| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/02/2013 | CN102859657A Heat treating apparatus |
| 01/02/2013 | CN102859656A Method for producing semiconductor device |
| 01/02/2013 | CN102859655A Vertical inline CVD system |
| 01/02/2013 | CN102859654A Silicon carbide epitaxial wafer and process for production thereof, silicon carbide bulk substrate for epitaxial growth purposes and process for production thereof, and heat treatment apparatus |
| 01/02/2013 | CN102859653A Epitaxial substrate and method for producing epitaxial substrate |
| 01/02/2013 | CN102859652A Method of manufacturing crystalline semiconductor and laser anneal apparatus |
| 01/02/2013 | CN102859651A Methods of forming a plurality of spaced features |
| 01/02/2013 | CN102859650A Dislocation and stress management by mask-less processes using substrate patterning and methods for device fabrication |
| 01/02/2013 | CN102859649A Silicon Epitaxial Wafer And Method For Producing The Same, As Well As Bonded Soi Wafer And Method For Producing The Same |
| 01/02/2013 | CN102859648A Systems and methods for application of optical materials to optical elements |
| 01/02/2013 | CN102859647A Apparatus and method for reactive ion etching |
| 01/02/2013 | CN102859646A Device for thermally treating substrates |
| 01/02/2013 | CN102859645A Processing methods and apparatus with temperature distribution control |
| 01/02/2013 | CN102859644A Glove box with clean room function and transfer system using the same |
| 01/02/2013 | CN102859637A Sensing of plasma process parameters |
| 01/02/2013 | CN102859605A Shift register and display device |
| 01/02/2013 | CN102859439A Positive radiation-sensitive composition, interlayer insulating film for display element, and formation method for same |
| 01/02/2013 | CN102859370A Inspection Contact Element And Inspection Jig |
| 01/02/2013 | CN102859035A Methods for multi-step copper plating on a continuous ruthenium film in recessed features |
| 01/02/2013 | CN102859034A Vertical inline CVD system |
| 01/02/2013 | CN102859033A A coating method for gas delivery system |
| 01/02/2013 | CN102858691A Perovskite material with anion-controlled dielectric properties, thin film capacitor device, and method for manufacturing the same |
| 01/02/2013 | CN102858495A Closed-loop control for improved polishing pad profiles |
| 01/02/2013 | CN102858493A Polishing slurry and polishing method therefor |
| 01/02/2013 | CN102856450A GaN based light-emitting diode and manufacturing method thereof |
| 01/02/2013 | CN102856449A GaN-based semiconductor light-emitting diode and manufacture method thereof |
| 01/02/2013 | CN102856441A Manufacture methods of X-ray detector back panel and PIN photodiode |
| 01/02/2013 | CN102856435A Diffusion method for improving sheet resistance uniformity after SE (selective emission) etching |
| 01/02/2013 | CN102856432A Surface passivation method of silicon chip |
| 01/02/2013 | CN102856392A Thin film transistor active device and manufacturing method of same |
| 01/02/2013 | CN102856390A A switching element of LCDs or organic EL displays comprising thin film transistor |
| 01/02/2013 | CN102856388A Thin film transistor and organic light emitting diode display using the same and method for manufacturing the same |
| 01/02/2013 | CN102856387A Methods of making lateral junction field effect transistors using selective epitaxial growth |
| 01/02/2013 | CN102856386A Semiconductor device and its manufacturing method |
| 01/02/2013 | CN102856385A Trench MOSFET (metal-oxide-semiconductor field effect transistor) with trench source field plate and preparation method of trench MOSFET |
| 01/02/2013 | CN102856384A Field transistor structure manufactured using gate last process |
| 01/02/2013 | CN102856381A Semiconductor device, method of manufacturing the semiconductor device, and electronic device |
| 01/02/2013 | CN102856379A Trench transistor and manufacturing method of the trench transistor |
| 01/02/2013 | CN102856378A Corner transistor and method of fabricating the same |
| 01/02/2013 | CN102856377A N-type semiconductor device and manufacturing method thereof |
| 01/02/2013 | CN102856376A Semiconductor structure and manufacturing method thereof |
| 01/02/2013 | CN102856375A Semiconductor structure and manufacturing method thereof |
| 01/02/2013 | CN102856374A GaN enhanced MIS-HFET device and preparation method of same |
| 01/02/2013 | CN102856369A Suspended HEMT (high electron mobility transistor) device based on silicon substrate nitride and preparation method of suspended HEMT device |
| 01/02/2013 | CN102856368A Power bipolar transistor and manufacture method thereof |
| 01/02/2013 | CN102856364A Thin film transistor and method of manufacturing the same |
| 01/02/2013 | CN102856362A Isolated gate controlled transverse field emission transistor and driving method thereof |
| 01/02/2013 | CN102856361A Transistor element provided with double-face field plate and manufacturing method thereof |
| 01/02/2013 | CN102856360A Semiconductor structure and preparation method thereof |
| 01/02/2013 | CN102856359A Semiconductor epitaxial structure and production method thereof |
| 01/02/2013 | CN102856358A Electrical switching device |
| 01/02/2013 | CN102856357A Heterojunction 1T-DRAM (One Transistor Dynamic Random Access Memory) structure based on buried layer N-type trap and preparation method thereof |
| 01/02/2013 | CN102856354A Graphene structure and method of manufacturing the graphene structure, and graphene device and method of manufacturing the graphene device |
| 01/02/2013 | CN102856353A Micro-through type IGBT (Insulated Gate Bipolar Translator) device and manufacture method thereof |
| 01/02/2013 | CN102856352A Insulated gate bipolar transistor terminal and producing method thereof |
| 01/02/2013 | CN102856351A Organic electroluminescence display panel and manufacturing method thereof |
| 01/02/2013 | CN102856348A Organic light emitting display devices and methods of manufacturing organic light emitting display devices |
| 01/02/2013 | CN102856346A Method of manufacturing organic light-emitting display apparatus |
| 01/02/2013 | CN102856329A Method for encapsulating through silicon via |
| 01/02/2013 | CN102856327A Donor substrates, methods of manufacturing donor substrates and methods of manufacturing organic light emitting display devices using donor substrates |
| 01/02/2013 | CN102856326A Thermally assisted dielectric charge trapping flash having dielectric charge trapping structure, operating method, and manufacturing method thereof |
| 01/02/2013 | CN102856322A Pixel structure and method for producing pixel structure |
| 01/02/2013 | CN102856319A Low capacitance transient voltage suppressor (TVS) with reduced clamping voltage |
| 01/02/2013 | CN102856318A Uni-directional transient voltage suppressor |
| 01/02/2013 | CN102856301A Semiconductor device and production method therefor |
| 01/02/2013 | CN102856300A Device and method for placing predetermined element to target platform |
| 01/02/2013 | CN102856299A Interconnect barrier structure and method |
| 01/02/2013 | CN102856294A Single-chip horizontal packaging, packaging-after-etching and pad-embedded packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856293A First etched and then packaged packaging structure with single chip normally installed and without base islands as well as preparation method thereof |
| 01/02/2013 | CN102856292A Single-chip flip, packaging-after-etching and non-pad packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856291A First etched and then packaged packaging structure with multiple chips normally installed and without base islands as well as preparation method thereof |
| 01/02/2013 | CN102856290A First etched and then packaged packaging structure with single chip reversedly installed and base islands buried as well as preparation method thereof |
| 01/02/2013 | CN102856289A First etched and then packaged packaging structure with single chip reversedly installed and base islands exposed and preparation method of structure |
| 01/02/2013 | CN102856288A First etched and then packaged packaging structure with multiple chips normally installed and base islands buried as well as preparation method thereof |
| 01/02/2013 | CN102856287A Multi-chip horizontal packaging, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856286A First packaged and then etched packaging structure with single chip normally installed and without base islands and preparation method of structure |
| 01/02/2013 | CN102856285A Single-chip flip, etching-after-packaging and pad embedded packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856284A Multi-chip flip, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856283A First packaged and then etched packaging structure with single chip normally installed and base islands buried and preparation method of structure |
| 01/02/2013 | CN102856282A Laminated high melting point soldering layer and fabrication method for the same, and semiconductor device |
| 01/02/2013 | CN102856281A Semiconductor package and manufacturing method thereof |
| 01/02/2013 | CN102856279A Interconnect structure for wafer level package |
| 01/02/2013 | CN102856278A Adapter plate structure and manufacturing method thereof |
| 01/02/2013 | CN102856277A Graphene conductive plug and formation method thereof |
| 01/02/2013 | CN102856276A Semiconductor device and manufacture method thereof |
| 01/02/2013 | CN102856273A Semiconductor assembly structure with radiating fin and assembling method thereof |
| 01/02/2013 | CN102856271A Multi-chip flip, packaging-after-etching and non-pad packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856270A Single-chip flip, etching-after-packaging and non-pad packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856269A Single-chip flip, etching-after-packaging and pad exposed packaging structure and manufacturing method thereof |
| 01/02/2013 | CN102856268A First packaged and then etched packaging structure with multiple chips normally installed and without base islands and preparation method of structure |
| 01/02/2013 | CN102856264A Semiconductor package and semiconductor package manufacturing method |
| 01/02/2013 | CN102856261A Method for preparing metal, ferroelectric substance, insulator and semiconductor structure |
| 01/02/2013 | CN102856260A CMOS (complementary metal-oxide-semiconductor transistor) transistor and manufacture method thereof |
| 01/02/2013 | CN102856259A Method for forming semiconductor device |
| 01/02/2013 | CN102856258A Formation method of semiconductor device |
| 01/02/2013 | CN102856257A Method for forming semiconductor device |
| 01/02/2013 | CN102856256A Semiconductor element and manufacture method thereof |
| 01/02/2013 | CN102856255A Semiconductor element with metal gate and manufacture method thereof |
| 01/02/2013 | CN102856254A Method of semiconductor manufacturing process |
| 01/02/2013 | CN102856253A Organic light-emitting diode display panel and manufacturing method thereof |