| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/03/2013 | US20130005105 Solid state klystron |
| 01/03/2013 | US20130005104 Method for fabricating nonvolatile memory device |
| 01/03/2013 | US20130005103 Methods for fabricating a finfet integrated circuit on a bulk silicon substrate |
| 01/03/2013 | US20130005102 Data Cells with Drivers and Methods of Making and Operating the Same |
| 01/03/2013 | US20130005101 Method for producing a semiconductor device including a dielectric layer |
| 01/03/2013 | US20130005100 Semiconductor Cells, Arrays, Devices and Systems Having a Buried Conductive Line and Methods for Forming the Same |
| 01/03/2013 | US20130005099 Method for producing a semiconductor device including a dielectric layer |
| 01/03/2013 | US20130005098 Semiconductor device having a contact plug connecting to a silicide film formed on a diffusion region of a flash memory cell |
| 01/03/2013 | US20130005097 Method for integrating replacement gate in semiconductor device |
| 01/03/2013 | US20130005096 Semiconductor device and method of fabricating the same |
| 01/03/2013 | US20130005095 ETSOI CMOS With Back Gates |
| 01/03/2013 | US20130005094 Semiconductor Device and A Method of Manufacturing the Same |
| 01/03/2013 | US20130005093 Method of manufacturing a reverse blocking insulated gate bipolar transistor |
| 01/03/2013 | US20130005092 Method of fabricating semiconductor package |
| 01/03/2013 | US20130005091 Housing Body and Method for Production thereof |
| 01/03/2013 | US20130005090 Method for manufacturing a semiconductor device having a heat spreader |
| 01/03/2013 | US20130005089 Wafer Level Package For Heat Dissipation And Method Of Manufacturing The Same |
| 01/03/2013 | US20130005088 Methods of forming semiconductor modules and semiconductor modules formed by the same |
| 01/03/2013 | US20130005087 Method and apparatus for molding semiconductor device |
| 01/03/2013 | US20130005086 Method of manufactruing semiconductor device |
| 01/03/2013 | US20130005085 Semiconductor device and method for manufacturing the same |
| 01/03/2013 | US20130005084 Planar interconnect structure for hybrid circuits |
| 01/03/2013 | US20130005083 Four mosfet full bridge module |
| 01/03/2013 | US20130005082 Thin film transistor array substrate and method of fabricating the same |
| 01/03/2013 | US20130005081 METHOD OF IGZO AND ZNO TFT FABRICATION WITH PECVD SiO2 PASSIVATION |
| 01/03/2013 | US20130005080 Methods Utilizing Microwave Radiation During Formation Of Semiconductor Constructions |
| 01/03/2013 | US20130005062 Method for manufacturing semiconductor laser |
| 01/03/2013 | US20130005060 Methods for Pattering an Epitaxial Substrate and Forming a Light-Emitting Diode with Nano-Patterns |
| 01/03/2013 | US20130005059 Method of manufacturing flexible display |
| 01/03/2013 | US20130005056 Method and apparatus for processing wafer edge portion |
| 01/03/2013 | US20130004370 Quantitative sensor and manufacturing method thereof |
| 01/03/2013 | US20130004288 Method for minimizing contamination in semiconductor processing chamber |
| 01/03/2013 | US20130004284 Transport method |
| 01/03/2013 | US20130004270 Semiconductor stocker systems and methods |
| 01/03/2013 | US20130004268 Semiconductor Stocker Systems And Methods |
| 01/03/2013 | US20130004267 Gate valve and substrate processing system using same |
| 01/03/2013 | US20130004167 Optical frame attached with alignment features microfabrictated in die |
| 01/03/2013 | US20130004057 Method and apparatus for inspecting pattern defects |
| 01/03/2013 | US20130003771 Distributed feedback laser diode having asymmetric coupling coefficient and manufacturing method thereof |
| 01/03/2013 | US20130003769 Gallium nitride-based semiconductor laser device, and method for fabricating gallium nitride-based semiconductor laser device |
| 01/03/2013 | US20130003445 Sram cells, memory circuits, systems, and fabrication methods thereof |
| 01/03/2013 | US20130003440 Single Device Driver Circuit to Control Three-Dimensional Memory Element Array |
| 01/03/2013 | US20130003437 Multilayer Cross-Point Memory Array Having Reduced Disturb Susceptibility |
| 01/03/2013 | US20130003250 Substrate holding device |
| 01/03/2013 | US20130003249 Electrostatic chucks, substrate treating apparatuses including the same, and substrate treating methods |
| 01/03/2013 | US20130002915 Solid-state imaging device and electronic apparatus |
| 01/03/2013 | US20130002849 Method and apparatus for pattern inspection |
| 01/03/2013 | US20130001899 Electrostatic chuck assembly |
| 01/03/2013 | US20130001846 Cassette jig for wafer cleaning apparatus and cassette assembly having the same |
| 01/03/2013 | US20130001810 Method of Manufacturing a Part of a MEMS System |
| 01/03/2013 | US20130001808 Encapsulation device having improved sealing |
| 01/03/2013 | US20130001806 Fabrication process and device of multi-chip package having spliced substrates |
| 01/03/2013 | US20130001804 Semiconductor device and manufacturing method thereof |
| 01/03/2013 | US20130001803 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module |
| 01/03/2013 | US20130001794 In situ-built pin-grid arrays for coreless substrates, and methods of making same |
| 01/03/2013 | US20130001793 Package interconnects |
| 01/03/2013 | US20130001791 Method and Apparatuses for Integrated Circuit Substrate Manufacture |
| 01/03/2013 | US20130001790 System on a chip with interleaved sets of pads |
| 01/03/2013 | US20130001787 Semiconductor device and production method therefor |
| 01/03/2013 | US20130001786 Overlapping contacts for semiconductor device |
| 01/03/2013 | US20130001785 Semiconductor device and method for manufacturing same |
| 01/03/2013 | US20130001783 Interconnect Barrier Structure and Method |
| 01/03/2013 | US20130001780 Multi-component integrated circuit contacts |
| 01/03/2013 | US20130001778 Bump-on-trace (bot) structures |
| 01/03/2013 | US20130001777 Copper wire receiving pad |
| 01/03/2013 | US20130001776 Interconnect Structure for Wafer Level Package |
| 01/03/2013 | US20130001775 Conductive connecting member and manufacturing method of same |
| 01/03/2013 | US20130001767 Package and method for manufacturing package |
| 01/03/2013 | US20130001766 Processing method and processing device of semiconductor wafer, and semiconductor wafer |
| 01/03/2013 | US20130001765 Integrated heater on mems cap for wafer scale packaged mems sensors |
| 01/03/2013 | US20130001764 Power device having reduced thickness |
| 01/03/2013 | US20130001763 Power device having high switching speed |
| 01/03/2013 | US20130001761 Lead carrier with thermally fused package components |
| 01/03/2013 | US20130001760 Package substrate having die pad with outer raised portion and interior recessed portion |
| 01/03/2013 | US20130001759 Semiconductor package and method of manufacturing the semiconductor package |
| 01/03/2013 | US20130001757 Flip-chip qfn structure using etched lead frame |
| 01/03/2013 | US20130001754 In-situ photoresist strip during plasma etching of active hard mask |
| 01/03/2013 | US20130001753 Template substrate and method for manufacturing same |
| 01/03/2013 | US20130001752 Method of semiconductor manufacturing process |
| 01/03/2013 | US20130001751 Actinic ray-sensitive or radiation-sensitive resin composition, and actinic ray-sensitive or radiation-sensitive film and pattern forming method using the same |
| 01/03/2013 | US20130001750 Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation |
| 01/03/2013 | US20130001749 Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation |
| 01/03/2013 | US20130001748 Semiconductor substrate and method of forming |
| 01/03/2013 | US20130001747 Bipolar transistor and method for manufacturing the same |
| 01/03/2013 | US20130001746 Multi-finger capacitor with reduced series resistance |
| 01/03/2013 | US20130001743 Metal insulator metal structure with remote oxygen scavenging |
| 01/03/2013 | US20130001741 Integrated circuit with a fin-based fuse, and related fabrication method |
| 01/03/2013 | US20130001739 Semiconductor structures and devices and methods of forming the same |
| 01/03/2013 | US20130001737 Semiconductor devices structures including an isolation structure |
| 01/03/2013 | US20130001735 Thermally conductive substrate for galvanic isolation |
| 01/03/2013 | US20130001721 Magnetic tunnel junction having coherent tunneling structure |
| 01/03/2013 | US20130001712 Acceleration sensor |
| 01/03/2013 | US20130001710 Process for a sealed mems device with a portion exposed to the environment |
| 01/03/2013 | US20130001709 Systems and methods for vertically stacking a sensor on an integrated circuit chip |
| 01/03/2013 | US20130001707 Fabricating method of mos transistor, fin field-effect transistor and fabrication method thereof |
| 01/03/2013 | US20130001706 Method and Structure for Low Resistive Source and Drain Regions in a Replacement Metal Gate Process Flow |
| 01/03/2013 | US20130001700 Local interconnect having increased misalignment tolerance |
| 01/03/2013 | US20130001699 Trench junction barrier schottky structure with enhanced contact area integrated with a mosfet |
| 01/03/2013 | US20130001698 Method to modify the shape of a cavity using angled implantation |
| 01/03/2013 | US20130001696 Semiconductor device and method for manufacturing the same |