| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/02/2013 | CN102854684A Metallic oxide fringing field switching mode liquid crystal display panel and manufacture method thereof |
| 01/02/2013 | CN102854683A Metal oxide in-plane switching liquid crystal display panel and manufacturing method thereof |
| 01/02/2013 | CN102854682A Array substrate for fringe field switching mode liquid crystal display and method of manufacturing the same |
| 01/02/2013 | CN102854681A Array substrate, display device, and manufacture method of array substrate |
| 01/02/2013 | CN102854677A Array substrate, production method of array substrate and display device |
| 01/02/2013 | CN102854663A Alignment film, colored film substrate, array substrate, liquid crystal display device and manufacturing method |
| 01/02/2013 | CN102854649A Liquid crystal display (LCD) panel, LCD and manufacturing method of LCD |
| 01/02/2013 | CN102854229A Integrated electronic sensor |
| 01/02/2013 | CN102853099A Gate valve and substrate processing system using same |
| 01/02/2013 | CN102853081A Sealing ring of equipment in semiconductor manufacturing method |
| 01/02/2013 | CN102851734A Semiconductor epitaxy structure and growth method thereof |
| 01/02/2013 | CN102851733A Preparation system and preparation method for gallium nitride base material and device thereof |
| 01/02/2013 | CN102851647A Integration of bottom-up metal film deposition |
| 01/02/2013 | CN102850982A Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure |
| 01/02/2013 | CN102849462A Device used for conveying substrate |
| 01/02/2013 | CN102848515A Resin sealing molding method of electronic device and device thereof |
| 01/02/2013 | CN102848305A Method for grinding to-be-processed object |
| 01/02/2013 | CN102848303A Processing method and processing device of semiconductor wafer, and semiconductor wafer |
| 01/02/2013 | CN102847691A Ultraviolet irradiation device |
| 01/02/2013 | CN102847688A 基板清洁方法 Substrate cleaning method |
| 01/02/2013 | CN102354677B Solar module decomposing equipment and rotary clamp thereof |
| 01/02/2013 | CN102347222B Phosphorous diffusion technology for polysilicon sheet |
| 01/02/2013 | CN102332420B Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc |
| 01/02/2013 | CN102280817B Nitride semiconductor device and fabrication method thereof |
| 01/02/2013 | CN102280376B Integration method for double metal gates and double high K gate mediums of CMOS device |
| 01/02/2013 | CN102262356B Methods for optimizing photoresist graph and forming contact hole |
| 01/02/2013 | CN102254792B Die peeling device with safety push-up pin |
| 01/02/2013 | CN102237365B Flash memory device and manufacturing method thereof |
| 01/02/2013 | CN102201388B QFN semiconductor package and fabrication method thereof |
| 01/02/2013 | CN102194894B Electrical-surge-resistance low-voltage-protection silicon diode and manufacturing method thereof |
| 01/02/2013 | CN102184871B Method for manufacturing high-voltage lateral dual-diffusion N-channel metal oxide semiconductor (NMOS) based on standard complementary metal-oxide-semiconductor transistor (CMOS) process |
| 01/02/2013 | CN102184845B Method for enhancing on-chip uniformity of titanium silicide square resistor |
| 01/02/2013 | CN102169831B Manufacturing method of silicon-on-insulator lateral insulated-gate bipolar transistor (SOI LIGBT) device unit of lateral channel with positive (p) buried layer |
| 01/02/2013 | CN102163543B 蚀刻设备及其控制方法 Etching equipment and control method |
| 01/02/2013 | CN102148145B Preparation method and detection source-compensating method for boron diffused source film |
| 01/02/2013 | CN102148142B Control and monitoring system for thin die detachment and pick-up |
| 01/02/2013 | CN102144285B Electrostatic chuck device and method for determining adsorbed state of wafer |
| 01/02/2013 | CN102142421B Metal-column chip connecting structure and method without solders |
| 01/02/2013 | CN102142383B Method for detecting positions of wells |
| 01/02/2013 | CN102136492B Memory based on self-assembled QD (Quantum Dots) and preparation method thereof |
| 01/02/2013 | CN102130096B Test structure and test method for coupling capacitance of metal redundant fillers in integrated circuit |
| 01/02/2013 | CN102122616B Manufacturing method of semiconductor device |
| 01/02/2013 | CN102117731B Method and device for monitoring measurement data in process production flow of semiconductor |
| 01/02/2013 | CN102110717B Trench metal oxide semiconductor field effect transistor and manufacturing method thereof |
| 01/02/2013 | CN102103979B Method for manufacturing three-dimensional silicon-based passive circuit consisting of through silicon vias |
| 01/02/2013 | CN102097332B Conduction hole structure of encapsulation substrate and manufacturing method thereof |
| 01/02/2013 | CN102097331B Circuit bridging manufacturing method for encapsulation substrate |
| 01/02/2013 | CN102097330B Conduction structure of encapsulation substrate and manufacturing method thereof |
| 01/02/2013 | CN102097329B Embedded conduction structure of encapsulation substrate and manufacturing method thereof |
| 01/02/2013 | CN102091703B Method for cleaning polymer on side wall of etching chamber and contact hole forming method |
| 01/02/2013 | CN102084023B Magnetron sputtering method, and magnetron sputtering device |
| 01/02/2013 | CN102077369B Device for structuring a solar module |
| 01/02/2013 | CN102064162B Stacked package structure, package structure thereof and manufacture method of the package structure |
| 01/02/2013 | CN102064093B Methods of forming pluralities of capacitors |
| 01/02/2013 | CN102057475B Manufacturing method for semiconductor device and semiconductor device |
| 01/02/2013 | CN102054853B 相变随机存取存储器及制造方法 Phase change random access memory and a method of manufacturing |
| 01/02/2013 | CN102054806B Thermal conductive substrate and manufacturing method thereof |
| 01/02/2013 | CN102054686B Method for forming stress membrane of complementary metal-oxide-semiconductor transistor (CMOS) device |
| 01/02/2013 | CN102044465B Apparatus and method for processing semiconductor wafers |
| 01/02/2013 | CN102044447B Packaging technology and packaging structure |
| 01/02/2013 | CN102024734B Substrate processing apparatus and method |
| 01/02/2013 | CN102023435B 液晶显示器及其制造方法 The liquid crystal display and manufacturing method |
| 01/02/2013 | CN102023423B Liquid crystal display and manufacturing method thereof |
| 01/02/2013 | CN102021625B Electrochemical electroplating equipment and method |
| 01/02/2013 | CN102017121B Dynamic alignment of wafers using compensation values obtained through a series of wafer movements |
| 01/02/2013 | CN102016135B Method of manufacturing Si(1-v-w-x)CwAlxNv substrate, method of manufacturing epitaxial wafer, Si(1-v-w-x)CwAlxNv substrate, and epitaxial wafer |
| 01/02/2013 | CN102007611B Nitride semiconductor element and method for producing the same |
| 01/02/2013 | CN102007596B Semiconductor device |
| 01/02/2013 | CN102005476B Power metal oxide semiconductor field-effect transistor and manufacturing method thereof |
| 01/02/2013 | CN101996955B Chip package and fabrication method thereof |
| 01/02/2013 | CN101989550B Method for manufacturing n-metal-oxide-semiconductor (NMOS) transistor |
| 01/02/2013 | CN101989533B Chip packaging block de-packaging method and device |
| 01/02/2013 | CN101988586B Gate valve and substrate processing system using same |
| 01/02/2013 | CN101981672B Multi-layer thick metallization structure for a microelectronic device, integrated circuit containing same, and method of manufacturing an integrated circuit containing same |
| 01/02/2013 | CN101976682B Silicon transverse device on N-type insulator for improving current density and preparation process thereof |
| 01/02/2013 | CN101960578B Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus |
| 01/02/2013 | CN101958375B Nitride semiconductor structure and manufacturing method thereof |
| 01/02/2013 | CN101958311B Semiconductor structure and forming method |
| 01/02/2013 | CN101958307B Power semiconductor module and method of manufacturing the same |
| 01/02/2013 | CN101958263B Semiconductor grain point measurement machine test method and semiconductor grain point measurement machine |
| 01/02/2013 | CN101958233B Substrate treatment method and substrate treatment apparatus |
| 01/02/2013 | CN101952944B Method of controlling etch microloading for a tungsten-containing layer |
| 01/02/2013 | CN101952941B Plasma processing apparatus and plasma processing method |
| 01/02/2013 | CN101937881B Semiconductor packaging structure and packaging method thereof |
| 01/02/2013 | CN101933119B Information processing apparatus, information processing method and program |
| 01/02/2013 | CN101930980B Semiconductor device having saddle fin-shaped channel and method for manufacturing the same |
| 01/02/2013 | CN101930919B Semiconductor device and manufacture method thereof |
| 01/02/2013 | CN101930184B Developing treatment apparatus |
| 01/02/2013 | CN101924032B 掩蔽方法 Masking method |
| 01/02/2013 | CN101916740B In-situ dry clean chamber for front end of line fabrication |
| 01/02/2013 | CN101916732B Circuit substrate and making process thereof |
| 01/02/2013 | CN101911286B Semiconductor storage device |
| 01/02/2013 | CN101911272B Method and apparatus for ultrasonic bonding |
| 01/02/2013 | CN101908560B Semiconductor element and manufacturing method thereof |
| 01/02/2013 | CN101903131B CMP pad dressers |
| 01/02/2013 | CN101899195B Dam composition and method for fabrication of multilayer semiconductor device |
| 01/02/2013 | CN101896636B Application of hipims to through silicon via metallization in three-dimensional wafer packaging |
| 01/02/2013 | CN101884106B Semiconductor module |
| 01/02/2013 | CN101879511B Method and device for cleaning semiconductor silicon wafer |
| 01/02/2013 | CN101874290B Manufacturing method for laminated substrate |