Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/27/2013CN103000667A Semiconductor device and method for manufacturing the semiconductor device
03/27/2013CN103000666A Compound semiconductor device and method for manufacturing the same
03/27/2013CN103000665A Super-junction device and manufacturing method thereof
03/27/2013CN103000664A Semiconductor device and manufacturing method thereof
03/27/2013CN103000663A Active matrix organic light emitting diode (AMOLED) integrating structure and integrating method
03/27/2013CN103000662A Array substrate, preparation method of array substrate and display device
03/27/2013CN103000641A Array substrate, preparation method of array substrate and display device
03/27/2013CN103000640A Array substrate, preparation method of array substrate and display device
03/27/2013CN103000639A Array substrate, preparation method of array substrate and organic light-emitting diode display device
03/27/2013CN103000638A Array substrate, preparation method of array substrate and organic light-emitting diode display device
03/27/2013CN103000637A Coated thin film transistor (TFT) substrate, preparation method thereof and TFT
03/27/2013CN103000635A Thin-film transistor substrate, manufacturing method of thin-film transistor substrate, and flat panel display
03/27/2013CN103000634A NOR flash memory and forming method thereof and contact hole forming method
03/27/2013CN103000632A Complementary metal oxide semiconductor (CMOS) circuit structure and manufacture method and display device thereof
03/27/2013CN103000631A Complementary metal oxide semiconductor (CMOS) circuit structure and manufacture method and display device thereof
03/27/2013CN103000630A Decoupling capacitor circuitry
03/27/2013CN103000629A Monolithic high-current and low-current transistors sharing high voltage drain
03/27/2013CN103000628A Display device, array substrate and manufacture method of array substrate
03/27/2013CN103000627A Array substrate, manufacture method thereof and display device
03/27/2013CN103000623A Aluminum-gate semiconductor device and manufacturing method thereof
03/27/2013CN103000618A Apparatus for stacked electronic circuitry and associated methods
03/27/2013CN103000617A Semiconductor package and manufacturing method for the same
03/27/2013CN103000612A Semiconductor device and method for manufacturing a semiconductor device
03/27/2013CN103000609A Salient point preparing material and salient point preparing method
03/27/2013CN103000603A Transistor structure and related transistor packaging method thereof
03/27/2013CN103000599A Flip-chip package structure and forming method thereof
03/27/2013CN103000597A Semiconductor devices and methods of manufacturing and packaging thereof
03/27/2013CN103000595A Multidirectional access phase change heat transfer device and manufacturing method thereof
03/27/2013CN103000593A Packaging methods and structures for semiconductor devices
03/27/2013CN103000589A Semiconductor Device, Semiconductor Wafer And Manufacturing Method Of Semiconductor Device
03/27/2013CN103000588A Chip packaging structure and manufacturing method for the same
03/27/2013CN103000586A Crack stop structure and method for forming the same
03/27/2013CN103000585A Manufacturing method of mask ROM (read only memory)
03/27/2013CN103000584A Bit line structure and manufacturing method thereof
03/27/2013CN103000583A Method for improving gate-introduced drain leakage (GIDL) of high-voltage metal-oxide-semiconductor field-effect transistor (MOS)
03/27/2013CN103000582A Resistor and production method thereof
03/27/2013CN103000581A Production method of thin film transistor (TFT) array substrate
03/27/2013CN103000580A Array substrate and preparation method thereof
03/27/2013CN103000579A Semiconductor device and preparation method thereof
03/27/2013CN103000578A Method for representing critical size after through-hole etching
03/27/2013CN103000577A Electronic programmable fuse device manufacturing method
03/27/2013CN103000576A Preparation process for Cu (Ge, Zr) alloy for controllable self-formed barrier layer
03/27/2013CN103000575A Copper interconnection structure and forming method thereof
03/27/2013CN103000574A Method of forming semiconductor die with active region responsive to external stimulus
03/27/2013CN103000573A Post-Polymer revealing of through-substrate via tips
03/27/2013CN103000572A Contact for high-K metal gate device
03/27/2013CN103000571A Semiconductor device and manufacturing method thereof
03/27/2013CN103000570A Forming method of copper interconnects
03/27/2013CN103000569A Metal liner manufacturing method
03/27/2013CN103000568A Metal interconnection layer manufacturing method
03/27/2013CN103000567A Manufacturing method of semiconductor device
03/27/2013CN103000566A Device with engineered epitaxial region and methods of making same
03/27/2013CN103000565A Method for improving isolation properties of shallow trenches in CMOS (complementary metal oxide semiconductor) process
03/27/2013CN103000564A Method for manufacturing electronic component module
03/27/2013CN103000563A Joint apparatus, joint system, and joint method
03/27/2013CN103000562A Die bonder and bonding method
03/27/2013CN103000561A Jigs with controlled spacing for bonding pipe cores onto package substrates
03/27/2013CN103000560A Slide groove structure of vacuum chuck
03/27/2013CN103000559A Positioning clamp for semiconductor chip and manufacture method for semiconductor device
03/27/2013CN103000558A Die bonder and bonding method
03/27/2013CN103000557A Conveyor
03/27/2013CN103000556A Dividing device
03/27/2013CN103000555A Thermal treatment apparatus, temperature control system, thermal treatment method, and temperature control method
03/27/2013CN103000554A Microwave processing apparatus and control method thereof
03/27/2013CN103000553A Alignment apparatus, substrates stacking apparatus, stacked substrates manufacturing apparatus, exposure apparatus and alignment method
03/27/2013CN103000552A Substrate cooling device, substrate cooling method and heat treatment apparatus
03/27/2013CN103000551A High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
03/27/2013CN103000550A Die bonder and bonding method
03/27/2013CN103000549A Cavity device and substrate processing equipment comprising same
03/27/2013CN103000548A Method for detecting integrated circuit manufacturing process defects by using field programmable gate array (FPGA) chip
03/27/2013CN103000547A Method for optimizing CDSEM (Critical Dimension Electronic Microscope) running sequence
03/27/2013CN103000546A Test probe card
03/27/2013CN103000545A Reusing method of test wafer for phosphorous boron pre-diffusion process
03/27/2013CN103000544A Recycling method of test strips for phosphorus and boron prediffusion process
03/27/2013CN103000543A High-reliability bonding method
03/27/2013CN103000542A Solder cap bump in semiconductor package and method of manufacturing the same
03/27/2013CN103000541A Method for manufacturing a chip packaging structure
03/27/2013CN103000540A Glue shaking device structure
03/27/2013CN103000539A Semiconductor packaging structure and manufacturing method thereof
03/27/2013CN103000538A Method for manufacturing semiconductor package structure
03/27/2013CN103000537A Wafer-level package structure and production method thereof
03/27/2013CN103000536A Preparation technology for intelligent power modules
03/27/2013CN103000535A Preparation method for side gating graphene field effect transistor
03/27/2013CN103000534A Manufacture method of groove-type P-type metal oxide semiconductor power transistor
03/27/2013CN103000533A Manufacturing method of self-aligned super junction power transistor
03/27/2013CN103000532A Manufacture method of pixel structure and manufacture method of conductor structure
03/27/2013CN103000531A Method for manufacturing low-temperature polycrystalline silicon thin film transistor
03/27/2013CN103000530A Manufacturing method of top-gate oxide thin-film transistor
03/27/2013CN103000529A Semiconductor device and method for manufacturing the same
03/27/2013CN103000528A Semiconductor structure with nickel silicide contact regions and method for forming semiconductor structure
03/27/2013CN103000527A Multi-gate device manufacturing method
03/27/2013CN103000526A Electric erasable read-only memory and manufacturing method thereof
03/27/2013CN103000525A PMOS (P-channel metal oxide semiconductor) transistor and manufacturing method thereof
03/27/2013CN103000524A Fin field-effect transistor and manufacturing method thereof
03/27/2013CN103000523A PMOS (P-channel metal oxide semiconductor) transistor structure and manufacturing method thereof
03/27/2013CN103000522A Method for manufacturing NMOS (N-channel metal oxide semiconductor) transistor
03/27/2013CN103000521A Method for manufacturing trench power metal-oxide semiconductor field-effect transistor
03/27/2013CN103000520A Method for etching sidewall layer of MOS (metal oxide semiconductor) surface gate
03/27/2013CN103000519A Method for removing silicon ridge produced in epitaxial deposition of super-junction high-pressure device
03/27/2013CN103000518A Method for forming non-planar transistor
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