| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/18/2013 | WO2013027968A3 Apparatus for fabricating ingot, method for providing material, and method for fabricating ingot |
| 04/18/2013 | WO2013025629A3 Wafer carrier |
| 04/18/2013 | WO2013022633A3 Substrate support with heater |
| 04/18/2013 | WO2013022616A3 Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing |
| 04/18/2013 | WO2013019541A3 Low-stress vias |
| 04/18/2013 | WO2013019432A3 Method for uninterrupted production of a polyatomic boron molecular ion beam with self-cleaning |
| 04/18/2013 | WO2013016341A3 Methods of forming a metal silicide region in an integrated circuit |
| 04/18/2013 | WO2013015934A3 Memory cells and methods of storing information |
| 04/18/2013 | WO2013012549A3 Multi-chamber cvd processing system |
| 04/18/2013 | WO2013006363A3 Memory cell structures |
| 04/18/2013 | WO2012178199A3 Memory array architecture with two-terminal memory cells |
| 04/18/2013 | WO2012052252A3 Starter material for a sintering compound and method for producing said sintering compound |
| 04/18/2013 | US20130095669 Substrate processing method and substrate processing apparatus |
| 04/18/2013 | US20130095668 Semiconductor device manufacturing method and substrate processing apparatus |
| 04/18/2013 | US20130095667 Gas barrier with vent ring for protecting a surface region from liquid |
| 04/18/2013 | US20130095666 Plasma confinement rings including rf absorbing material for reducing polymer deposition |
| 04/18/2013 | US20130095665 Systems and methods for processing substrates |
| 04/18/2013 | US20130095664 Atomic layer deposition of antimony oxide films |
| 04/18/2013 | US20130095663 Method of forming a semiconductor memory device |
| 04/18/2013 | US20130095662 Integrated circuit method with triple patterning |
| 04/18/2013 | US20130095661 Cmp method, cmp apparatus and method of manufacturing semiconductor device |
| 04/18/2013 | US20130095660 Method for polishing silicon wafer |
| 04/18/2013 | US20130095659 Method for producing silicon waveguides on non-soi substrate |
| 04/18/2013 | US20130095658 Metal organic chemical vapor deposition method and apparatus |
| 04/18/2013 | US20130095657 Post-etch treating method |
| 04/18/2013 | US20130095656 Semiconductor device and method of manufacturing the same |
| 04/18/2013 | US20130095655 Methods Of Forming Circuit Structures Within Openings And Methods Of Forming Conductive Lines Across At Least A Portion Of A Substrate |
| 04/18/2013 | US20130095654 Methods of manufacturing a vertical type semiconductor device |
| 04/18/2013 | US20130095653 Non-volatile memory devices including vertical nand strings and methods of forming the same |
| 04/18/2013 | US20130095652 Method for fabricating semiconductor device |
| 04/18/2013 | US20130095651 Tunable Semiconductor Component Provided with a Current Barrier |
| 04/18/2013 | US20130095650 System And Method For Constructing Waffle Transistors |
| 04/18/2013 | US20130095649 Chemical Bath Replenishment |
| 04/18/2013 | US20130095648 Technique for reducing topography-related irregularities during the patterning of a dielectric material in a contact level of closely spaced transistors |
| 04/18/2013 | US20130095644 Planarization process for semiconductor device fabrication |
| 04/18/2013 | US20130095643 Methods for implanting dopant species in a substrate |
| 04/18/2013 | US20130095642 Junction leakage reduction through implantation |
| 04/18/2013 | US20130095641 Method Of Manufacturing Gallium Nitride Film |
| 04/18/2013 | US20130095640 Reusable substrates for electronic device fabrication and methods thereof |
| 04/18/2013 | US20130095639 Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device |
| 04/18/2013 | US20130095638 Method of Fabricating Integrated Circuits |
| 04/18/2013 | US20130095637 Method of fabricating a semiconductor device |
| 04/18/2013 | US20130095636 Process for producing at least one deep trench isolation |
| 04/18/2013 | US20130095635 Method for fabricating nonvolatile memory device |
| 04/18/2013 | US20130095633 Methods of manufacturing variable resistance memory and semiconductor device |
| 04/18/2013 | US20130095632 Enhanced Work Function Layer Supporting Growth of Rutile Phase Titanium Oxide |
| 04/18/2013 | US20130095630 Threshold mismatch and iddq reduction using split carbon co-implantation |
| 04/18/2013 | US20130095629 Finfet Parasitic Capacitance Reduction Using Air Gap |
| 04/18/2013 | US20130095628 Mask rom fabrication method |
| 04/18/2013 | US20130095627 Methods of Forming Source/Drain Regions on Transistor Devices |
| 04/18/2013 | US20130095626 Method for manufacturing semiconductor device |
| 04/18/2013 | US20130095623 Vertical transistor having an asymmetric gate |
| 04/18/2013 | US20130095622 Method of manufacturing a semiconductor device |
| 04/18/2013 | US20130095621 Method of Manufacture of a Passive High-Frequency Image Reject Mixer |
| 04/18/2013 | US20130095620 Methods of forming highly scaled semiconductor devices using a disposable spacer technique |
| 04/18/2013 | US20130095619 Performance and reducing variation of narrow channel devices |
| 04/18/2013 | US20130095616 Method for manufacturing multi-gate transistor device |
| 04/18/2013 | US20130095615 Manufacturing method of package structure |
| 04/18/2013 | US20130095614 Wafer level packaging of semiconductor chips |
| 04/18/2013 | US20130095613 Fabrication method of semiconductor devices and fabrication system of semiconductor devices |
| 04/18/2013 | US20130095612 Wafer level packaging method of encapsulating the bottom and side of a semiconductor chip |
| 04/18/2013 | US20130095611 Packaging Methods for Semiconductor Devices |
| 04/18/2013 | US20130095610 Package-on-package assembly with wire bond vias |
| 04/18/2013 | US20130095609 Device and Method for Manufacturing a Device |
| 04/18/2013 | US20130095608 Methods for Forming 3DIC Package |
| 04/18/2013 | US20130095607 Methods and Apparatus For Alignment In Flip Chip Bonding |
| 04/18/2013 | US20130095606 Fabrication Method for ZnO Thin Film Transistors Using Etch-stop Layer |
| 04/18/2013 | US20130095599 Photovoltaic device using nano-spheres for textured electrodes |
| 04/18/2013 | US20130095586 Method of cutting light emitting element packages employing ceramic substrate, and method of cutting multilayered object |
| 04/18/2013 | US20130095581 Thick window layer led manufacture |
| 04/18/2013 | US20130095580 Semiconductor device and structure |
| 04/18/2013 | US20130095577 System and method for measuring layer thickness and depositing semiconductor layers |
| 04/18/2013 | US20130095576 Transformer signal coupling for flip-chip integration |
| 04/18/2013 | US20130094287 Semiconductor memory devices and methods of manufacturing the same |
| 04/18/2013 | US20130094006 Substrate conveyance device and substrate conveyance method, exposure apparatus and exposure method, device manufacturing method |
| 04/18/2013 | US20130093650 Display Device |
| 04/18/2013 | US20130093497 Tunnel field effect transistor (tfet) with lateral oxidation |
| 04/18/2013 | US20130093146 Ceramic-metal bonded body |
| 04/18/2013 | US20130093145 Electrostatic chuck |
| 04/18/2013 | US20130093104 Bond pad structure and fabricating method thereof |
| 04/18/2013 | US20130093100 Semiconductor Device and Method of Forming Conductive Pillar Having an Expanded Base |
| 04/18/2013 | US20130093098 Through substrate via structures and methods of forming the same |
| 04/18/2013 | US20130093097 Package-On-Package (PoP) Structure and Method |
| 04/18/2013 | US20130093094 Method and Apparatus for Die Assembly |
| 04/18/2013 | US20130093093 Semiconductor device with damascene bit line and method for fabricating the same |
| 04/18/2013 | US20130093092 Electronic device and method for producing same |
| 04/18/2013 | US20130093091 Three-Dimensional Vertical Interconnecting Structure and Manufacturing Method Thereof |
| 04/18/2013 | US20130093089 Interconnect Structure With An Electromigration and Stress Migration Enhancement Liner |
| 04/18/2013 | US20130093088 Package-on-package assembly with wire bond vias |
| 04/18/2013 | US20130093086 Semiconductor package and method of fabricating the same |
| 04/18/2013 | US20130093085 Dual interlock heatsink assembly for enhanced cavity pbga packages, and method of manufacture |
| 04/18/2013 | US20130093080 Multi-chip package and method of manufacturing the same |
| 04/18/2013 | US20130093075 Semiconductor Device Package and Method |
| 04/18/2013 | US20130093072 Leadframe pad design with enhanced robustness to die crack failure |
| 04/18/2013 | US20130093071 Optical module with a lens encapsulated within sealant and method for manufacturing the same |
| 04/18/2013 | US20130093069 Package structure and the method to fabricate thereof |
| 04/18/2013 | US20130093068 Semiconductor Device and Method of Forming Air Gap Adjacent to Stress Sensitive Region of the Die |
| 04/18/2013 | US20130093067 Wafer level applied rf shields |
| 04/18/2013 | US20130093064 Semiconductor structure and fabrication method thereof |
| 04/18/2013 | US20130093063 Bonded substrate and method of manufacturing the same |