Patents for H05K 1 - Printed circuits (98,583)
08/2008
08/28/2008DE102004038970B4 HF-Zwischenverbindung für Mehrfach-Verdrahtungsebenen mit impedanzdefinierten Leiterbahnstrukturen RF interconnect for multiple wiring layers with defined impedance interconnect structures
08/27/2008EP1962568A2 Structure of light emitting diode and method to assemble thereof
08/27/2008EP1962567A2 Press-fit pin and board structure
08/27/2008EP1962566A2 Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices
08/27/2008EP1962342A1 Substrate with built-in chip and method for manufacturing substrate with built-in chip
08/27/2008EP1962302A1 Composite transformer and insulated switching power supply
08/27/2008EP1962173A1 Optoelectronic module equipped with at least one photoreceptor circuit
08/27/2008EP1961554A1 Prepreg and laminate
08/27/2008EP1961282A2 Arrangement comprising at least one electronic component
08/27/2008EP1961043A2 Universal pad arrangement for surface mounted semiconductor devices
08/27/2008EP1371010B1 Optical reader imaging module
08/27/2008EP1011298B1 Substrate for formation of special pattern, and method of manufacture of substrate
08/27/2008CN101253825A Sheet-like composite electronic component and method for manufacturing same
08/27/2008CN101253824A Electronic circuit connection structure and its manufacturing method
08/27/2008CN101253823A Hardware protection for preventing sensitive electronic data component from being operated by external
08/27/2008CN101253822A Jointing structure and jointing method of circuit boards, pressuring tools for jointing circuit board
08/27/2008CN101253821A Hardware protected sensor for preventing sensitive electronic data component from being operated by external
08/27/2008CN101253820A Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing
08/27/2008CN101253433A Optical waveguide film, method for manufacturing the film, optoelectrical hybrid film including the waveguide film, and electronic device
08/27/2008CN101252820A Semiconductor device and display apparatus
08/27/2008CN101252819A Composite board for heat sinking and forming method thereof
08/27/2008CN101252814A Wiring substrate
08/27/2008CN101252809A Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices
08/27/2008CN101252808A Soldering circuit plate and soldering method thereof
08/27/2008CN101252807A Circuit board and electronic equipment having the same, method of manufacturing same
08/27/2008CN101252806A Printed circuit board
08/27/2008CN101252123A High-frequency signal processing module and electronic device
08/27/2008CN101252091A Forming method of sliver hole on substrate and substrate structure
08/27/2008CN101251904A Radio frequency tag and method for manufacturing radio frequency tag
08/27/2008CN100415067C External connection terminal fixing structure and mobile terminal device
08/27/2008CN100414836C Conductive parts
08/27/2008CN100414699C Wiring substrate
08/27/2008CN100414404C Circuit member connection structure and liquid crystal display panel
08/27/2008CN100414403C Display device
08/27/2008CN100414362C Liquid crystal display module
08/27/2008CN100413684C Circuit protective composites
08/27/2008CN100413675C Method for producing laminated plate
08/26/2008US7418603 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program
08/26/2008US7417872 Circuit board with trace configuration for high-speed digital differential signaling
08/26/2008US7417871 Memory module
08/26/2008US7417870 Multi-layer board with decoupling function
08/26/2008US7417869 Methods and systems for filtering signals
08/26/2008US7417867 Printed wiring board and display apparatus
08/26/2008US7417827 Head/slider supporting structure having lead wire inclined relative to slider pad
08/26/2008US7417596 Ground connection of a printed circuit board placed in a wristwatch type electronic device
08/26/2008US7417523 Ultra-thin flexible inductor
08/26/2008US7417322 Multi-chip module with embedded package and method for manufacturing the same
08/26/2008US7417318 Thick film circuit board, method of producing the same and integrated circuit device
08/26/2008US7417292 Arrangement for connecting the terminal contacts of an optoelectronic component to a printed circuit board
08/26/2008US7417197 Direct contact power transfer pad and method of making same
08/26/2008US7417196 Multilayer board with built-in chip-type electronic component and manufacturing method thereof
08/26/2008US7417195 Circuit board and circuit board connection structure
08/26/2008US7417194 ESD protection devices and methods of making same using standard manufacturing processes
08/26/2008US7416996 Method of making circuitized substrate
08/26/2008US7416972 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
08/26/2008US7416812 Battery provided with terminals
08/26/2008US7416431 Pivoting apparatus for mating a power supply with a riser card and method for doing the same
08/26/2008US7416420 Conductive adhesive bond
08/26/2008US7416282 Printhead having common actuator for inkjet nozzles
08/26/2008US7416132 Memory card with and without enclosure
08/26/2008US7415761 Method of manufacturing multilayered circuit board
08/21/2008WO2008099856A1 Elecric device-installed apparatus and its noise reduction method
08/21/2008WO2008099527A1 Flexible circuit board and process for producing the same
08/21/2008WO2008098272A1 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
08/21/2008WO2008098271A1 Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor
08/21/2008WO2008098270A1 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
08/21/2008WO2008098269A1 Method for removing a part of a planar material layer and multilayer structure
08/21/2008WO2008083250A3 Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate
08/21/2008WO2008075248A3 Lighting device of leds on a transparent substrate
08/21/2008WO2008033484B1 Connection for flex circuit and rigid circuit board
08/21/2008US20080200326 Aluminum nitride powder and aluminum nitride sintered compact
08/21/2008US20080198567 Multilayer printed circuit board
08/21/2008US20080198561 High-frequency signal processing module and electronic device
08/21/2008US20080197700 Method For the Attachment of Ribbon Cable Systems
08/21/2008US20080196935 Multilayer printed wiring boards with copper filled through-holes
08/21/2008US20080196934 Circuit board process
08/21/2008US20080196933 Printed circuit board substrate and method for constructing same
08/21/2008US20080196932 Multilayer substrate including components therein
08/21/2008US20080196931 Printed circuit board having embedded components and method for manufacturing thereof
08/21/2008US20080196930 Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure
08/21/2008US20080196929 Optical transmitter module
08/21/2008US20080196928 Method For the Production of a Functional Constructional Unit, and Functional Constructional Unit
08/21/2008US20080196927 Working panel for multilayer printed circuit board
08/21/2008DE4404986B4 Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung Means for contacting an electrical conductor and methods of making such a device
08/21/2008DE19824225B4 Verfahren zur Herstellung einer gedruckten Schaltungsplatte A process for producing a printed circuit board
08/21/2008DE102008006959A1 Schutz für Schaltungsplatinen Protection for circuit boards
08/21/2008DE102007008109A1 Printed circuit board arrangement has multiple printed circuit boards for opto-electronic components, where two neighbouring printed circuit boards are connected by a connecting body
08/21/2008DE102004046251B4 Verfahren zur biegenden Herstellung eines Geräts der Leistungselektronik A process for producing a bending of the power electronics unit
08/21/2008DE102004025773B4 Elektronisches Bauelement mit thermisch voneinander isolierten Bereichen Electronic component with thermally insulated from one another areas
08/20/2008EP1959717A1 Printed wiring board with component-mounting pin
08/20/2008EP1959716A2 Multilayer Printed Circuit Board
08/20/2008EP1959280A2 Optical transmitter module
08/20/2008EP1958970A1 Resin for thermal imprinting
08/20/2008EP1957612A2 Flame retardant compositions with a phosphorated compound
08/20/2008EP1314342B1 Method, apparatus and use of applying viscous medium on a substrate
08/20/2008EP1229772B1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it
08/20/2008EP1101228B1 Polymer thick-film resistor printed on planar circuit board surface
08/20/2008CN101248708A Dielectric substrate with holes and method of manufacture
08/20/2008CN101248556A Microminiature contact and method for manufacturing same, and electronic component
08/20/2008CN101248436A Hardware protection in form of printed circuit board drawn into semi-case