Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2013
01/09/2013CN102870194A Substrate processing apparatus
01/09/2013CN102870193A Selective nanoparticle assembly systems and methods
01/09/2013CN102870192A Three dimensional inductor and transformer design methodology of glass technology
01/09/2013CN102870191A Device and method for mechanically texturing a silicon wafer intended to comprise a photovoltaic cell, and resulting silicon wafer
01/09/2013CN102870166A Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
01/09/2013CN102870071A Pad for touch panel and touch panel using same
01/09/2013CN102870046A Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition
01/09/2013CN102870045A Positive Radiation-sensitive Composition For Discharge Nozzle Coating Method, Interlayer Insulating Film For Display Element, And Formation Method For Same
01/09/2013CN102869817A 碳化硅衬底 SiC substrates
01/09/2013CN102869816A 碳化硅衬底 SiC substrates
01/09/2013CN102869690A Active energy ray-curable resin composition, nano ridge/groove structure using same and production method for said structure, and water repellent article provided with nano ridge/groove structure
01/09/2013CN102869630A Methods to fabricate a photoactive substrate suitable for microfabrication
01/09/2013CN102869587A Article transport facility
01/09/2013CN102869478A Sapphire polishing slurry and sapphire polishing method
01/09/2013CN102869476A Wafer chamfering device
01/09/2013CN102867924A Organic layer deposition apparatus, organic light-emitting display device, and method of manufacturing the same
01/09/2013CN102867915A Semiconductor device and method of manufacturing the same, and method of manufacturing image display device
01/09/2013CN102867857A Schottky diode with extended forward current capability
01/09/2013CN102867855A Amorphous oxide and thin film transistor
01/09/2013CN102867854A 半导体装置及其制造方法 Semiconductor device and manufacturing method
01/09/2013CN102867852A Transistor and method for forming same
01/09/2013CN102867851A Ion beam current signal amplifier and manufacturing method thereof
01/09/2013CN102867850A Semiconductor device with a high-k gate dielectric and a metal gate electrode
01/09/2013CN102867849A Fast recovery diode and manufacturing method thereof
01/09/2013CN102867848A Trench type power semiconductor element and manufacturing method thereof
01/09/2013CN102867847A Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
01/09/2013CN102867842A Super junction device and manufacturing method thereof
01/09/2013CN102867838A Organic light-emitting display apparatus and method of manufacturing the organic light-emitting display apparatus
01/09/2013CN102867831A Semiconductor device and method of manufacturing the same
01/09/2013CN102867830A Non-volatile memory device and method of manufacturing the same
01/09/2013CN102867829A Anti-fuse memory ultilizing a coupling channel and operating method thereof
01/09/2013CN102867824A Tri-strain tri-polycrystal-plane BiCMOS (Bipolar complementary metal oxide semiconductor) integrated device and preparation method thereof
01/09/2013CN102867823A Array substrate and manufacturing method and display device thereof
01/09/2013CN102867822A ESD protective device and preparation method thereof
01/09/2013CN102867817A Power electronic system with cooling device
01/09/2013CN102867816A Power electronics system with cooling device
01/09/2013CN102867815A Power module package and method for manufacturing the same
01/09/2013CN102867812A Crack detection line device and method
01/09/2013CN102867811A Semiconductor structure and manufacturing method thereof as well as method for manufacturing layouts of semiconductor
01/09/2013CN102867808A Package structure and method for fabricating the same
01/09/2013CN102867807A Coreless packaging substrate and method of fabricating the same
01/09/2013CN102867806A Packaging substrate and fabrication method thereof
01/09/2013CN102867805A Semiconductor packager and manufacturing method therefor
01/09/2013CN102867804A Semiconductor device including a contact clip having protrusions and manufacturing thereof
01/09/2013CN102867803A Bond line thickness control for die attachment
01/09/2013CN102867802A Multi-chip reversely-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof
01/09/2013CN102867801A Semiconductor carrier, package and fabrication method thereof
01/09/2013CN102867800A Connecting function chips to a package to form package-on-package
01/09/2013CN102867799A Packaging substrate and method of fabricating the same
01/09/2013CN102867798A Coreless package substrate and fabrication method thereof
01/09/2013CN102867796A 3D (three-dimensional) integrated circuit structure and method for detecting alignment of chip structures
01/09/2013CN102867795A Semiconductor device and method of manufacturing the same
01/09/2013CN102867792A Semiconductor device and method of manufacturing the same
01/09/2013CN102867791A Multi-chip reversely-arranged etched-encapsulated base island-buried encapsulating structure and manufacturing method thereof
01/09/2013CN102867790A Multi-chip positively-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof
01/09/2013CN102867789A Single-chip positively-arranged etched-encapsulated base island-exposed encapsulating structure and manufacturing method thereof
01/09/2013CN102867785A Nonvolatile memory device and manufacturing method thereof
01/09/2013CN102867784A Semiconductor device with a dislocation structure and method of forming the same
01/09/2013CN102867783A Apparatus and methods for dicing interposer assembly
01/09/2013CN102867782A Method for correcting electronically programmable fuse wire device
01/09/2013CN102867781A Novel process for performing dielectric membrane etching by using intramembrane blocking layer structure
01/09/2013CN102867780A Copper interconnection process
01/09/2013CN102867779A Defect solving means for metal hard photomask structure in 40/45 nanometer technology
01/09/2013CN102867778A Defect solution scheme for 40/45 nano process metal hard photomask structure
01/09/2013CN102867777A Forming grounded through-silicon vias in a semiconductor substrate
01/09/2013CN102867776A Forming wafer-level chip scale package structures with reduced number of seed layers
01/09/2013CN102867775A Filling method of deep groove
01/09/2013CN102867774A Method for manufacturing shallow trench isolation
01/09/2013CN102867773A Method for reducing HDPCVD (high density plasma chemical vapor deposition) defects
01/09/2013CN102867772A Pitch-variable clamp for wafer replacing
01/09/2013CN102867771A Clamping device with function of monitoring state of semiconductor chip and method
01/09/2013CN102867770A Silicon chip clamp for silicon chip implantation process
01/09/2013CN102867769A Wafer transfer mechanical arm and semiconductor manufacturing equipment
01/09/2013CN102867768A Method for improving wafer transmission efficiency of target chamber
01/09/2013CN102867767A Device and method for buffer-storing a multiplicity of wafer-type workpieces
01/09/2013CN102867766A Cassette for accomodating substrates
01/09/2013CN102867765A Detector and detection method for wafer position
01/09/2013CN102867764A Cartesian robot cluster tool architecture
01/09/2013CN102867763A Control apparatus, a substrate treating method, a substrate treating system, a method of operating a substrate treating system, a load port control apparatus, and a substrate treating system having the load port control apparatus
01/09/2013CN102867762A Monitoring method of photoetching wafer edge-washing and side glue removing quantity measurement stability
01/09/2013CN102867761A Defect scanning method and system capable of realizing dynamic complementation of wafers
01/09/2013CN102867760A Test circuit, integrated circuit, and test circuit layout method
01/09/2013CN102867759A Semiconductor package and manufacturing method thereof
01/09/2013CN102867758A Lug manufacturing process and structure thereof
01/09/2013CN102867757A UBM etching methods for eliminating undercut
01/09/2013CN102867756A Preparation method of active layer of metal oxide thin film field effect transistor
01/09/2013CN102867755A Method for forming NMOS (N-channel metal oxide semiconductor) device with low GIDL (gate induced drain leakage) current
01/09/2013CN102867754A Two-dimensional material nanometer device based on inversion process and forming method of two-dimensional material nanometer device
01/09/2013CN102867753A Radio frequency power transistor based on inversion process and forming method thereof
01/09/2013CN102867752A Method for fabricating semiconductor device with vertical gate
01/09/2013CN102867751A Preparation method for full-silicification metal gate silicon multi-gate fin field effect transistor
01/09/2013CN102867750A MOSFET (metal oxide semiconductor field effect transistor) and manufacturing method thereof
01/09/2013CN102867749A Method for forming MOS (metal oxide semiconductor) transistor
01/09/2013CN102867748A Transistor and manufacturing method thereof as well as semiconductor chip with transistor
01/09/2013CN102867747A Production process for O.J diode
01/09/2013CN102867746A Method for processing diode and diode
01/09/2013CN102867745A Etching method and system for improving uniformity of critical dimension of pattern in wafer
01/09/2013CN102867744A Method for increasing 1X DD (dual damascene) etching uniformity and reducing photoresist consumption
01/09/2013CN102867743A Method for improving morphologic difference between doped polysilicon gate etching and undoped polysilicon gate etching
01/09/2013CN102867742A Plasma etching method for eliminating morphologic deformation