| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/17/1976 | US3975758 Gate assist turn-off, amplifying gate thyristor and a package assembly therefor |
| 08/17/1976 | US3975757 Molded electrical device |
| 08/17/1976 | US3975201 Vehicle and printing pastes for use in the manufacture of microelectronic packages |
| 08/10/1976 | US3974518 Encapsulation for high frequency semiconductor device |
| 08/10/1976 | US3974517 Metallic ground grid for integrated circuits |
| 08/03/1976 | US3973271 Semiconductor device having bonding pads extending over active regions |
| 07/27/1976 | US3972063 Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope |
| 07/27/1976 | US3972062 Mounting assemblies for a plurality of transistor integrated circuit chips |
| 07/27/1976 | US3971684 Etching thin film circuits and semiconductor chips |
| 07/27/1976 | US3971661 Formation of openings in dielectric sheet |
| 07/20/1976 | US3971062 Semiconductor arrangement |
| 07/13/1976 | US3969754 Semiconductor device having supporting electrode composite structure of metal containing fibers |
| 07/13/1976 | US3969752 Hybrid transistor |
| 07/13/1976 | US3969745 Interconnection in multi element planar structures |
| 07/13/1976 | US3969543 Method of providing a patterned layer of silicon-containing oxide on a substrate |
| 07/13/1976 | US3969150 Method of MOS transistor manufacture |
| 07/13/1976 | US3968563 Precision registration system for leads |
| 07/06/1976 | US3968511 Semiconductor device with additional carrier injecting junction adjacent emitter region |
| 07/06/1976 | US3968193 Firing process for forming a multilayer glass-metal module |
| 07/06/1976 | US3967371 Methods of manufacturing multilayer interconnections for integrated circuits and to integrated circuits utilizing said method |
| 07/06/1976 | US3967366 Method of contacting contact points of a semiconductor body |
| 07/06/1976 | US3967364 Method of manufacturing semiconductor devices |
| 06/29/1976 | US3967310 Semiconductor device having controlled surface charges by passivation films formed thereon |
| 06/29/1976 | US3967306 Asymmetrical well charge coupled device |
| 06/29/1976 | US3965971 Cooling system for semiconductors |
| 06/29/1976 | US3965567 Method for producing diffused contacted and surface passivated semiconductor chips for semiconductor devices |
| 06/22/1976 | US3965277 Photoformed plated interconnection of embedded integrated circuit chips |
| 06/22/1976 | US3964920 Solder glass composition and method of using same for encapsulating devices |
| 06/22/1976 | US3964157 Method of mounting semiconductor chips |
| 06/22/1976 | US3964156 Electrical solid-state devices |
| 06/15/1976 | US3964093 Bonding of dissimilar workpieces to a substrate |
| 06/15/1976 | US3964092 Semiconductor devices with conductive layer structure |
| 06/15/1976 | US3963505 Lead-zinc-boron sealing glass compositions |
| 06/15/1976 | US3963500 Phosphorus pentoxide, boric anhydride, solvent, noble metal salts or oxides |
| 06/15/1976 | US3962779 Method for fabricating oxide isolated integrated circuits |
| 06/08/1976 | US3962713 Large value capacitor |
| 06/08/1976 | US3962669 Electrical contact structure for semiconductor body |
| 06/08/1976 | US3961666 Heat dispersion device for use in an electronic apparatus |
| 06/08/1976 | US3961415 Carrier for mounting a semiconductor chip and method therefor |
| 06/08/1976 | US3961414 Semiconductor structure having metallization inlaid in insulating layers and method for making same |
| 06/08/1976 | US3961413 Method and apparatus for the assembly of semiconductor devices |
| 06/01/1976 | US3961358 Leakage current prevention in semiconductor integrated circuit devices |
| 06/01/1976 | US3961356 Integrated circuit with oxidation-junction isolation and channel stop |
| 06/01/1976 | US3961355 Semiconductor device having electrically insulating barriers for surface leakage sensitive devices and method of forming |
| 06/01/1976 | US3961350 Method and chip configuration of high temperature pressure contact packaging of Schottky barrier diodes |
| 06/01/1976 | US3960674 Method of depositing a metal on a surface comprising an electrically non-conductive ferrite |
| 06/01/1976 | US3960623 Membrane mask for selective semiconductor etching |
| 06/01/1976 | US3960561 Method for making electrical lead frame devices |
| 06/01/1976 | US3960559 Method of making a semiconductor device utilizing a light-sensitive etching agent |
| 06/01/1976 | US3959874 Method of forming an integrated circuit assembly |
| 06/01/1976 | US3959840 Pipe cleaning apparatus |
| 05/25/1976 | US3959763 Four terminal varistor |
| 05/25/1976 | US3959579 Apertured semi-conductor device mounted on a substrate |
| 05/25/1976 | US3959047 Method for constructing a rom for redundancy and other applications |
| 05/25/1976 | US3958742 Manufacture of supports for semiconductor devices |
| 05/18/1976 | US3958195 R.f. transistor package having an isolated common lead |
| 05/18/1976 | US3958075 High power thick film circuit with overlapping lead frame |
| 05/18/1976 | US3956821 Method of attaching semiconductor die to package substrates |
| 05/18/1976 | US3956820 Method of manufacturing a semiconductor device having a lead bonded to a surface thereof |
| 05/11/1976 | US3956672 In line rectifier assembly |
| 05/11/1976 | US3956052 Masking, masking, machining, coating, peeling |
| 05/11/1976 | US3956033 Method of fabricating an integrated semiconductor transistor structure with epitaxial contact to the buried sub-collector |
| 05/04/1976 | US3955122 Heat sink mounting for controlled rectifiers |
| 05/04/1976 | US3954523 Process for fabricating devices having dielectric isolation utilizing anodic treatment and selective oxidation |
| 05/04/1976 | US3954486 Solder glass with refractory filler |
| 04/27/1976 | US3953877 Semiconductors covered by a polymeric heat resistant relief structure |
| 04/27/1976 | US3953266 Platinum and chromium layers, masking, etching |
| 04/27/1976 | US3953265 Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers |
| 04/27/1976 | US3952797 Semi conductor cooling system |
| 04/27/1976 | US3952403 Shell eyelet axial lead header for planar contact semiconductive device |
| 04/20/1976 | US3952231 Functional package for complex electronic systems with polymer-metal laminates and thermal transposer |
| 04/20/1976 | US3951701 Mask for use in production of semiconductor arrangements |
| 04/20/1976 | US3950843 Continuous film transistor fabrication process |
| 04/13/1976 | US3950778 Iron-copper-carbon |
| 04/13/1976 | US3950603 Enclosure case for potless immobilization of circuit components |
| 04/13/1976 | US3950233 Electroforming gold layer, roughness |
| 04/13/1976 | US3950174 Silicon dioxide, calcium oxide, aluminum oxide |
| 04/13/1976 | US3950142 Glass envelope, copper coating, metallic seal |
| 04/13/1976 | US3950140 Combination strip frame for semiconductive device and gate for molding |
| 04/06/1976 | US3949274 Packaging and interconnection for superconductive circuitry |
| 04/06/1976 | US3947957 Mounting integrated circuit elements |
| 04/06/1976 | US3947953 Method of making plastic sealed cavity molded type semi-conductor devices |
| 04/06/1976 | US3947952 Method of encapsulating beam lead semiconductor devices |
| 03/30/1976 | US3947869 Semiconductor device having internal junction passsivating insulating layer |
| 03/30/1976 | US3947868 Air-cooled converter assembly, having heat sinks shaped as isosceles triangles |
| 03/30/1976 | US3947867 Two part package for a semiconductor die |
| 03/30/1976 | US3947304 Ferricyanide etchant |
| 03/30/1976 | US3947303 Method for producing a surface stabilizing protective layer in semiconductor devices |
| 03/30/1976 | US3947299 Method of manufacturing semiconductor devices |
| 03/30/1976 | US3947298 Method of forming junction regions utilizing R.F. sputtering |
| 03/23/1976 | US3946429 Self-fusing transcalent electrical device |
| 03/23/1976 | US3946428 Encapsulation package for a semiconductor element |
| 03/23/1976 | US3946426 Interconnect system for integrated circuits |
| 03/23/1976 | US3946421 Multi phase double level metal charge coupled device |
| 03/23/1976 | US3946420 Two level electrode configuration for three phase charge coupled device |
| 03/23/1976 | US3946278 Fail-safe four leaded zener diode arrangement |
| 03/23/1976 | US3946276 Island assembly employing cooling means for high density integrated circuit packaging |
| 03/23/1976 | US3945826 Precious metal |
| 03/23/1976 | US3945347 Method of making integrated circuits |
| 03/23/1976 | US3945111 Metallization system for semiconductor devices, devices utilizing such metallization system and method for making devices and metallization system |