Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2013
04/04/2013US20130081763 Ceiling plate and plasma process apparatus
04/04/2013US20130081691 Coating fluid for boron diffusion
04/04/2013DE112011102031T5 Siliziumband, sphärisches Silizium, Solarzelle, Solarzellenmodul, Verfahren zum Herstellen eines Siliziumbandes und Verfahren zum Herstellen sphärischen Siliziums Silicon ribbon, spherical silicon solar cell, solar cell module, method for manufacturing a silicon strip and method for producing spherical silicon
04/04/2013DE112011100451T5 Verfahren zur Herstellung einer Halbleitervorrichtung und Vorrichtung zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device and device for producing a semiconductor device
04/04/2013DE112011100445T5 Schichttransfer unter Verwendung einer mit Bor dotierten SiGe-Schicht Layer transfer using a boron-doped SiGe layer
04/04/2013DE10295940B4 Verfahren zur Herstellung einer Halbleitereinrichtung mit einem plattenförmigen Schaltungsblock A method of manufacturing a semiconductor device with a plate-shaped circuit block
04/04/2013DE102012215055A1 Verfahren zur Herstellung einer Leistungshalbleiteranordnung A method of manufacturing a power semiconductor arrangement
04/04/2013DE102012109374A1 Halbleitergehäuse und Verfahren zum Herstellen desselben Of the same semiconductor package and method for manufacturing
04/04/2013DE102012109355A1 Prüfprozess für Halbleiterbauelemente Inspection process for semiconductor devices
04/04/2013DE102012109354A1 Trennung von Halbleiterbauelementen von einem Waferträger Separation of semiconductor devices from a wafer carrier
04/04/2013DE102012018523A1 Chemisch-mechanische Acrylat-Polyurethan-Polierschicht Chemical-mechanical polishing acrylic polyurethane layer
04/04/2013DE102011114774A1 Sensor component e.g. gas sensor component integrated in e.g. ball grid array package, has conductive layer that is made to contact with sensor chip by electrical contacts of conductive layer
04/04/2013DE102011114770A1 Cooling device for electronic components e.g. CPU, has cooling structure that is connected with ceramic structure by braze welding, ultrasonic welding, soldering or diffusion bonding
04/04/2013DE102011114671A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
04/04/2013DE102011114670A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
04/04/2013DE102011114559A1 Optoelektronisches Bauelement umfassend eine Haftschicht, Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement und Verwendung eines Klebstoffes zur Bildung von Haftschichten in optoelektronischen Bauelementen An optoelectronic component comprising an adhesive layer Process for the preparation of an adhesive layer in an optoelectronic device and use of an adhesive for forming adhesive layers in optoelectronic devices
04/04/2013DE102011114558A1 Bauelement und Verfahren zum Herstellen dieses Bauelementes Device and method of manufacturing this component
04/04/2013DE102011090166B3 Verfahren zur Steigerung des Transistorleistungsverhaltens durch Verringern der Einwirkung eines Sauerstoffplasmas in einem dualen Verspannungsschichtenverfahren Method for increasing the transistor performance by reducing the effect of an oxygen plasma method in a dual stress layers
04/04/2013DE102011083911A1 Elektronische Baugruppe mit hochtemperaturstabilem Substratgrundwerkstoff Electronic assembly with high temperature stable substrate base material
04/04/2013DE102011083719A1 Verfahren zur Herstellung einer Zweichipanordnung und entsprechende Zweichipanordnung A process for producing a two-chip layout and corresponding two-chip system
04/04/2013DE102011080440B4 Verfahren zur Herstellung von Metallgateelektrodenstrukturen mit großem ε mittels einer frühen Deckschichtanpassung A process for the production of metal gate electrode structures with large ε cover layer by means of an early adaptation
04/04/2013DE102011055549A1 Verfahren zur Herstellung eines optoelektronischen Bauelements mit einer drahtlosen Kontaktierung A process for producing an optoelectronic component with a wireless contacting
04/04/2013DE102011054107A1 Device for recovering wire break arising at wire field of multi-wire saw utilized for cutting silicon, has wire loop formed based on ends of cracked wire, and deflection rollers mounted at support, which is mounted above wire guide rollers
04/04/2013DE102010038745B4 Teststruktur für Prüfung von Zwischenschichtdielektrikumshohlräumen und Kontaktwiderstandsmessungen in einem Halbleiterbauelement Test structure for testing of Zwischenschichtdielektrikumshohlräumen and contact resistance measurements in a semiconductor device
04/04/2013DE102009021490B4 Mehrschrittabscheidung eines Abstandshaltermaterials zur Reduzierung der Ausbildung von Hohlräumen in einem dielektrischen Material einer Kontaktebene eines Halbleiterbauelements Multi-step deposition of a spacer material to reduce the formation of voids in a dielectric material of a contact layer of a semiconductor device
04/04/2013DE102008026212B4 Halbleiterbauelement mit einer chipinternen elektrischen Teststruktur und Verfahren zur Herstellung der Teststruktur A semiconductor device comprising an on-chip electrical test structure and method of manufacturing the test structure
04/04/2013DE102006025351B4 Teststruktur zur Überwachung von Leckströmen in einer Metallisierungsschicht und Verfahren Test structure for monitoring leakage currents in a metallization layer and method
04/04/2013DE10037697B4 Adaptive Maskentechnik zur Inspektion von Defekten Adaptive mask technique for inspection of defects
04/03/2013EP2575181A2 High electron mobility transistor and method of manufacturing the same
04/03/2013EP2575178A2 Compound semiconductor device and manufacturing method therefor
04/03/2013EP2575163A2 Improved debonding equipment and methods for debonding temporary bonded wafers
04/03/2013EP2575162A2 Method for manufacturing a semiconductor device with a step of selectively removing a layer of silicon-germanium
04/03/2013EP2575161A2 Method of growing semiconductor crystal
04/03/2013EP2574690A1 A method of producing silicon carbide single crystal
04/03/2013EP2574687A2 Method and device for galvanising substrates
04/03/2013EP2574611A1 Halogenated Organoaminosilane Precursors and Methods for Depositing Films Comprising Same
04/03/2013EP2574418A1 Laser annealing device and laser annealing method using a pulsed laser diode
04/03/2013EP2574407A1 Method for producing a coating of a substrate
04/03/2013CN202855790U Clamping sheet and graphite boat
04/03/2013CN202855741U Wafer-wafer, wafer-chip and chip-chip bonding structure
04/03/2013CN202855725U Eutectic machine ceramic support clamp
04/03/2013CN202855724U Substrate carrying device and semiconductor processing equipment
04/03/2013CN202855723U Adsorptive transmission mechanism
04/03/2013CN202855722U Wet etching machine
04/03/2013CN202855721U Feeding apparatus used for plastic package trimming rib
04/03/2013CN202855720U Scribing working plate having surface with concave ring or convex ring
04/03/2013CN202855719U Ultrasonic lead bonding instrument chopper pressure on-line device
04/03/2013CN202855718U Automatic wafer etching cleaning machine
04/03/2013CN202855717U Replaceable upper chamber part of plasma reaction chamber
04/03/2013CN202855716U Silicon solar cell wet method etching machine etching segment double layer exhausting system
04/03/2013CN202849542U Polygonal graphite boat staple bolt
04/03/2013CN202845369U Tool basket for silicon material cleaning
04/03/2013CN1947479B Method and apparatus for accurately applying structures to a substrate
04/03/2013CN1567529B Multi-layer type anti-reflection layer and semiconductor process adopting the same
04/03/2013CN103026799A Parasitic plasma prevention in plasma processing chambers
04/03/2013CN103026492A Thin film transistor device and method for producing thin film transistor device
04/03/2013CN103026489A Thyristor random access memory device and method
04/03/2013CN103026485A CMOS transistor fabrication with different threshold voltages
04/03/2013CN103026484A Three-dimensional integrated circuit having redundant relief structure for chip bonding section
04/03/2013CN103026483A Metal-contamination -free through-substrate via structure
04/03/2013CN103026482A Processing substrates using a temporary carrier
04/03/2013CN103026481A Device for storing articles in a controlled atmosphere
04/03/2013CN103026480A Firing furnace for firing electrode of solar cell element, method for manufacturing solar cell element, and solar cell element
04/03/2013CN103026479A Substrate conveyance method and substrate conveyance system
04/03/2013CN103026478A Endpoint determination for capillary-assisted flow control
04/03/2013CN103026477A Combinatorial methods for making GIGS solar cells
04/03/2013CN103026476A Method to form solder alloy deposits on substrates
04/03/2013CN103026475A Method to form solder deposits on substrates
04/03/2013CN103026474A Precursor composition for forming amorphous metal oxide semiconductor layer, amorphous metal oxide semiconductor layer, method for producing same, and semiconductor device
04/03/2013CN103026473A Interlayer insulating layer formation method and semiconductor device
04/03/2013CN103026472A Method for depositing cyclic thin film
04/03/2013CN103026471A Method for depositing cyclic thin film
04/03/2013CN103026470A 激光加工方法 The laser processing method
04/03/2013CN103026469A Laminate film, and film for use in production of semiconductor comprising same
04/03/2013CN103026468A Chip manufacturing method
04/03/2013CN103026467A Wafer working tape
04/03/2013CN103026466A Methods for forming interconnect structures
04/03/2013CN103026465A Substrate susceptor and deposition apparatus having same
04/03/2013CN103026464A Methods for forming low moisture dielectric films
04/03/2013CN103026463A Method for vapor-phase epitaxial growth of semiconductor film
04/03/2013CN103026462A Methods for depositing metal in high aspect ratio features
04/03/2013CN103026461A Process for filling deep trenches in a semiconductor material body, and semiconductor device resulting from the same process
04/03/2013CN103026460A Method for the preparation of a multi-layered crystalline structure
04/03/2013CN103026459A Semiconductor device and method of forming a structure in a target substrate for manufacturing a semiconductor device
04/03/2013CN103026458A Microlens exposure device
04/03/2013CN103026416A 半导体装置 Semiconductor device
04/03/2013CN103026398A Substrate and process for production thereof, and display device
04/03/2013CN103026219A Ultrasonic acoustic emissions to detect substrate fracture
04/03/2013CN103025916A Bath deposition solution for the wet-chemical deposition of a metal sulfide layer and related production method
04/03/2013CN103025629A Goods transport facility
04/03/2013CN103025486A Aqueous processing solution for fixed abresive grain wire saw
04/03/2013CN103025478A Substrate processing method
04/03/2013CN103025476A 激光加工方法 The laser processing method
04/03/2013CN103025474A 激光加工方法 The laser processing method
04/03/2013CN103025473A Substrate processing method
04/03/2013CN103022891A High-power semiconductor laser chip integrated with protection diode
04/03/2013CN103022381A Organic light emitting diode display device and method of fabricating the same
04/03/2013CN103022284A LED chip cutting method and LED chip manufactured by same
04/03/2013CN103022258A Preparation method for textured Al electrode of photovoltaic cell of flexible substrate
04/03/2013CN103022248A Photovoltaic cell with three layers of antireflective films in composite structures and composite coating method thereof