Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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04/23/1996 | US5510274 Method of controlling a carrier lifetime in a semiconductor switching device |
04/23/1996 | US5510273 Process of mounting semiconductor chips in a full-width-array image |
04/23/1996 | US5510270 Generating pattern of light and dark areas by selectively irradiating surface areas; deprotecting; contacting with receptor to identify oligonucleotide showing complementarity to receptor |
04/23/1996 | US5510230 Device fabrication using DUV/EUV pattern delineation |
04/23/1996 | US5510216 Using ligatrig material, electroless metallization catalysts and electroless plating solution |
04/23/1996 | US5510197 Lead frame material and lead frame for semiconductor device |
04/23/1996 | US5510189 Adhesive tape for electronic parts and liquid adhesive |
04/23/1996 | US5510172 Thin films having different coercive forces and squareness ratios; non magnetic interlayer |
04/23/1996 | US5510158 Process for oxidation of an article |
04/23/1996 | US5510151 Establishing enclosed film-forming chamber by curving and projecting moving substrate web to form cylindrical wall, feeding raw material gas into resulting space to deposit film on inner face of wall |
04/23/1996 | US5510146 Low pressure process |
04/23/1996 | US5510139 Process for assembly and bonding of electronic components on an insulating support |
04/23/1996 | US5510138 Formulating hot melt coating composition which is solid or semisolid at room temperature, heating to melt, depositing on substrate, allowing to cool and solidify to form conformal protective coating |
04/23/1996 | US5510095 Production of high-purity silicon ingot |
04/23/1996 | US5510074 Injection molding thermoplastic |
04/23/1996 | US5510011 Method for forming a functional deposited film by bias sputtering process at a relatively low substrate temperature |
04/23/1996 | US5510007 Reacting solid precursor material including silicon in electrochemical cell with generated hydrogen ions to form silane, depositing silicon, alloy or compound from silane |
04/23/1996 | US5509995 Process for anisotropically etching semiconductor material |
04/23/1996 | US5509974 Etch control seal for dissolved wafer process |
04/23/1996 | US5509970 Method of cleaning semiconductor substrate using an aqueous acid solution |
04/23/1996 | US5509967 Heat treatment apparatus |
04/23/1996 | US5509772 System for the handling and confinement of flat objects in individual boxes |
04/23/1996 | US5509771 Vacuum processing apparatus |
04/23/1996 | US5509553 Direct etch processes for the manufacture of high density multichip modules |
04/23/1996 | US5509539 Method for preparing injection molding compound pellets to remove molding compound dust and broken pellets |
04/23/1996 | US5509464 Method and apparatus for cooling rectangular substrates |
04/23/1996 | US5509375 Coating apparatus |
04/23/1996 | US5509203 Method for manufacturing a sheet formed connector for inspection of an integrated circuit |
04/21/1996 | CA2159234A1 Electrically conductive paste materials and applications |
04/18/1996 | WO1996011531A2 Transmission system utilizing different coding principles |
04/18/1996 | WO1996011524A1 Substrate housing and docking system |
04/18/1996 | WO1996011504A1 Method for producing high efficiency light-emitting diodes and resulting diode structures |
04/18/1996 | WO1996011503A2 Radiation-emitting semiconductor diode and method of manufacturing such a diode |
04/18/1996 | WO1996011497A1 Method for replacing a detection module hybridized by welding balls |
04/18/1996 | WO1996011496A2 Container having a cleanable, re-usable box door liner |
04/18/1996 | WO1996011495A1 Wafer heating chuck with dual zone backplane heating and segmented clamping member |
04/18/1996 | WO1996011494A1 Apparatus and method for bonding tape |
04/18/1996 | WO1996011392A1 Automatic handler and method of measuring devices using the same |
04/18/1996 | WO1996011377A1 Illuminator for inspecting appearance of device and automatic apparatus for inspecting appearance of device using the illumination device |
04/18/1996 | WO1996011376A1 On-axis mask and wafer alignment system |
04/18/1996 | WO1996011082A1 Chemical mechanical polishing slurry for metal layers |
04/18/1996 | WO1996003772A3 Method of manufacturing a semiconductor device for surface mounting, and semiconductor device for surface mounting |
04/18/1996 | DE4437035A1 Method and appts. for producing thin, metallic structures on insulating carrier materials |
04/18/1996 | DE4426288A1 Electrode for e.g. anodic glass bounding on silicon@ in semiconductor mfr. |
04/18/1996 | DE19538648A1 Integrierte Wellenleitervorrichtung und Herstellungsverfahren dafür Integrated waveguide device and production method thereof |
04/18/1996 | DE19538019A1 Verfahren zur Bildung einer Metallverdrahtung einer Halbleitereinrichtung A method of forming a metal wiring of a semiconductor device |
04/18/1996 | DE19537716A1 Verfahren zur Erzeugung eines Photoresistmusters A method for generating a photoresist pattern |
04/18/1996 | DE19537358A1 Integrated circuit holding and transport support |
04/18/1996 | DE19536501A1 Semiconductor component mfr. method for e.g. field effect transistor |
04/18/1996 | DE19531618A1 Bipolar transistor, esp. vertical PNP bipolar transistor |
04/18/1996 | DE19514908C1 Large scale solar panels for building and vehicles |
04/18/1996 | DE19505720C1 Coating a substrate with a film of amorphous, hydrogen-free carbon |
04/18/1996 | CA2202377A1 On-axis mask and wafer alignment system |
04/18/1996 | CA2176362A1 Wafer heating chuck with dual zone backplane heating and segmented clamping member |
04/17/1996 | EP0707346A1 Method for fabricating an integrated circuit |
04/17/1996 | EP0707345A1 Method for fabricating an integrated circuit |
04/17/1996 | EP0707344A2 Semiconductor device using a polysilicium thin film and production thereof |
04/17/1996 | EP0707343A2 Structure and method for connecting to integrated circuitry |
04/17/1996 | EP0707342A2 Semiconductor device including protection means |
04/17/1996 | EP0707340A2 Fabrication and structures of circuit modules with flexible interconnect layers |
04/17/1996 | EP0707339A2 Method and apparatus for planarizing a layer of material on a semiconductor substrate surface |
04/17/1996 | EP0707338A2 Wafer of semiconductor material for fabricating integrated semiconductor devices, and process for its fabrication |
04/17/1996 | EP0707337A1 Solid annular gas discharge electrode |
04/17/1996 | EP0707236A2 Masks with low stress multilayer films and a process for controlling the stress of multilayer films |
04/17/1996 | EP0707214A2 Multiport membrane probe for full-wafer testing |
04/17/1996 | EP0707097A1 MBE apparatus and MBE method |
04/17/1996 | EP0707015A1 Polymers |
04/17/1996 | EP0706857A1 Wafer polishing machine |
04/17/1996 | EP0706856A1 Polishing pad cluster for polishing a semiconductor wafer |
04/17/1996 | EP0706855A2 Wafer polishing machine |
04/17/1996 | EP0706854A1 Wafer holder for semiconductor wafer polishing machine |
04/17/1996 | EP0706716A1 Transistors and methods for fabrication thereof |
04/17/1996 | EP0706715A1 Electrical charge transfer apparatus |
04/17/1996 | EP0706714A1 Soi substrate fabrication |
04/17/1996 | EP0706635A1 Apparatus for thermal treatment of thin film wafer |
04/17/1996 | EP0706582A1 Improved compositions and methods for polishing |
04/17/1996 | EP0706425A1 Selective plasma deposition |
04/17/1996 | EP0654166B1 Dram cell assembly |
04/17/1996 | EP0597052B1 Transport robot for a machining or processing line for lead frames |
04/17/1996 | EP0581768B1 Liquid film interface cooling chuck for semiconductor wafer processing |
04/17/1996 | CN1120850A Reworkable poly(ethylene-vinyl alcohol) adhesive for electronic applications |
04/17/1996 | CN1120739A Semiconductor device and method for fabricating the same |
04/17/1996 | CN1120738A A semiconductor device and method of manufacturing the same |
04/17/1996 | CN1120736A Method and apparatus for directly joining a chip to a heat sink |
04/17/1996 | CN1120733A The use of a saw frame with tape as a substrate carrier for wafer level backend processing |
04/17/1996 | CN1120725A Method for fabricating a switching device by anodizaion, and anodizing interconnection |
04/17/1996 | CN1120669A Wire breakage detecting method |
04/16/1996 | US5509128 FPGA architecture including direct logic function circuit to I/O interconnections |
04/16/1996 | US5509041 X-ray lithography method for irradiating an object to form a pattern thereon |
04/16/1996 | US5509018 Flash-erase-type nonvolatile semiconductor storage device |
04/16/1996 | US5508956 Nonvolatile flash-EEPROM memory array with source control transistors |
04/16/1996 | US5508954 Method and apparatus for reduced fatigue in ferroelectric memory |
04/16/1996 | US5508953 Capacitor, electrode structure, and semiconductor memory device |
04/16/1996 | US5508947 Process gas distribution system and method with automatic transducer zero calibration |
04/16/1996 | US5508939 Method of partitioning a circuit |
04/16/1996 | US5508881 Capacitors and interconnect lines for use with integrated circuits |
04/16/1996 | US5508808 Development sensor apparatus for monitoring the progression of development of an optical disk master |
04/16/1996 | US5508803 For imaging a gray scale feature |
04/16/1996 | US5508800 Semiconductor substrate, method of manufacturing semiconductor substrate and semiconductor device, and method of inspecting and evaluating semiconductor substrate |
04/16/1996 | US5508765 Matrix-addressed type display device |