 | US7428155 Printed wiring board including power supply layer and ground layer |
| 09/23/2008 | US7427904 Ultra-high-frequency notch filter having an inductance set by selecting a conductor width |
| 09/23/2008 | US7427851 Capacitor unit |
| 09/23/2008 | US7427804 Optoelectronic semiconductor device and light signal input/output device |
| 09/23/2008 | US7427719 Shifted segment layout for differential signal traces to mitigate bundle weave effect |
| 09/23/2008 | US7427718 Ground plane having opening and conductive bridge traversing the opening |
| 09/23/2008 | US7427717 Flexible printed wiring board and manufacturing method thereof |
| 09/23/2008 | US7427716 Microvia structure and fabrication |
| 09/23/2008 | US7427652 allows for reduced amounts of phosphonate as compared to a composition not containing the filler; optional polybenzoxazine resin, and an optional co-curing agent |
| 09/23/2008 | US7427423 potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element |
| 09/23/2008 | CA2626822A1 Safety and control device for an electric household appliance |
| 09/23/2008 | CA2432471C High efficiency directional coupler |
| 09/23/2008 | CA2432467C High efficiency interdigital filter |
| 09/23/2008 | CA2169852C Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 09/18/2008 | WO2008112658A1 Embedded capacitive stack |
| 09/18/2008 | WO2008111309A1 Recognition mark, and circuit substrate manufacturing method |
| 09/18/2008 | WO2008110402A1 Copper inlay for printed circuit boards |
| 09/18/2008 | WO2008057717B1 Method for fabricating closed vias in a printed circuit board |
| 09/18/2008 | WO2006110616A3 Layered structure with printed elements |
| 09/18/2008 | US20080227946 Thermosetting Composition and Curing Method Thereof |
| 09/18/2008 | US20080226979 Protection circuit board for secondary battery and secondary battery using the same |
| 09/18/2008 | US20080226815 Novel thin laminate as embedded capacitance material in printed circuit boards |
| 09/18/2008 | US20080225502 Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid |