Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1996
06/11/1996US5525543 Annealing titanium nitride
06/11/1996US5525542 Aluminum nitride antireflecting layer is sputter deposited over polysilicon or aluminum conductive layer
06/11/1996US5525540 Method for manufacturing silicon layer having impurity diffusion preventing layer
06/11/1996US5525538 Method for intrinsically doped III-A and V-A compounds
06/11/1996US5525537 Process of producing diamond composite structure for electronic components
06/11/1996US5525536 Method for producing SOI substrate and semiconductor device using the same
06/11/1996US5525535 Method for making doped well and field regions on semiconductor substrates for field effect transistors using liquid phase deposition of oxides
06/11/1996US5525534 Method of producing a semiconductor device using a reticle having a polygonal shaped hole
06/11/1996US5525533 Method of making a low voltage coefficient capacitor
06/11/1996US5525532 Method for fabricating a semiconductor device
06/11/1996US5525531 SOI DRAM with field-shield isolation
06/11/1996US5525530 Method of manufacturing a semiconductor device
06/11/1996US5525529 Method for reducing dopant diffusion
06/11/1996US5525528 Ferroelectric capacitor renewal method
06/11/1996US5525527 Reduced number of microlithography steps; used in radiology
06/11/1996US5525428 Sintered compact containing copper, tungsten and(or)molybdenum; heat dissipation member
06/11/1996US5525422 Self-adhesive tape which can be partially detackified by radiation (dicing tape)
06/11/1996US5525402 Bump forming paste is metal oxide including copper oxide as major component and bumps are made of reduced and sintered body of paste; used for semiconductors
06/11/1996US5525374 Infiltering metal in molten state in sintered ceramic body to fill the void space by capillary action, cooling
06/11/1996US5525369 Cooling and tensioning a composite of metal and polymeric material while depositing a metal from vapor phase
06/11/1996US5525204 Applying a solder mask after plating process
06/11/1996US5525192 Method for forming a submicron resist pattern
06/11/1996US5525158 Thin film deposition apparatus
06/11/1996US5525106 Load storing equipment with cleaning device
06/11/1996US5525024 Cassette loader having compound translational motion
06/11/1996US5524811 Wire bonding method
06/11/1996US5524604 Method and apparatus for slicing semiconductor wafers
06/11/1996US5524502 Positioning apparatus including a hydrostatic bearing for spacing apart a supporting surface and a guide surface
06/07/1996CA2164048A1 Photoacid generating composition used in radiation-sensitive compositions
06/06/1996WO1996017505A1 Method, flip-chip module, and communicator for providing three-dimensional package
06/06/1996WO1996017430A1 Electrostatic motor and its fabrication process
06/06/1996WO1996017386A1 A capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
06/06/1996WO1996017382A1 Solder bumps for mounting flip-chips, and method of producing such bumps
06/06/1996WO1996017381A1 Semiconductor device and production method thereof
06/06/1996WO1996017380A1 A method and system for providing an integrated circuit device that allows for a high field threshold voltage utilizing resist pullback of the field implant region
06/06/1996WO1996017379A1 A method and system for providing an integrated circuit device that allows for a high field threshold voltage utilizing oxide spacers
06/06/1996WO1996017378A1 Electrical contact structures from flexible wire
06/06/1996WO1996017377A1 Besoi wafer and process for stripping outer edge thereof
06/06/1996WO1996017376A1 Structure and method for exposing photoresist
06/06/1996WO1996017171A2 Getter pump module and system
06/06/1996WO1996017112A1 Epitaxial growth of silicon carbide and resulting silicon carbide structures
06/06/1996WO1996017104A1 A method of depositing tungsten nitride using a source gas comprising silicon
06/06/1996WO1996016768A1 Process for bonding wires to oxidation-sensitive metal substrates which can be soldered
06/06/1996WO1996010845A3 Semiconductor device comprising a ferroelectric memory element with a lower electrode provided with an oxygen barrier
06/06/1996CA2485918A1 Getter pump module and system
06/06/1996CA2206264A1 Getter pump module and system
06/06/1996CA2205966A1 Process for bonding wires to oxidation-sensitive metal substrates which can be soldered
06/06/1996CA2205956A1 A capacitor for an integrated circuit and method of formation thereof, and a method of adding on chip capacitors to an integrated circuit
06/05/1996EP0715488A1 Metal-foil-clad composite ceramic board and process for the production thereof
06/05/1996EP0715411A2 Low-power-dissipation CMOS circuits
06/05/1996EP0715409A1 Circuit for limiting the output voltage of a power transistor
06/05/1996EP0715357A1 Carbon-doped GaAsSb semiconductor
06/05/1996EP0715356A1 Bipolar transistor and manufacturing method thereof
06/05/1996EP0715355A2 Cap to close off open via holes in PCBs
06/05/1996EP0715354A2 Insulator for integrated circuits and process
06/05/1996EP0715353A2 Board for a semiconductor chip
06/05/1996EP0715350A2 Method of forming a shallow trench, for isolating adjacent deep trenches, using a silicidation step
06/05/1996EP0715349A2 Method of evaluating lifetime of semiconductor surface
06/05/1996EP0715348A2 Method of manufacturing semiconductor devices
06/05/1996EP0715347A2 Method of making a charge coupled device with edge aligned implants and electrodes
06/05/1996EP0715346A2 Method of forming a MESFET with a T-shaped gate electrode and device formed thereby
06/05/1996EP0715345A1 Integrated circuit capacitor fabrication
06/05/1996EP0715344A2 Process for forming gate oxides possessing different thicknesses on a semiconductor substrate
06/05/1996EP0715343A1 Semiconductor device and its manufacture
06/05/1996EP0715342A2 Single-wafer heat-treatment apparatus and method of manufacturing reactor vessel used for same
06/05/1996EP0715341A1 Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet
06/05/1996EP0715340A2 Improvements in or relating to semiconductor processing
06/05/1996EP0715335A1 System for processing a workpiece in a plasma
06/05/1996EP0715334A2 Plasma reactors for processing semiconductor wafers
06/05/1996EP0715310A2 Improvements in or relating to memory devices
06/05/1996EP0715213A1 Method of optical projection exposure to light
06/05/1996EP0715201A2 Circuit assembly and process for production thereof
06/05/1996EP0715178A2 Integrated circuit comprising a testing pad
06/05/1996EP0715175A2 Method and apparatus for testing an integrated circuit
06/05/1996EP0715006A1 Substrates and methods for gas phase deposition
06/05/1996EP0714998A2 CVD processing chamber
06/05/1996EP0714773A2 Bonding process for ink jet silicon chips
06/05/1996EP0714554A1 Non-volatile sidewall memory cell method of fabricating same
06/05/1996EP0714553A1 Method of forming electrically conductive polymer interconnects on electrical substrates
06/05/1996EP0681741A4 Electronic chip carrier package and method of making thereof.
06/05/1996EP0626098B1 Method of producing a contact with a trench-condenser electrode
06/05/1996EP0587845B1 Device and method for handling objects
06/05/1996EP0528001B1 Batch assembly methods for packaging of chips
06/05/1996EP0527739B1 Servo guided stage system
06/05/1996EP0463067B1 Fermi threshold field effect transistor
06/05/1996EP0416126B1 Sulfuric acid composition having low surface tension
06/05/1996DE4435656A1 Semiconductor device esp. thin film solar cell
06/05/1996DE19545163A1 Phasenschiebermaske zur Bildung von Kontaktlöchern mit Mikroabmessung Phase shift mask for forming contact holes with micro dimension
06/05/1996DE19544753A1 Electron beam lithographic appts. for semiconductor integrated circuit mfr.
06/05/1996DE19544725A1 Insulated gate bipolar transistor semiconductor substrate mfr.
06/05/1996DE19540626A1 Mirror polishing device for semiconductor wafers
06/05/1996CN1124060A Sensor for articles on an end effector
06/05/1996CN1123957A Semiconductor device and method of manufacturing the same
06/05/1996CN1123956A Method of fabricating semiconductor integrated-circuit device
06/05/1996CN1123955A Plate-free photoetching process for manufacturing vacuum microelectronic devices
06/05/1996CN1123911A Method for detecting wafer defects
06/05/1996CN1031969C Common bias circuit for plurality of discreteic's each having their own bias circuitry
06/05/1996CN1031967C Process for making ohmic contacts and photovoltaic cell with ohmic contact
06/04/1996US5524131 For manufacturing microdevices
06/04/1996US5524095 Semiconductor memory device with a substrate bias voltage generation circuit as a power supply of a word line driver circuit
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