| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/28/2013 | US20130075740 P-type oxide alloys based on copper oxides, tin oxides, tin-copper alloy oxides and metal alloy thereof, and nickel oxide, with embedded metals thereof, fabrication process and use thereof |
| 03/28/2013 | US20130075736 Thin film transistor array panel and manufacturing method thereof |
| 03/28/2013 | US20130075735 Semiconductor device and method for manufacturing the same |
| 03/28/2013 | US20130075733 Method for manufacturing semiconductor device and semiconductor device |
| 03/28/2013 | US20130075732 Semiconductor device and method for manufacturing the same |
| 03/28/2013 | US20130075731 Manufacturing method for thin film transistor and thin film transistor manufactured by them |
| 03/28/2013 | US20130075730 Vertical pnp device in a silicon-germanium bicmos process and manufacturing method thereof |
| 03/28/2013 | US20130075729 Fin-Based Bipolar Junction Transistor and Method for Fabrication |
| 03/28/2013 | US20130075726 Protection method for an electronic device and corresponding device |
| 03/28/2013 | US20130075725 Enhanced wafer test line structure |
| 03/28/2013 | US20130075719 Thin film transistor, method for manufacturing same, and display device |
| 03/28/2013 | US20130075687 Method for manufacturing nonvolatile semiconductor storage device and nonvolatile semiconductor storage device |
| 03/28/2013 | US20130075682 Phase change random access memory and method for manufacturing the same |
| 03/28/2013 | US20130075274 Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers |
| 03/28/2013 | US20130075246 Methods of forming a metal containing layer on a substrate with high uniformity and good profile control |
| 03/28/2013 | US20130075037 Plasma processing apparatus |
| 03/28/2013 | US20130074769 Apparatus for the deposition of a conformal film on a substrate and methods therefor |
| 03/28/2013 | US20130074615 Load port apparatus and method of detecting object to be processed |
| 03/28/2013 | US20130074326 Substrate transfer apparatus, substrate transfer method, and surface mounter |
| 03/28/2013 | DE112011102131T5 Ferroelektrische Kondensatormodule, Herstellungsverfahren und Entwurfsstrukturen Ferroelectric capacitor modules, manufacturing processes and design structures |
| 03/28/2013 | DE112011101914T5 Verfahren zum Herstellen eines Siliziumwafers und Siliziumwafer A method for manufacturing a silicon wafer and silicon wafers |
| 03/28/2013 | DE112011101813T5 Glättungsverfahren für Halbleitermaterial und von daraus hergestellten Wafern Smoothing method for semiconductor materials and wafers produced therefrom |
| 03/28/2013 | DE112011101433T5 Stressor mit eingebetteter Dotierstoff-Monoschicht für hochentwickelten CMOS-Halbleiter Stressor with embedded dopant monolayer for advanced CMOS semiconductor |
| 03/28/2013 | DE112011100505T5 Verfahren zur herstellung eines fotoaktiven substrats, das zur mikrofertigung geeignet ist Process for the preparation of a photoactive substrate, which is suitable for microfabrication |
| 03/28/2013 | DE112010003657T5 Ätzanlage Etching system |
| 03/28/2013 | DE112007001161B4 Selektives Bilden von Abstandhaltern auf Transistoren unterschiedlicher Klassen auf derselben Baugruppe Selectively forming spacers on transistors of different classes on the same assembly |
| 03/28/2013 | DE10392232B4 Schneidvorrichtung Cutter |
| 03/28/2013 | DE10352765B4 Hetero-Bipolartransistor mit einem schmalen Dotierungsprofil Hetero-bipolar transistor with a narrow doping profile |
| 03/28/2013 | DE10232781B4 Vorrichtung zur Wafer-Inspektion Apparatus for wafer inspection |
| 03/28/2013 | DE102012217562A1 Halbleitervorrichtung und verfahren zu deren herstellung Semiconductor device and process for their preparation |
| 03/28/2013 | DE102012216969A1 Halbleiterbauelement mit einem Halbleitervia und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device with a Halbleitervia and method of manufacturing a semiconductor device |
| 03/28/2013 | DE102012216909A1 Halbleitereinrichtung mit lateralem Element Semiconductor device having a lateral element |
| 03/28/2013 | DE102012216641A1 Halbleiterchiptestverfahren und Halbleiterchiptestvorrichtung A semiconductor chip test method and the semiconductor chip test device |
| 03/28/2013 | DE102012206403B3 Plant, useful to solder first pair of workpieces and second pair of workpieces, includes heating unit, first positioning unit by which first spacing of first pair of workpieces is adjustable from heating unit, and second positioning unit |
| 03/28/2013 | DE102012109164A1 Halbleiterstruktur samt Schutzring Semiconductor structure including guard ring |
| 03/28/2013 | DE102012108901A1 Verfahren und System zum Herstellen von Chalcogenid-Halbleitermaterialien unter Verwendung von Sputter- und Verdampfungsfunktionen A method and system for making chalcogenide semiconductor materials using sputtering and evaporation functions |
| 03/28/2013 | DE102012102781A1 3D-Halbleiterbauelement und Verfahren zur Herstellung desselben Of the same 3-D semiconductor device and process for producing |
| 03/28/2013 | DE102011122778B3 Verfahren zur Herstellung einer Lumineszenzkonversions-Leuchtdiode A method for producing a phosphor converted light-emitting diode |
| 03/28/2013 | DE102011115603A1 Method for defining design rules to design field plates of structures of semiconductor transistors in integrated circuit, involves carrying out longitudinal extension of field plates against reverse voltage corresponding to field plates |
| 03/28/2013 | DE102011114186A1 Power semiconductor device for use as e.g. pole switch for circuit breaker, has semiconductor element with power FETs that are electrically connected to each other through drain, where gates and sources are disconnected |
| 03/28/2013 | DE102011090170A1 Erhöhte Integrität von Metallgatestapeln mit großem ε durch Herstellen von STI-Gebieten nach den Gatemetallen Increased integrity of metal gate stacks with large ε by preparing STI regions by the gate metals |
| 03/28/2013 | DE102011090163A1 Halbleiterbauelement mit Austauschgateelektrodenstrukturen und selbstjustierten Kontaktelementen, die durch eine späte Kontaktfüllung hergestellt sind Semiconductor component with replacement gate electrode structures and self-aligned contact elements which are produced by a late charge Contact |
| 03/28/2013 | DE102011083627A1 Method for connecting electronic part e.g. transistor, involves applying electrical conductive layer for electrically connecting electrical contact surface of electronic part with electrical strip conductor, and applying covering layer |
| 03/28/2013 | DE102011083615A1 Substrate processing system for treating disk-shaped substrates in horizontal position, has heat shields arranged on end regions of transport rollers, which project over substrate to be treated |
| 03/28/2013 | DE102011083491A1 Connection assembly for use in scintillation detector of computed tomography system to connect e.g. memory chip with substrate, has two micro-components connected with each other as pair and arranged on functional side opposite to rear face |
| 03/28/2013 | DE102011083261A1 Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem Wire guide pulley for wire saws with a data acquisition system |
| 03/28/2013 | DE102011083175A1 Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem Wire guide pulley for wire saws with a data acquisition system |
| 03/28/2013 | DE102011005753A1 Method for producing doped, conductive and transparent metal oxide layer on substrates, involves coating a cooled substrate with ceramic/metallic target in inert atmosphere at predetermined room temperature and heating the coated layer |
| 03/28/2013 | DE102011003232B4 Herstellverfahren für Metallgateelektrodenstrukturen mit großem ε, die durch ein Austauschgateverfahren auf der Grundlage einer verbesserten Ebenheit von Platzhaltermaterialien hergestellt sind Production processes for metal gate electrode structures with large ε, which are made by a replacement gate process on the basis of an improved flatness wildcard materials |
| 03/28/2013 | DE102008007002B4 Verfahren zum Bilden von Substratkontakten für moderne SOI-Bauelemente auf der Grundlage einer tiefen Grabenkondensatorkonfiguration A method of forming substrate contacts for modern SOI devices on the basis of a deep grave capacitor configuration |
| 03/28/2013 | DE102007063723B4 Verfahren zur Finnen-Struktur-Silizidierung Process for the fin structure silicidation |
| 03/28/2013 | DE102006053597B4 Halbleitervorrichtung und Verfahren zum Schneiden eines Halbleitersubstrats A semiconductor device and method of cutting a semiconductor substrate |
| 03/28/2013 | DE102005047110B4 Waferteilungsverfahren und -teilungsvorrichtung Wafer dividing method and -teilungsvorrichtung |
| 03/28/2013 | DE102004059664B4 Gerät zur automatischen Fokussierung und Verfahren dazu Device for automatic focus and method therefor |
| 03/27/2013 | EP2573826A1 Light emitting device |
| 03/27/2013 | EP2573822A1 Semiconductor device, and method for producing semiconductor device |
| 03/27/2013 | EP2573818A1 Group III-V device structure having a selectively reduced impurity concentration |
| 03/27/2013 | EP2573811A2 Electronic component module and its manufacturing method |
| 03/27/2013 | EP2573809A1 Semiconductor device and method for manufacturing the same |
| 03/27/2013 | EP2573808A1 Integrated circuit using FD-SOI technology with shared box and a means for polarising opposite doping floorplans located in the same box |
| 03/27/2013 | EP2573807A1 Semiconductor structure and process for bird's beak reduction |
| 03/27/2013 | EP2573806A1 Integrated circuit with sensor and manufacturing method thereof |
| 03/27/2013 | EP2573805A2 Aerogel dielectric layer |
| 03/27/2013 | EP2573804A1 Integrated circuit with sensor and manufacturing method thereof |
| 03/27/2013 | EP2573803A1 Silicon nitride film for semiconductor element, and method and apparatus for manufacturing silicon nitride film |
| 03/27/2013 | EP2573802A2 Sealed porous materials, methods for making them, and semiconductor devices comprising them |
| 03/27/2013 | EP2573801A1 Etching solution, and method for processing surface of silicon substrate |
| 03/27/2013 | EP2573800A1 Diffusion agent composition, method of forming an impurity diffusion layer, and solar cell |
| 03/27/2013 | EP2573514A1 Composite sensor and method for manufacturing same |
| 03/27/2013 | EP2573508A1 Solder height detection method and solder height detection device |
| 03/27/2013 | EP2573206A1 Method for growing a group (iii) metal nitride film |
| 03/27/2013 | EP2573048A1 Titanium oxide particles, process for producing same, magnetic memory, optical information recording medium, and charge accumulation type memory |
| 03/27/2013 | EP2572827A1 Precision transfer equipment |
| 03/27/2013 | EP2572814A1 Paste and method for connecting electronic components with a substrate |
| 03/27/2013 | EP2572561A2 Method for dividing a large substrate into smaller ones and method for controllably selectively depositing a sealant material |
| 03/27/2013 | EP2572386A1 Iii-nitride light-emitting device grown on a relaxed layer |
| 03/27/2013 | EP2572380A1 Method for producing chip stacks, and a carrier for carrying out the method |
| 03/27/2013 | EP2572374A1 Method for building a substrate holder |
| 03/27/2013 | EP2572373A2 Method of sealing and contacting substrates using laser light and electronics module |
| 03/27/2013 | EP2572372A1 Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc) |
| 03/27/2013 | EP2572371A1 Memory device comprising a junctionless thin- film transistor |
| 03/27/2013 | EP2572370A1 Composite growth substrate for growing a semiconductor device |
| 03/27/2013 | EP2572207A2 Micromachined on-wafer probes and related method |
| 03/27/2013 | EP2571655A1 Method and apparatus for optically measuring by interferometry the thickness of an object |
| 03/27/2013 | EP2038929B1 Method for producing a matrix of individual electronic components and matrix produced thereby |
| 03/27/2013 | CN202839717U Novel graphite boat device capable of preventing silicon slice from dropping down |
| 03/27/2013 | CN202839712U Etching fixture system capable of improving conversion efficiency of battery sheet |
| 03/27/2013 | CN202839710U Wet etching machine having mist spraying function |
| 03/27/2013 | CN202839708U Novel monocrystalline silicon wafer chemical corrosion cassette |
| 03/27/2013 | CN202839621U 薄膜晶体管 Thin film transistor |
| 03/27/2013 | CN202839599U Chip-embedded-type three-dimensional wafer-level packaging structure |
| 03/27/2013 | CN202839584U Semiconductor device |
| 03/27/2013 | CN202839583U Semiconductor device |
| 03/27/2013 | CN202839582U Pitch variable clamp driven by rotation |
| 03/27/2013 | CN202839581U Stably running variable pitch clamp |
| 03/27/2013 | CN202839580U Varying pitch clamp with stable operation for slice replacing |
| 03/27/2013 | CN202839579U Fixture with pitches variable |
| 03/27/2013 | CN202839578U Clamping device having function of monitoring state of semiconductor wafer |
| 03/27/2013 | CN202839577U Planetary plate |
| 03/27/2013 | CN202839576U Bonding head of LED flip chip bonding machine |