| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/03/2013 | CN103021980A Chip module and method for fabricating a chip module |
| 04/03/2013 | CN103021972A Chip encapsulation structure and method |
| 04/03/2013 | CN103021970A Integrated circuit with sensor and manufacturing method thereof |
| 04/03/2013 | CN103021969A Substrate, semiconductor package and fabrication method thereof |
| 04/03/2013 | CN103021966A Substrate with reference marks and chip fixing method using substrate |
| 04/03/2013 | CN103021965A Light-transmitting package structure and package method based on silicon substrate and glass gland |
| 04/03/2013 | CN103021964A Semiconductor substrate, eletronic device and method for manufacturing the same |
| 04/03/2013 | CN103021961A Splicing method of infrared focal plane detector chips |
| 04/03/2013 | CN103021960A Method for three dimensional integrated circuit fabrication |
| 04/03/2013 | CN103021959A Array substrate, manufacture method of array substrate and display device |
| 04/03/2013 | CN103021958A Method of integrating high voltage devices |
| 04/03/2013 | CN103021957A Method for increasing floating grid coupling coefficient of control grid in flash memory |
| 04/03/2013 | CN103021956A PIP (poly-insulator-poly) capacitor of split gate type flash memory and manufacturing method of PIP capacitor |
| 04/03/2013 | CN103021955A Polycrystalline silicon resistance structure and method for manufacturing corresponding semiconductor integrated device |
| 04/03/2013 | CN103021954A Polycrystalline silicon resistance structure and method for manufacturing corresponding semiconductor integrated device |
| 04/03/2013 | CN103021953A Formation method of semiconductor integrated device |
| 04/03/2013 | CN103021952A Split gate flash memory and forming method thereof |
| 04/03/2013 | CN103021951A Flash memory and manufacturing method thereof as well as formation method of grids in different thicknesses |
| 04/03/2013 | CN103021950A Method for preparing embedded storage based on change-resistant gate medium |
| 04/03/2013 | CN103021949A Replacement of gate semiconductor device |
| 04/03/2013 | CN103021948A Process integrating method for deep-submicron semiconductor device |
| 04/03/2013 | CN103021947A Manufacture method for semiconductor device |
| 04/03/2013 | CN103021946A Method of preparing GaN monocrystal substrate in mechanical removal way |
| 04/03/2013 | CN103021945A Array substrate, manufacturing method of array substrate, and display device with array substrate |
| 04/03/2013 | CN103021944A TFT (thin-film transistor) array substrate, manufacturing method of TFT array substrate, and display device with TFT array substrate |
| 04/03/2013 | CN103021943A Array substrate, manufacture method of array substrate and display device |
| 04/03/2013 | CN103021942A Array substrate and manufacturing method thereof, display device |
| 04/03/2013 | CN103021941A Method for manufacturing array substrate, array substrate and liquid crystal display device |
| 04/03/2013 | CN103021940A Array substrate, manufacture method of array substrate and display device |
| 04/03/2013 | CN103021939A Array substrate, manufacture method of array substrate and display device |
| 04/03/2013 | CN103021938A Method for manufacturing display device |
| 04/03/2013 | CN103021937A Device and method for overburden electroplating copper layer on chemical corrosion TSV (through silicon via) surface |
| 04/03/2013 | CN103021936A Bipolar circuit manufacture method |
| 04/03/2013 | CN103021935A Formation method of local air gaps |
| 04/03/2013 | CN103021934A Method for forming through hole or contact hole |
| 04/03/2013 | CN103021933A Method for preprocessing wafer groove before chemical electroplating process |
| 04/03/2013 | CN103021932A Self-aligned method for forming contact of device with reduced step height |
| 04/03/2013 | CN103021931A Preparation method of metal nitride barrier layer |
| 04/03/2013 | CN103021930A Metal interconnection layer etching method |
| 04/03/2013 | CN103021929A Manufacturing method of semiconductor device |
| 04/03/2013 | CN103021928A Manufacturing method of semiconductor isolation regions |
| 04/03/2013 | CN103021927A Hybrid coplanar SOI (silicon-on-insulator) substrate structure and preparation method thereof |
| 04/03/2013 | CN103021926A Formation method of STI (shallow trench isolation) structure and formation method of memory |
| 04/03/2013 | CN103021925A STI (shallow trench isolation) manufacturing process, trench etching method and photoresist processing method |
| 04/03/2013 | CN103021924A Formation method of STI (shallow trench isolation) structure |
| 04/03/2013 | CN103021923A Semiconductor process |
| 04/03/2013 | CN103021922A Cover plate, loading device as well as plasma processing device |
| 04/03/2013 | CN103021921A Method for fabricating integrated circuit systems |
| 04/03/2013 | CN103021920A Device for rapidly taking and putting solar cell pieces |
| 04/03/2013 | CN103021919A Wafer prealignment device |
| 04/03/2013 | CN103021918A A carrying device |
| 04/03/2013 | CN103021917A Material system |
| 04/03/2013 | CN103021916A 晶圆传输系统 Wafer transport system |
| 04/03/2013 | CN103021915A Substrate treatment system, substrate transfer method and non-transitory computer-readable storage medium |
| 04/03/2013 | CN103021914A Wafer boat for preventing central portion of wafer from sagging |
| 04/03/2013 | CN103021913A Large-sized front opening unified wafer pod |
| 04/03/2013 | CN103021912A Semiconductor etching device and etching method of semiconductor structure |
| 04/03/2013 | CN103021911A Film-cutting machine structure |
| 04/03/2013 | CN103021910A Movable sealing device |
| 04/03/2013 | CN103021909A Mobile sealing device |
| 04/03/2013 | CN103021908A Extended mainframe designs for semiconductor device manufacturing equipment? |
| 04/03/2013 | CN103021907A Microwave processing apparatus and method for processing object to be processed? |
| 04/03/2013 | CN103021906A Substrate processing apparatus and substrate processing method |
| 04/03/2013 | CN103021905A Apparatus for treating substrate |
| 04/03/2013 | CN103021904A Wafer scrubber apparatus and wafer scrubber method |
| 04/03/2013 | CN103021903A Semiconductor chip pick-up method and semiconductor chip pick-up apparatus |
| 04/03/2013 | CN103021902A Mould casting device and method for semiconductor package |
| 04/03/2013 | CN103021901A Quartz hook for semiconductor diffusion furnace |
| 04/03/2013 | CN103021900A Quartz flange |
| 04/03/2013 | CN103021899A Semiconductor product detecting machine and detecting method thereof |
| 04/03/2013 | CN103021898A Method for measuring plane angle, and method and system for measuring relative inclination angle of chip and base plate |
| 04/03/2013 | CN103021897A Method for detecting semiconductor device electrical property failure |
| 04/03/2013 | CN103021896A Apparatus for testing and repairing of substrate |
| 04/03/2013 | CN103021895A Method for monitoring etching process |
| 04/03/2013 | CN103021894A Processing method for multi-way electrostatic discharge protection device |
| 04/03/2013 | CN103021893A Processing method for multi-way electrostatic discharge protection device |
| 04/03/2013 | CN103021892A Non-outer-pin semiconductor package structure and manufacturing method and lead frame strip thereof |
| 04/03/2013 | CN103021891A Hybrid integrated circuit metallization interconnecting method |
| 04/03/2013 | CN103021890A Method for manufacturing QFN (quad flat no-lead) package device |
| 04/03/2013 | CN103021889A Manufacture method of once-again wiring AAQFN packaging devices |
| 04/03/2013 | CN103021888A Methods for fabricating integrated circuit systems including high reliability die under-fill |
| 04/03/2013 | CN103021887A Airtight capping method for cooling-required FC (flip chip) circuits |
| 04/03/2013 | CN103021886A Facing package diode welding process, multipoint dispensing tool for process and multipoint chip feeding tool |
| 04/03/2013 | CN103021885A Flat package part manufacturing process based on sand blasting |
| 04/03/2013 | CN103021884A Flat package part manufacturing process based on thin frame |
| 04/03/2013 | CN103021883A Flat package part manufacturing process based on corrosion plastic package body |
| 04/03/2013 | CN103021882A Flat package part manufacture process based on grinding plastic package body |
| 04/03/2013 | CN103021881A Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device |
| 04/03/2013 | CN103021880A Manufacture method for semiconductor device |
| 04/03/2013 | CN103021879A Non-outer-pin semiconductor package structure and manufacturing method and lead frame strip thereof |
| 04/03/2013 | CN103021878A Methods and systems for forming electronic modules |
| 04/03/2013 | CN103021877A High-density chip radiating method by dual-path heat transfer |
| 04/03/2013 | CN103021876A Method for manufacturing high-density QFN (quad flat no-lead) package device |
| 04/03/2013 | CN103021875A Flat packaging part manufacturing process based on AAQFN frame product secondary plastic package |
| 04/03/2013 | CN103021874A Semiconductor chip package and method for manufacturing thereof |
| 04/03/2013 | CN103021873A Thin film transistor growing technology |
| 04/03/2013 | CN103021872A Thin film transistor growth process |
| 04/03/2013 | CN103021871A Process for manufacturing thin film transistor |
| 04/03/2013 | CN103021870A Manufacturing method of MOS (metal oxide semiconductor) transistor and method for rounding top charge corners of channels |
| 04/03/2013 | CN103021869A Trench power device manufacturing method |