| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/21/2010 | US20100014259 Modular circuit board structure for large current area |
| 01/21/2010 | US20100014035 Printed circuit board and method for manufacturing the same |
| 01/21/2010 | US20100012368 Ceramic substrate manufacturing method and ceramic substrate |
| 01/21/2010 | US20100012367 Printed circuit board arrangement |
| 01/21/2010 | US20100012366 Wiring board having via and method forming a via in a wiring board |
| 01/21/2010 | US20100012365 Printed circuit board |
| 01/21/2010 | US20100012364 Method of manufacturing electronic component embedded circuit board |
| 01/21/2010 | US20100012363 Printed circuit board and layout method thereof |
| 01/21/2010 | US20100012362 Resin composition, resin film, cover lay film, interlayer adhesive, metal-clad laminate and multilayer printed circuit board |
| 01/21/2010 | US20100012361 Circuit obfuscation |
| 01/21/2010 | US20100012360 Circuit element mounting board, and circuit device and air conditioner using the same |
| 01/21/2010 | US20100012359 Article with a Coating of Electrically Conductive Polymer and Precious/Semiprecious Metal and Process for Production Thereof |
| 01/21/2010 | US20100012358 Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| 01/21/2010 | US20100012357 Printed Circuit Board With Improved Via Design |
| 01/21/2010 | US20100012356 Printed wiring board having recognition mark |
| 01/21/2010 | US20100012355 Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier |
| 01/21/2010 | US20100012354 Thermally conductive polymer based printed circuit board |
| 01/21/2010 | US20100012353 Elongated semiconductor devices, methods of making same, and systems for making same |
| 01/21/2010 | US20100012352 Photoimaging method and apparatus |
| 01/21/2010 | DE10340069B4 Oberflächenbefestigbare Elektronikvorrichtung Surface mount electronic device |
| 01/20/2010 | EP2146558A2 Attachment assembly for a safety module and use of a screw for attaching a safety module |
| 01/20/2010 | EP2146557A1 Integrated microwave circuit |
| 01/20/2010 | EP2146556A1 Waveguide structure and printed-circuit board |
| 01/20/2010 | EP2146374A1 Printed circuit board assembly |
| 01/20/2010 | EP2145910A1 Linear polyimide precursor having asymmetric structure, polyimide, and their production methods |
| 01/20/2010 | EP2145515A2 High thermal-efficient metal core printed circuit board with selective electrical and thermal circuitry connectivity |
| 01/20/2010 | EP1911334B1 Method and system for electrically coupling an information carrier to a contact element |
| 01/20/2010 | EP1641081B1 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box |
| 01/20/2010 | CN201388353Y Veneer |
| 01/20/2010 | CN201388343Y Auxiliary device for electronic component |
| 01/20/2010 | CN201388342Y Resonant cavity integrated on PCB |
| 01/20/2010 | CN201388341Y Flexible printed circuit board |
| 01/20/2010 | CN201388340Y Aluminum substrate structure |
| 01/20/2010 | CN201388339Y Phenolic paper two-sided copper-clad plate |
| 01/20/2010 | CN201388338Y Phenolic paper one-side copper-clad plate |
| 01/20/2010 | CN201388337Y Flame-proofing epoxy novolac paper two-sided copper-clad plate |
| 01/20/2010 | CN201388336Y Flame-proofing epoxy novolac paper one-side copper-clad plate |
| 01/20/2010 | CN201388335Y Epoxy glass cloth two-sided copper-clad plate |
| 01/20/2010 | CN201388334Y Configuration structure of circuit board |
| 01/20/2010 | CN201387944Y Electrical connector |
| 01/20/2010 | CN101631425A Circuit board and coexistence wiring method thereof |
| 01/20/2010 | CN101631424A Rigid and flexible circuit board and manufacture method thereof |
| 01/20/2010 | CN101631423A Multi-layer printed board |
| 01/20/2010 | CN100584156C Circuit board and its making method |
| 01/20/2010 | CN100584153C Electronic device and method of manufacturing the same |
| 01/20/2010 | CN100584150C Multilayer printed wiring board |
| 01/20/2010 | CN100584149C Circuit base plate |
| 01/20/2010 | CN100584148C Wiring structure of transmission wire in high speed printed circuit board |
| 01/20/2010 | CN100584147C Soft circuit board and its making method |
| 01/20/2010 | CN100584146C Multilayer ceramic substrate and production method thereof |
| 01/20/2010 | CN100584145C Circuit board system |
| 01/20/2010 | CN100584144C A passive base board for the switch power module and its making method |
| 01/20/2010 | CN100583573C Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection |
| 01/20/2010 | CN100583472C Substrate for light-emitting element packaging, luminescent module, and lighting apparatus |
| 01/20/2010 | CN100583428C Selective reference plane bridge(s) on folded package |
| 01/20/2010 | CN100583424C Encapsulation base plate |
| 01/20/2010 | CN100583423C Multilayered wiring substrate and method of manufacturing the same |
| 01/20/2010 | CN100583133C Polymeric film substrate for use in radio-frequency responsive tags |
| 01/20/2010 | CN100582883C Flat panel display device and portable display apparatus using the same |
| 01/20/2010 | CN100582366C Non-woven sheet of aramid flocculate |
| 01/20/2010 | CN100582167C Resin composition for composite dielectric body, composite dielectric body, and electrical circuit board using such composite dielectric body |
| 01/20/2010 | CN100582143C Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate |
| 01/20/2010 | CN100581812C Method for preparing laminated board |
| 01/20/2010 | CN100581660C Structure for mounting multi-featured vibration actuator on circuit board |
| 01/19/2010 | US7649749 Wiring substrate, semiconductor device, and method of manufacturing the same |
| 01/19/2010 | US7649747 IC device having compact design |
| 01/19/2010 | US7649742 Thin flash-hard-drive with two-piece casing |
| 01/19/2010 | US7649731 Power distribution module using buss bar |
| 01/19/2010 | US7649368 Wafer level interposer |
| 01/19/2010 | US7649279 Power supply for simultaneously providing operating voltages to a plurality of devices |
| 01/19/2010 | US7649252 Ceramic multilayer substrate |
| 01/19/2010 | US7649144 Connection structure between wired circuit boards |
| 01/19/2010 | US7649143 Wired-circuit-board assembly sheet |
| 01/19/2010 | US7648774 Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same |
| 01/19/2010 | US7648372 Cable assembly having connector with interior framework |
| 01/19/2010 | US7647691 Method of producing antenna elements for a wireless communication device |
| 01/19/2010 | CA2400350C Melt-processible poly(tetrafluoroethylene) |
| 01/14/2010 | WO2010004981A1 Microstructure, and method for production thereof |
| 01/14/2010 | WO2010004943A1 Electronic circuit and ic tag |
| 01/14/2010 | WO2010004929A1 Interlayer connecting member for multilayer printed wiring board, method for manufacturing the interlayer connecting member, multilayer printed wiring board, and method for manufacturing the multilayer printed wiring board |
| 01/14/2010 | WO2010004885A1 Surface treated copper foil |
| 01/14/2010 | WO2010004875A1 Flexible substrate and electric circuit structure |
| 01/14/2010 | WO2010004793A1 Anisotropic conductive film |
| 01/14/2010 | WO2009141145A4 Digital television receiver |
| 01/14/2010 | WO2003071378A9 High capacity memory module with built-in performance enhancing features |
| 01/14/2010 | US20100011397 Packet timing method and apparatus of a receiver system for controlling digital tv program start time |
| 01/14/2010 | US20100009201 thermosetting resins; butadiene-methacrylate core shell particles; high performance; dielectrics; fireproofing |
| 01/14/2010 | US20100009179 Insulated ultrafine powder, process for producing same and resin composite material with high dielectric constant using same |
| 01/14/2010 | US20100009178 Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor |
| 01/14/2010 | US20100009169 Reducing Dusting of Epoxy Laminates |
| 01/14/2010 | US20100008058 Semiconductor device |
| 01/14/2010 | US20100008056 Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| 01/14/2010 | US20100008055 Method of fabricating electronic cards including at least one printed pattern |
| 01/14/2010 | US20100007701 Ceramic printed circuit board (pcb) and inkjet printhead assembly using the same |
| 01/14/2010 | US20100007033 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates |
| 01/14/2010 | US20100007012 Electronic system modules |
| 01/14/2010 | US20100006992 Fine-pitch routing in a lead frame based system-in-package (SIP) device |
| 01/14/2010 | US20100006978 Circuit board and semiconductor device |
| 01/14/2010 | US20100006869 Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package |
| 01/14/2010 | US20100006335 Multilayer ceramic substrate and method for manufacturing the same |