Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2013
04/10/2013CN103035523A Transistor forming method
04/10/2013CN103035522A Manufacturing method of compound semiconductor device
04/10/2013CN103035521A Process method for achieving minor carrier storage layer groove-type insulated gate bipolar translator (IGBT)
04/10/2013CN103035520A Manufacture method for insulated gate bipolar transistor (IGBT) device
04/10/2013CN103035519A Insulated gate bipolar transistor (IGBT) device and manufacture process method thereof
04/10/2013CN103035518A Manufacture method of insulated gate bipolar transistor wafer
04/10/2013CN103035517A Process for producing semiconductor
04/10/2013CN103035516A Method and apparatus for etching silicon-containing film
04/10/2013CN103035515A Filling method of groove
04/10/2013CN103035514A Manufacture method for forming thick silicon oxide isolation layer in radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS)
04/10/2013CN103035513A Formation method of amorphous carbon film
04/10/2013CN103035512A Production method of non-photosensitive polyimide passivation layer
04/10/2013CN103035511A Method for producing zero layer photoetching marking of high-voltage device without barrier layers
04/10/2013CN103035510A Contact through hole etching method
04/10/2013CN103035509A Method for producing semiconductor device
04/10/2013CN103035508A Critical dimension shrink method
04/10/2013CN103035507A Substrate processing device, substrate processing method, and manufacturing method of solar cell
04/10/2013CN103035506A Etching method for radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) isolation medium layer deep groove
04/10/2013CN103035505A Method of controlling plasma etching reaction rate by using glowing color
04/10/2013CN103035504A Chemical machinery polishing method and chemical machinery polishing device
04/10/2013CN103035503A Method for manufacturing a semiconductor device
04/10/2013CN103035502A Polycrystalline silicon filling method for insulated gate bipolar transistor (IGBT) grid groove
04/10/2013CN103035501A Preparation method for polycrystalline silicon groove grid and capable of avoiding holes
04/10/2013CN103035500A Formation method of trench gate
04/10/2013CN103035499A Method of growing low stress insulated gate bipolar transistor groove type grid electrode
04/10/2013CN103035498A Method of growing low stress insulated gate bipolar transistor (IGBT) groove type grid electrode
04/10/2013CN103035497A Nickel silicide forming method and transistor forming method
04/10/2013CN103035496A GaN film developed on silicon (Si) substrate and preparation method and application thereof
04/10/2013CN103035495A Separation blade used for polycrystalline silicon furnace tube technology and preparation method for same
04/10/2013CN103035494A Epitaxial wafer manufacturing method suitable for super junction device
04/10/2013CN103035493A Forming method for alternatively-arranged P columns and N columns of semiconductor component
04/10/2013CN103035492A Manufacturing method for double protection layers in semiconductor device
04/10/2013CN103035491A Processing method of power semiconductor chip surface
04/10/2013CN103035490A Preparation method for flexible display device
04/10/2013CN103035489A Method for precisely controlling thinning of wafer
04/10/2013CN103035488A Formation method of groove-shaped semiconductor structure
04/10/2013CN103035487A Groove manufacturing method capable of improving silicon slice warping degree
04/10/2013CN103035486A Method for simultaneously filling and flattening deep trenches with different sizes
04/10/2013CN103035485A Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus
04/10/2013CN103035484A Method for Fabricating a MIM Capacitor Having a Local Interconnect Metal Electrode and Related Structure
04/10/2013CN103035483A Temporary bonding and dissociating process method applied to thin silicon slices
04/10/2013CN103035482A Temporary bonding method of silicon wafer
04/10/2013CN103035481A Formation method of groove
04/10/2013CN103035480A Semiconductor device and manufacturing method thereof
04/10/2013CN103035479A Semiconductor structure forming method
04/10/2013CN103035478A Back-end process control method of wafer
04/10/2013CN103035477A Method for fabricating monocrystalline silicon nanostructure
04/10/2013CN103035470A Semiconductor etching device and semiconductor etching method
04/10/2013CN103035468A Radical passing device and substrate processing apparatus
04/10/2013CN103035467A Apparatuses, systems and methods for treating substrate
04/10/2013CN103034064A Device for pre-aligning substrate and further detecting and adjusting substrate direction
04/10/2013CN103034062A Method for edge exposure of wafer, optical modules and automatic focusing systems
04/10/2013CN103034061A Manufacturing mehtod of substrate
04/10/2013CN103034049A Method for manufacturing metal wire and array substrate
04/10/2013CN103034044A Multi-gray scale photomask, manufacturing method of multi-gray scale photomask and pattern transfer method
04/10/2013CN103034004A 薄膜晶体管阵列面板 The thin film transistor array panel
04/10/2013CN103033999A Thin film transistor substrate and method of fabricating the same
04/10/2013CN103033997A Display devices and fabrication methods thereof
04/10/2013CN103033993A Method for fabricating photo spacer and liquid crystal display and array substrate
04/10/2013CN103033991A Substrate, forming method of substrate and liquid crystal display
04/10/2013CN103033956A Array testing device
04/10/2013CN103033127A Base plate pre-alignment pose measuring method
04/10/2013CN103031597A Na-Be codoped p-ZnO film growth method
04/10/2013CN103031580A Plating cup with contoured cup bottom
04/10/2013CN103031541A Nozzle unit, and apparatus and method for treating substrate with the same
04/10/2013CN103031540A Reaction cavity device and substrate processing equipment with same
04/10/2013CN103031537A Film deposition apparatus and substrate processing apparatus
04/10/2013CN103031536A Cleaning apparatus and cleaning method for components of metal organic chemical vapor deposition device
04/10/2013CN103031530A Thin film forming method and film forming apparatus
04/10/2013CN103031526A Reaction chamber for forming tantalum deposition film on silicon substrate, and application thereof
04/10/2013CN103031520A 蒸发源及成膜装置 Evaporation source and film forming apparatus
04/10/2013CN103031091A Resin paste for die bonding, method for manufacturing semiconductor device, and semiconductor device
04/10/2013CN103030439A Processing method of ceramic substrate
04/10/2013CN103029985A Vacuum suction apparatus
04/10/2013CN103029436A Apparatuses and methods for treating substrate
04/10/2013CN103029031A Processing method for wafer substrates
04/10/2013CN103028861A Conductive bonding material, conductor bonding method, and semiconductor device production method
04/10/2013CN103028855A BGA (ball grid array) welding equipment
04/10/2013CN103028844A Ablation method for substrate on which passivation film is formed
04/10/2013CN103028836A Wiring bonding method between enforcing substrate and semiconductor chip and welding control system
04/10/2013CN102387659B Printed circuit board and production method thereof
04/10/2013CN102347309B Electric fuse structure and formation method thereof
04/10/2013CN102332454B One-time programmable memory cell, memory and preparation method thereof
04/10/2013CN102299077B Semiconductor device and manufacturing method thereof
04/10/2013CN102299075B Method for manufacturing semiconductor device structure
04/10/2013CN102290338B Room-temperature large-area deposition production process for transparent conductive film
04/10/2013CN102280496B Varactor, methods of forming the same, and three-dimensional integrated circuits using the same
04/10/2013CN102280396B Graphite boat saturated treating technology
04/10/2013CN102263030B Method for manufacturing groove-type power device
04/10/2013CN102206098B Ceramic copper-clad substrate and preparation method thereof
04/10/2013CN102194695B Method for removing clearance wall structure
04/10/2013CN102194655B Method for optimally adjusting console parameters in semiconductor technology
04/10/2013CN102194652B Method for preventing warping of wafers and wafers therefrom
04/10/2013CN102189469B Method for dynamically adjusting time limit of chemically-mechanical polishing
04/10/2013CN102184878B System and method for feeding back image quality of template for wafer alignment
04/10/2013CN102169809B BGA (Ball Grid Array) component repairing method and fixture
04/10/2013CN102152297B Series type R-shaft expanding mechanical arm
04/10/2013CN102148174B Semiconductor defect signal grasping and counting system and method
04/10/2013CN102136415B Method for improving roughness of line edge of photoetching pattern in semiconductor process
04/10/2013CN102136410B Method for cleaning technological cavities of semiconductor