Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2013
04/10/2013CN103035681A Radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) component and manufacture method
04/10/2013CN103035679A Semiconductor device with self-charging field electrodes
04/10/2013CN103035678A Radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) component and manufacture method
04/10/2013CN103035677A Super junction structure, super junction metal-oxide semiconductor (MOS) transistor and production method of super junction structure
04/10/2013CN103035676A Semiconductor device and method for manufacturing the same
04/10/2013CN103035675A Radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) component and manufacture method
04/10/2013CN103035674A Radio frequency horizontal double-diffusion-field effect transistor and manufacturing method thereof
04/10/2013CN103035672A Compound semiconductor device and method of manufacturing the same
04/10/2013CN103035671A Laterally diffused metal oxide semiconductor (LDMOS) device and manufacture method thereof
04/10/2013CN103035670A Compound semiconductor device and method of manufacturing the same
04/10/2013CN103035669A Pn junction with ultra-low junction capacity density and manufacture method thereof
04/10/2013CN103035655A Enhanced insulating silicon composite material and preparation method
04/10/2013CN103035654A Silicon radio frequency device on insulator and silicon substrate on the same
04/10/2013CN103035653A Pixel structure and manufacturing method of thin-film transistor
04/10/2013CN103035652A Array substrate of fringe filed switching type liquid-crystal display panel and production method of array substrate
04/10/2013CN103035651A Semiconductor device and method of manufacturing the same
04/10/2013CN103035650A Semiconductor device and manufacturing method of semiconductor device
04/10/2013CN103035648A Flash memory unit structure and manufacture method thereof
04/10/2013CN103035647A One-time programmable device having an LDMOS structure and related method
04/10/2013CN103035646A Semiconductor device including metal-containing conductive line and method of manufacturing the same
04/10/2013CN103035645A Trench gate type metal oxide semiconductor (MOS) tube and manufacturing method thereof
04/10/2013CN103035644A Multi-transistor semiconductor device and manufacturing method thereof
04/10/2013CN103035643A Three-dimensional integration power semiconductor based on bonding technology and manufacture process of three-dimensional integration power semiconductor
04/10/2013CN103035640A Array substrate and manufacturing method thereof and display device thereof
04/10/2013CN103035637A Electro-static discharge (ESD) component in radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) process and manufacture method
04/10/2013CN103035631A Semi-conductive device for joint encapsulation of high-end chip and low-end chip and manufacture method thereof
04/10/2013CN103035630A Stacked semiconductor devices
04/10/2013CN103035625A Processing method of one-way electrostatic discharge (ESD) protective device
04/10/2013CN103035619A Electromigration reliability test structure
04/10/2013CN103035615A Semiconductor device and manufacturing method of the same
04/10/2013CN103035614A Semiconductor structure and method for making same
04/10/2013CN103035612A One time programmable structure using a gate last high-k metal gate process
04/10/2013CN103035610A Electric connection structure for connection trap and substrate in radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) and manufacture method
04/10/2013CN103035605A Semiconductor device and method of manufacture thereof
04/10/2013CN103035604A Flip chip encapsulation structure and fabrication process thereof
04/10/2013CN103035601A Semiconductor device including diffusion soldered layer on sintered silver layer
04/10/2013CN103035598A Formation of connectors without UBM
04/10/2013CN103035597A Interposer, circuit board module, and method for manufacturing interposer
04/10/2013CN103035596A Electrical connection for chip scale packaging
04/10/2013CN103035593A Package on packaging structure and methods of making same
04/10/2013CN103035589A Module chip scale packaging
04/10/2013CN103035588A Folded tape package, production method, and camera module
04/10/2013CN103035585A Metal aluminum base aluminum nitride package substrate and preparation method thereof
04/10/2013CN103035584A Power module package and method of manufacturing the same
04/10/2013CN103035583A Chip box formed in stretching mode and good in welding performance and producing method thereof
04/10/2013CN103035578A Semiconductor device and method of forming reconstituted wafer with larger carrier
04/10/2013CN103035577A Semiconductor structure and manufacturing method thereof
04/10/2013CN103035576A Manufacturing method and device structure of germanium silicon heterojunction bipolar transistor (HBT) and complementary metal-oxide-semiconductor transistor (CMOS) device integration
04/10/2013CN103035575A Formation method of flash memory storage cell
04/10/2013CN103035574A Semiconductor device and fabrication method thereof
04/10/2013CN103035573A Separation method for semiconductor units
04/10/2013CN103035572A Method for manufacturing semiconductor device
04/10/2013CN103035571A Separation of semiconductor devices from a wafer carrier
04/10/2013CN103035570A Ablation method
04/10/2013CN103035569A Growth process of thin film transistor
04/10/2013CN103035568A Thin film transistor (TFT) array substrate, manufacturing method and display device
04/10/2013CN103035567A Substrate for display device and method for manufacturing the same
04/10/2013CN103035566A Method for producing semiconductor device
04/10/2013CN103035565A Method for producing semiconductor device
04/10/2013CN103035564A Semiconductor device and production method thereof
04/10/2013CN103035563A Novel insulation silicon composite material and preparation method thereof
04/10/2013CN103035562A Process for fabricating a silicon-on-insulator structure
04/10/2013CN103035561A Process method for forming inclined angle at top of deep groove
04/10/2013CN103035560A Method for restraining boron impurities expanding in P-shaped pseudo buried layer
04/10/2013CN103035559A Elastic fixed wheel and wafer adapter including the same
04/10/2013CN103035558A Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet
04/10/2013CN103035557A Cutting table plate for ingot, attaching method for plate, and attaching device
04/10/2013CN103035556A Contact type pneumatic suspension device of intelligent card module carrier band
04/10/2013CN103035555A Silicon wafer automatic feeding and discharging device for plasma enhanced chemical vapor deposition (PECVD) device
04/10/2013CN103035554A Delivering device for dispensing a lead frame
04/10/2013CN103035553A Conveying arm for wafer manufacturing
04/10/2013CN103035552A Foreign matter detecting device and semiconductor manufacturing device
04/10/2013CN103035551A Apparatus and method for treating substrate
04/10/2013CN103035550A Method and apparatus for mounting semiconductor chips
04/10/2013CN103035549A Production flow and reusable testing method
04/10/2013CN103035548A Method of judging whether boron penetrates through P-type metal-oxide-semiconductor field-effect transistor (PMOSFET) device
04/10/2013CN103035547A Device and method for detecting mark and semiconductor device processing system
04/10/2013CN103035546A Small-size bonding point double-line bonding method
04/10/2013CN103035545A Wafer level packaging method by using lead frame
04/10/2013CN103035544A Method and system for metal deposition in semiconductor processing
04/10/2013CN103035543A Methods of forming connection bump of semiconductor device
04/10/2013CN103035542A Method for producting a power semiconductor arrangement
04/10/2013CN103035541A Method of mounting semiconductor device
04/10/2013CN103035540A Low moisture content encapsulation device and method of jumbo size non-standard metal encapsulation device
04/10/2013CN103035539A Nest mechanism with recessed wall segments
04/10/2013CN103035538A Method for producing semiconductor device
04/10/2013CN103035537A Resin encapsulating apparatus
04/10/2013CN103035536A EMI package and method for making same
04/10/2013CN103035535A Preparation method for large current / high-voltage diode
04/10/2013CN103035534A Fixture for adhering heat sink layers to backs of chips and application method thereof
04/10/2013CN103035533A Ultra shallow junction semiconductor field effect transistor and preparation method thereof
04/10/2013CN103035532A Field effect transistor of radio frequency lateral double-diffusion and preparation method thereof
04/10/2013CN103035531A Method and device for manufacturing thin film transistor using oxide semiconductor
04/10/2013CN103035530A Manufacture method of N-channel metal oxide semiconductor (NMOS) switch device
04/10/2013CN103035529A Method for improving electric leakage in radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS)
04/10/2013CN103035528A Super junction preparation technology method
04/10/2013CN103035527A Nitrogen passivation of source and drain recesses
04/10/2013CN103035526A Semiconductor device and fabrication method thereof
04/10/2013CN103035525A Manufacturing method of high voltage isolating N type laterally diffused metal oxide semiconductor (LDMOS) component
04/10/2013CN103035524A Semiconductor device and production method thereof