Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2013
01/08/2013US8350339 Integrated circuits having dummy gate electrodes and methods of forming the same
01/08/2013US8350337 Semiconductor device and method of forming the same
01/08/2013US8350335 Semiconductor device including off-set spacers formed as a portion of the sidewall
01/08/2013US8350334 Stress film forming method and stress film structure
01/08/2013US8350333 Semiconductor device and method for manufacturing same
01/08/2013US8350331 Semiconductor device and manufacturing method for the same
01/08/2013US8350329 Low trigger voltage electrostatic discharge NFET in triple well CMOS technology
01/08/2013US8350322 Semiconductor device and method for manufacturing the same
01/08/2013US8350319 Semiconductor device
01/08/2013US8350317 Power semiconductor devices and methods of manufacture
01/08/2013US8350311 Semiconductor device
01/08/2013US8350307 Semiconductor memory device with power decoupling capacitors and method of fabrication
01/08/2013US8350306 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
01/08/2013US8350301 Semiconductor photodiode device and manufacturing method thereof
01/08/2013US8350300 Semiconductor device having air gaps in multilayer wiring structure
01/08/2013US8350298 Hybrid material inversion mode GAA CMOSFET
01/08/2013US8350297 Compound semiconductor device and production method thereof
01/08/2013US8350278 Nitride semiconductor light-emitting device
01/08/2013US8350274 Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting unit
01/08/2013US8350267 Flat panel display
01/08/2013US8350254 Multilayer polymer electroluminescent device comprising water-soluble polymer layer containing cations and method for fabricating the same
01/08/2013US8350246 Structure of porous low-k layer and interconnect structure
01/08/2013US8350236 Aromatic molecular carbon implantation processes
01/08/2013US8350214 Charged particle beam applied apparatus
01/08/2013US8349746 Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structure
01/08/2013US8349745 Fabrication of a semiconductor nanoparticle embedded insulating film luminescence device
01/08/2013US8349744 Double deposition of a stress-inducing layer in an interlayer dielectric with intermediate stress relaxation in a semiconductor device
01/08/2013US8349743 Method for fabricating light emitting device
01/08/2013US8349742 Gallium nitride-based semiconductor device and method for manufacturing the same
01/08/2013US8349741 Amorphous carbon deposition method for improved stack defectivity
01/08/2013US8349740 Reduced topography-related irregularities during the patterning of two different stress-inducing layers in the contact level of a semiconductor device
01/08/2013US8349739 Conformal etch material and process
01/08/2013US8349738 Metal precursors for deposition of metal-containing films
01/08/2013US8349737 Manufacturing method of array substrate using lift-off method
01/08/2013US8349736 Semiconductor device manufacturing method and semiconductor device
01/08/2013US8349735 Semiconductor device and method of forming conductive TSV with insulating annular ring
01/08/2013US8349734 Integrated circuits having backside test structures and methods for the fabrication thereof
01/08/2013US8349733 Manufacturing method of substrate with through electrode
01/08/2013US8349732 Implanted metal silicide for semiconductor device
01/08/2013US8349731 Methods for forming copper diffusion barriers for semiconductor interconnect structures
01/08/2013US8349730 Transitional interface between metal and dielectric in interconnect structures
01/08/2013US8349729 Hybrid bonding interface for 3-dimensional chip integration
01/08/2013US8349728 Method of fabricating copper damascene and dual damascene interconnect wiring
01/08/2013US8349727 Integrated method for high-density interconnection of electronic components through stretchable interconnects
01/08/2013US8349726 Method for fabricating a structure for a semiconductor device using a halogen based precursor
01/08/2013US8349725 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and storage medium
01/08/2013US8349724 Method for improving electromigration lifetime of copper interconnection by extended post anneal
01/08/2013US8349723 Structure of power grid for semiconductor devices and method of making the same
01/08/2013US8349722 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device
01/08/2013US8349721 Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
01/08/2013US8349720 Nonvolatile semiconductor memory and manufacturing method thereof
01/08/2013US8349719 Semiconductor device and method for fabricating the same
01/08/2013US8349718 Self-aligned silicide formation on source/drain through contact via
01/08/2013US8349717 High voltage LDMOS
01/08/2013US8349716 Semiconductor device with reduced junction leakage and an associated method of forming such a semiconductor device
01/08/2013US8349715 Nanoscale chemical templating with oxygen reactive materials
01/08/2013US8349714 Method of crystallizing semiconductor film and method of manufacturing semiconductor device
01/08/2013US8349713 High speed laser crystallization of particles of photovoltaic solar cells
01/08/2013US8349712 Layer assembly
01/08/2013US8349711 Single crystal group III nitride articles and method of producing same by HVPE method incorporating a polycrystalline layer for yield enhancement
01/08/2013US8349710 Shielding techniques for an integrated circuit
01/08/2013US8349709 Method of layout of pattern
01/08/2013US8349708 Integrated circuits on a wafer and methods for manufacturing integrated circuits
01/08/2013US8349707 Process for making contact with and housing integrated circuits
01/08/2013US8349706 Semiconductor surface protecting method
01/08/2013US8349705 Method of manufacturing semiconductor device
01/08/2013US8349704 Method for manufacturing SOI substrate and SOI substrate
01/08/2013US8349703 Method of bonding two substrates
01/08/2013US8349702 Method for manufacturing semiconductor substrate
01/08/2013US8349701 Combination of a substrate and a wafer
01/08/2013US8349700 Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
01/08/2013US8349699 Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry
01/08/2013US8349698 Integrated semiconductor device and method of manufacturing the same
01/08/2013US8349697 Field effect transistor with air gap dielectric
01/08/2013US8349696 Asymmetric MIM capacitor for DRAM devices
01/08/2013US8349694 Enhanced confinement of high-K metal gate electrode structures by reducing material erosion of a dielectric cap layer upon forming a strain-inducing semiconductor alloy
01/08/2013US8349693 Method of manufacturing a semiconductor device having a super junction
01/08/2013US8349692 Channel surface technique for fabrication of FinFET devices
01/08/2013US8349691 Method of forming power MOSFET
01/08/2013US8349690 Semiconductor device with one-side-contact and method for fabricating the same
01/08/2013US8349689 Non-volatile memory device and method for fabricating the same
01/08/2013US8349688 Nonvolatile semiconductor memory transistor and method for manufacturing nonvolatile semiconductor memory
01/08/2013US8349686 Nonvolatile semiconductor memory device and method of manufacturing the same
01/08/2013US8349685 Dual spacer formation in flash memory
01/08/2013US8349684 Semiconductor device with high K dielectric control terminal spacer structure
01/08/2013US8349683 Production method of a capacitor
01/08/2013US8349682 Method for fabricating metal gate transistor and polysilicon resistor
01/08/2013US8349681 Ultrahigh density monolithic, three dimensional vertical NAND memory device
01/08/2013US8349680 High-k metal gate CMOS patterning method
01/08/2013US8349679 Semiconductor device and method of manufacturing the same
01/08/2013US8349678 Laterally diffused metal oxide semiconductor transistor with partially unsilicided source/drain
01/08/2013US8349677 Semiconductor device and method for manufacturing the same
01/08/2013US8349676 Electrostatic discharge management apparatus, systems, and methods
01/08/2013US8349675 Method for forming a gate electrode
01/08/2013US8349674 Forming borderless contact for transistors in a replacement metal gate process
01/08/2013US8349673 Method of producing plurality of organic transistors using laser patterning
01/08/2013US8349672 Display element manufacturing method and manufacturing apparatus, thin film transistor manufacturing method and manufacturing apparatus, and circuit forming apparatus
01/08/2013US8349671 Methods for manufacturing thin film transistor and display device
01/08/2013US8349670 Selective floating body SRAM cell
01/08/2013US8349669 Thin film transistors using multiple active channel layers