Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2013
03/28/2013US20130076443 Compound semiconductor device and method of manufacturing the same
03/28/2013US20130076442 Compound semiconductor device and method of manufacturing the same
03/28/2013US20130075982 High voltage chuck for a probe station
03/28/2013US20130075937 Apparatus and Methods for Molding Die on Wafer Interposers
03/28/2013US20130075936 Semiconductor Device and Method of Forming Interconnect Substration for FO-WLCSP
03/28/2013US20130075930 Semiconductor substrate, eletronic device and method for manufacturing the same
03/28/2013US20130075929 Semiconductor device and method of manufacturing the same
03/28/2013US20130075928 Integrated circuit and method of making
03/28/2013US20130075927 Integrated circuit packaging system with encapsulation and method of manufacture thereof
03/28/2013US20130075926 Integrated circuit packaging system with package stacking and method of manufacture thereof
03/28/2013US20130075924 Semiconductor Device and Method of Forming Stacked Vias Within Interconnect Structure for FO-WLCSP
03/28/2013US20130075923 Integrated circuit packaging system with encapsulation and method of manufacture thereof
03/28/2013US20130075922 Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof
03/28/2013US20130075921 Forming Packages Having Polymer-Based Substrates
03/28/2013US20130075920 Multilayer Connection Structure and Making Method
03/28/2013US20130075919 Semiconductor Device and Method of Forming FO-WLCSP Having Conductive Layers and Conductive Vias Separated by Polymer Layers
03/28/2013US20130075917 Multi-Chip and Multi-Substrate Reconstitution Based Packaging
03/28/2013US20130075916 Integrated circuit packaging system with external wire connection and method of manufacture thereof
03/28/2013US20130075915 Integrated circuit packaging system with chip stacking and method of manufacture thereof
03/28/2013US20130075913 Structure and method for reducing vertical crack propagation
03/28/2013US20130075912 Semiconductor device and method for manufacturing the same
03/28/2013US20130075909 Semiconductor device including metal-containing conductive line and method of manufacturing the same
03/28/2013US20130075908 Semiconductor interconnect structure having enhanced performance and reliability
03/28/2013US20130075907 Interconnection Between Integrated Circuit and Package
03/28/2013US20130075906 Semiconductor device and method for manufacturing semiconductor device
03/28/2013US20130075902 Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant
03/28/2013US20130075900 Semiconductor Device and Method of Forming Insulating Layer on Conductive Traces for Electrical Isolation in Fine Pitch Bonding
03/28/2013US20130075899 Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
03/28/2013US20130075898 Surface depressions for die-to-die interconnects and associated systems and methods
03/28/2013US20130075895 Semiconductor device and manufacturing method thereof
03/28/2013US20130075894 Integrated circuit and method of making
03/28/2013US20130075892 Method for Three Dimensional Integrated Circuit Fabrication
03/28/2013US20130075891 Flip chip type full wave rectification semiconductor device and its manufacturing method
03/28/2013US20130075890 Integrated circuit and method of making
03/28/2013US20130075889 Integrated circuit packaging system with heat shield and method of manufacture thereof
03/28/2013US20130075888 Semiconductor package and method of fabricating the same
03/28/2013US20130075885 Lead frame and packaging method
03/28/2013US20130075884 Semiconductor package with high-side and low-side mosfets and manufacturing method
03/28/2013US20130075883 Integrated circuit packaging system with dual connection and method of manufacture thereof
03/28/2013US20130075879 Semiconductor chip package and method of making same
03/28/2013US20130075876 Sealed porous materials, methods for making them, and semiconductor devices comprising them
03/28/2013US20130075875 Silicon nitride film of semiconductor element, and method and apparatus for producing silicon nitride film
03/28/2013US20130075874 Semiconductor structure and fabrication method thereof
03/28/2013US20130075873 Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
03/28/2013US20130075870 Method for protection of a layer of a vertical stack and corresponding device
03/28/2013US20130075869 Chip Comprising a Fill Structure
03/28/2013US20130075868 Methods of transferring layers of material in 3d integration processes and related structures and devices
03/28/2013US20130075867 Method of processing a surface of group iii nitride crystal and group iii nitride crystal substrate
03/28/2013US20130075862 Embedded capacitor and method of fabricating the same
03/28/2013US20130075860 Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
03/28/2013US20130075857 Isolation structure, semiconductor device having the same, and method for fabricating the isolation structure
03/28/2013US20130075855 Manufacturing methods for accurately aligned and self-balanced superjunction devices
03/28/2013US20130075846 Magnetic memory
03/28/2013US20130075844 Semiconductor device and manufacturing method thereof
03/28/2013US20130075839 Structure and method for a mram device with an oxygen absorbing cap layer
03/28/2013US20130075838 Method and structure for a mram device with a bilayer passivation
03/28/2013US20130075837 Technique for smoothing an interface between layers of a semiconductor device
03/28/2013US20130075832 Process for producing a conducting electrode
03/28/2013US20130075831 Metal gate stack having tialn blocking/wetting layer
03/28/2013US20130075830 Semiconductor device and manufacturing method thereof
03/28/2013US20130075827 Replacement gate semiconductor device
03/28/2013US20130075826 Semiconductor device with strained channels induced by high-k capping metal layers
03/28/2013US20130075824 Semiconductor device and manufacturing method thereof
03/28/2013US20130075823 Reliable contacts
03/28/2013US20130075822 Structures and methods of self-aligned gate for sb-based fets
03/28/2013US20130075821 Semiconductor Device Comprising Replacement Gate Electrode Structures and Self-Aligned Contact Elements Formed by a Late Contact Fill
03/28/2013US20130075820 Superior Integrity of High-K Metal Gate Stacks by Forming STI Regions After Gate Metals
03/28/2013US20130075819 Semiconductor device and method of manufacturing same
03/28/2013US20130075818 3D Semiconductor Device and Method of Manufacturing Same
03/28/2013US20130075816 Lateral double diffused metal oxide semiconductor device and method for manufacturing the same
03/28/2013US20130075814 Semiconductor device with a semiconductor via
03/28/2013US20130075811 Double gate transistor and method of fabricating the same
03/28/2013US20130075809 Semiconductor power device with embedded diodes and resistors using reduced mask processes
03/28/2013US20130075806 Multi-gate bandgap engineered memory
03/28/2013US20130075805 Method for manufacturing nonvolatile semiconductor storage device and nonvolatile semiconductor storage device
03/28/2013US20130075803 Flash-To-ROM Conversion
03/28/2013US20130075802 Contact architecture for 3d memory array
03/28/2013US20130075801 Self-adjusted capacitive structure
03/28/2013US20130075800 Semiconductor device manufacturing method, semiconductor device and substrate processing apparatus
03/28/2013US20130075797 Semiconductor device and method of manufacturing the same
03/28/2013US20130075796 Semiconductor device and fabrication method thereof
03/28/2013US20130075795 Aerogel dielectric layer
03/28/2013US20130075789 Semiconductor device and method for manufacturing semiconductor device
03/28/2013US20130075788 Semiconductor device and fabrication method
03/28/2013US20130075787 Compound semiconductor device and method of manufacturing the same
03/28/2013US20130075785 Semiconductor device and fabrication method
03/28/2013US20130075784 Semiconductor device and method for manufacturing the same
03/28/2013US20130075783 Semiconductor device and method for manufacturing the same
03/28/2013US20130075758 Semiconductor device and method for manufacturing semiconductor device
03/28/2013US20130075757 Semiconductor device and method for manufacturing the same
03/28/2013US20130075754 Semiconductor device, fabrication method of the semiconductor devices
03/28/2013US20130075752 Semiconductor device and method of manufacturing the same
03/28/2013US20130075751 Compound semiconductor device and method of manufacturing the same
03/28/2013US20130075750 Semiconductor device
03/28/2013US20130075749 Compound semiconductor device and method of manufacturing the same
03/28/2013US20130075748 Method and system for diffusion and implantation in gallium nitride based devices
03/28/2013US20130075746 Lateral PNP Bipolar Transistor with Narrow Trench Emitter
03/28/2013US20130075745 Thin-film semiconductor device, display apparatus, and method for manufacturing thin-film semiconductor device
03/28/2013US20130075743 Semiconductor device and method of manufacturing semiconductor device
03/28/2013US20130075741 Lateral PNP Bipolar Transistor Formed with Multiple Epitaxial Layers
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